Abstract: A lens assembly for an electronic display, and a method of manufacturing said lens assembly is provided herein. The lens assembly includes a first lens layer, the first lens layer defining a surface opposing a viewer of the lens assembly; a second lens layer opposing a second surface of the first lens layer, the second surface being on an opposite side of the surface; a reservoir formed by the first lens layer and the second lens layer placed on a border, a liquid optical clear adhesive (loca) deposited into the reservoir; and a touch sensor attached to either the first lens layer and the second lens layer.

Abstract: An integrated vehicle structure includes an electronic site in a plastic support structure. The electronic site has a flexible substrate with electronic components mounted thereon. The plastic support structure defines a plastic mounting surface which includes a plurality of elongated ribs projecting from the plastic support structure. Each of the ribs have a side edge forming a portion of the plastic mounting surface. The flexible substrate is mounted to the plastic mounting surface, and a plurality of air flow passageways are defined by adjacent ribs in the flexible substrate. A method support structure may also be provided which defines a metal mounting surface. One or more electronic sides may be attached to the metal and plastic mounting surfaces.

Abstract: An integrated light and accessory assembly for a vehicle is disclosed. The assembly includes at least one lamp for illumination of a vehicle, and also includes reflective, conductive and insulative portions inside a housing, and a module for controlling or accessorizing the assembly. Also disclosed is a method of manufacturing the assembly. The method includes providing materials for molding or shaping the components of the assembly, selectively etching conductive materials, molding the materials into a desired configuration, connecting a lamp and an accessory module to the conductive portions, and enclosing the components in a housing. A portion of the module may be removed for emergency lighting.

Abstract: An automobile instrument panel assembly may be used in the cockpit of an automobile. The assembly includes a cross-car structure having a plurality of recesses and protrusions along the length of the structure and a plurality of generally planar surfaces. A plurality of HVAC components are adapted to closely fit within one or more of the plurality of recesses within the structure, and at least one flatwire bus is affixed to the generally planar surfaces of the structure.

Abstract: An integrated control system comprising an integrated circuit that controls at least one component or subsystem of an engine and a first light source that generates a first light signal when triggered through the integrated circuit. The first light signal propagates from the first light source through an LCC that may also serve as a substrate, wherein the signal that actuates the component of the engine can be the first light signal or a signal generated after the first light signal is produced. The component or subsystem of the engine may be an ignition system or a fuel injection system. The present invention is also directed to a method of controlling a component or subsystem of an engine.

Abstract: An automobile instrument panel assembly for the cockpit of an automobile. The assembly includes a cross-car structure having a plurality of recesses and protrusions along the length of the structure and a plurality of generally planar surfaces. A plurality of HVAC components are adapted to closely fit within one or more of the plurality of recesses within the structure, and at least one flatwire bus is affixed to the generally planar surfaces of the structure.

Abstract: A method 10 for making a multi-layer circuit board 70 having at least one electrically conductive interconnection portion or “via” 72 which extends within the board 70 and at least one air-bridge 74. The method 10 includes the steps of forming protuberances 13 upon a core member 12, attaching pre-circuit assemblies 32, 34 to the core member 12, thereby forming the circuit board 70 while concomitantly and selectively extending at least one of the protuberances 13 within the formed circuit board 70.

Abstract: An integrated control system comprising an integrated circuit that controls at least one component or subsystem of an engine and a first light source that generates a first light signal when triggered through the integrated circuit. The first light signal propagates from the first light source through an LCC that may also serve as a substrate, wherein the signal that actuates the component of the engine can be the first light signal or a signal generated after the first light signal is produced. The component or subsystem of the engine may be an ignition system or a fuel injection system. The present invention is also directed to a method of controlling a component or subsystem of an engine.

Abstract: An integrated light and accessory assembly for a vehicle is disclosed. The assembly includes at least one lamp for illumination of a vehicle, and also includes reflective, conductive and insulative portions inside a housing, and a module for controlling or accessorizing the assembly. Also disclosed is a method of manufacturing the assembly. The method includes providing materials for molding or shaping the components of the assembly, selectively etching conductive materials, molding the materials into a desired configuration, connecting a lamp and an accessory module to the conductive portions, and enclosing the components in a housing. A portion of the module may be removed for emergency lighting.

Abstract: A method for repairing a flatwire conductor is disclosed. The method includes aligning a cutting tool along the flatwire conductor at a first cut zone, cutting the flatwire along a transverse axis of the flatwire within the first cut zone, removing the cutting tool from the flatwire, aligning the cutting tool along the flatwire at a second cut zone, cutting the flatwire within the second cut zone, and removing the cutting tool and flatwire attached thereto to allow for replacement of the flatwire.

Abstract: A method 10, 110 for making multi-layer circuit boards having metallized apertures 38, 40, 130, 132 which may be selectively and electrically grounded and having at least one formed air-bridge 92, 178.

Abstract: A multi-layer electronic circuit board design 10 having a core member 12, a pair of dielectric layers 14, 16 disposed thereon, and a first circuit portion 20 which is coupled to the dielectric layer 14 and core member 12 using a layer of adhesive material 18. Circuit board design 10 further having selectively formed “blind” apertures, vias or cavities 22 formed through the first circuit portion 20, dielectric layer 14, and adhesive layer 18, thereby exposing core member 12.

Abstract: A method 10, 110 for making multi-layer electronic circuit boards 82, 148 having metallized apertures 18, 20, 118, 120 which may be selectively and electrically connected to a source of ground potential.

Abstract: A method 10, 110 for making multi-layer circuit boards having metallized apertures 38, 40, 130, 132 which may be selectively and electrically grounded and having at least one formed air-bridge 92, 178.

Abstract: A method 10 for making a multi-layer circuit board 70 having at least one electrically conductive interconnection portion or “via” 72 which extends within the board 70 and at least one air-bridge 74. The method 10 includes the steps of forming protuberances 13 upon a core member 12, attaching pre-circuit assemblies 32, 34 to the core member 12, thereby forming the circuit board 70 while concomitantly and selectively extending at least one of the protuberances 13 within the formed circuit board 70.

Abstract: There is disclosed herein a printed circuit board (PCB) having enhanced mounting pads useful for overprinting solder paste and for repair of the solder joints. The PCB comprises: a dielectric substrate 10 having at least one mounting pad 20 thereon, wherein each mounting pad is arranged in matched relation with a respective termination 32 of an electronic component 30. Each mounting pad 20 includes a main body portion 24 and one or more fingerlike extensions 26 extending outward from the main body portion and away from a projected footprint 34 of the electronic component.

Abstract: A method 10, 110 for making multi-layer electronic circuit boards 82, 148 having metallized apertures 18, 20, 118, 120 which may be selectively and electrically connected to a source of ground potential.

Abstract: There is disclosed herein a printed circuit board (PCB) having improved resistance against solder bridging and component decentering/tombstoning. The printed circuit board (PCB) includes a substrate 10 having a top surface 12; at least two mounting pads 14 disposed on the top surface in matched relation with terminations 26 of an electronic component 24; and a solder mask 16 disposed on the top surface and having at least two apertures 18 therethrough, wherein each aperture generally conforms in shape with and is arranged about a respective one of the mounting pads 14. Each aperture 18 has at least one inner aperture edge 22i generally within a projected footprint F of the electronic component and at least one outer aperture edge 22o generally outside the footprint F. Each aperture 18 includes a notch 20 in one or more of the at least one outer aperture edge 22o, wherein each notch 20 extends generally outward from its respective mounting pad 14.

Abstract: An electronic circuit assembly having anti-tombstoning solder joints, including: a substrate 10 having at least one mounting pad 20 thereon; an SMD 30 having at least one termination 40; and at least one solder joint 50 connecting each termination 40 to its respective mounting pad 20. Each solder joint 50 is convex in shape, having a continuous and substantially circular arcuate outer profile 60 and covering substantially all of the mounting pad 20 and substantially all of a top portion 42 of each termination 40. Each mounting pad 20 has a predetermined length lp and each solder joint has a predetermined volume of solder selected such that a positive net anti-tombstoning moment is exerted upon the SMD 30 when at least one solder joint 50 is in a molten state.

Abstract: Disclosed herein is a method and apparatus for splicing flexible circuit boards, particularly those having one or more flexible strip extensions with conductor runs. The splice clamp of the present invention has two hinged plates that clamp over unconnected ends of two flexible circuit board segments. The splice clamp includes alignment guides for aligning the segments in the clamp so that one or more jumpers contact and provide an electrical bridge between the conductors of the segments when the plates are clamped together. The jumpers contact conductive pads of larger size than the conductor runs to ensure electrical coupling between the flexible circuit board segments. The jumpers may have pointed tips that cut through insulation. The clamp includes flexible clasps on one plate that engage with catch surfaces on the other plate to lock the flexible circuit board segments spliced together.