Patents by Inventor Richard K. Allman

Richard K. Allman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermally-coupled heat dissipation apparatus for electronic devices
    Patent number: 6181556
    Abstract: A thermally-coupled heat-dissipation apparatus (10) surrounds a solid state electronic device mounted on an adapter circuit board (14) or a thermal transfer column (74) extending upwardly from a main board socketed device. The apparatus (10) includes at least two heat sinks (18 and 20) positioned in a spaced parallel relationship on front and back sides (22 and 28) of the adapter circuit board (14) or thermal transfer column (74). A bridge member (38) thermally couples the two heat sinks (18 and 20). A plurality of fans (42) are mounted along outer surfaces of the heat sinks (18 and 20). In a preferred embodiment, the bridge member (38) is an additional heat sink, but could be a metal plate in alternate embodiments. The preferred device to cool using the present invention is a computer processor (12).
    Type: Grant
    Filed: August 20, 1999
    Date of Patent: January 30, 2001
    Inventor: Richard K. Allman