Patents by Inventor Richard Joseph Teti

Richard Joseph Teti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-circuit RF connections using molded and compliant RF coaxial interconnects
    Patent number: 6031188
    Abstract: Interconnections are made through a planar circuit by a monolithic short-circuited transmission path which extends from a circuit portion of the planar circuit to the opposite side. The opposite side is ground sufficiently to remove the short-circuiting plate, thereby separating the previously monolithic conductors, and exposing ends of the separated conductors of the transmission path. Connection is made between the exposed conductors of the transmission path and the registered contacts of a second planar circuit by way of electrically conductive, compliant fuzz buttons. The transmission path may be a coaxial path useful for RF.
    Type: Grant
    Filed: April 30, 1998
    Date of Patent: February 29, 2000
    Assignee: Lockheed Martin Corp.
    Inventors: Brian Alan Pluymers, Doreen Marie Nixon, Richard Joseph Teti, Robert Edward Hayes
  • Compliant RF coaxial interconnect
    Patent number: 5945897
    Abstract: Interconnections are made through a planar circuit by a monolithic short-circuited transmission path which extends from a circuit portion of the planar circuit to the opposite side. The opposite side is ground sufficiently to remove the short-circuiting plate, thereby separating the previously monolithic conductors, and exposing ends of the separated conductors of the transmission path. Connection is made between the exposed conductors of the transmission path and the registered contacts of a second planar circuit by means of electrically conductive, compliant fuzz buttons. The transmission path may be a coaxial path useful for RF.
    Type: Grant
    Filed: April 30, 1998
    Date of Patent: August 31, 1999
    Assignee: Lockheed Martin Corporation
    Inventors: Brian Alan Pluymers, Richard Joseph Teti
  • Hermetic feedthrough using three-via transmission lines
    Patent number: 5923234
    Abstract: A hermetically sealed housing (10) includes a dielectric end portion (118) which provides a transmission-line feedthrough between a printed-circuit such as HDI and exterior connections. A first transmission line (1) on the PC board (30) transitions to a 3-via transmission line (4), which transitions to a third coplanar, microstrip, or stripline transmission line (3). The third transmission line (3) transitions to a second 3-via transmission line (5), which ends at a coplanar transmission line (2) which is outside the housing.
    Type: Grant
    Filed: October 27, 1997
    Date of Patent: July 13, 1999
    Assignee: Lockheed Martin Corp.
    Inventors: Eric Louis Holzman, Stephen Charles Miller, Richard Joseph Teti, Bradley David Dufour