Abstract: A soldering pump for pumping an electrically conductive fluid—in particular, a liquid solder—said soldering pump having a feed channel which travels at least in segments along a circular path and has an inlet and an outlet, and having a device for generating a moving magnetic field, wherein the device comprises at least one permanent magnet, wherein the device is designed such that the permanent magnet is moved along the feed channel during operation.

Abstract: A soldering device, in particular a soldering crucible for selective flow soldering, having a solder reservoir which is designed for storing a solder, in particular a molten solder, with a soldering nozzle and with a solder pump which is designed for conveying the solder out of the solder reservoir through the soldering nozzle, wherein the soldering device has an upper part and a lower part, wherein the upper part is releasably connectable to the lower part, and comprises the solder reservoir and the soldering nozzle, wherein a feed channel of the solder pump is disposed in the upper part and a device for generating a moving magnetic field of the solder pump is disposed in the lower part, designed (said device for generating a moving magnetic field) for generating a moving magnetic field along the feed channel.

Abstract: A soldering device, particularly solder pots for selective wave soldering or a fluxer device, having a receiving means configured to store a liquid, particularly a solder reservoir, configured to store a solder, particularly a liquid solder, or having a flux tank configured to store flux, with a nozzle, particularly a solder nozzle or fluxer nozzle, and having a pump, particularly a solder pump or a flux pump, configured to deliver the liquid from the receiving means through the nozzle in the direction of a Z-axis.

Abstract: A soldering pump for pumping an electrically conductive fluid—in particular, a liquid solder—said soldering pump having a feed channel which travels at least in segments along a circular path and has an inlet and an outlet, and having a device for generating a moving magnetic field, wherein the device comprises at least one permanent magnet, wherein the device is designed such that the permanent magnet is moved along the feed channel during operation.

Abstract: The present invention relates to a device for thermally treating workpieces that are equipped with electrical and electronic components, including at least one process chamber in which at least one heating or cooling zone is formed or disposed, wherein a temperature-controlled gaseous fluid can be introduced into said heating or cooling zone, wherein the workpieces pass through the heating or cooling zone and heat is transferred in a convective manner between the workpieces and the temperature-controlled fluid, and including at least one temperature measuring element disposed in the process chamber, wherein at least one sensor element that has a defined mass is disposed in the process chamber, such that heat is convectively transferred between the sensor element and the fluid, and an apparatus is provided for cooling and/or heating the sensor element, wherein the temperature of the sensor element can be measured by the temperature measuring element.

Abstract: The invention relates to a device for the thermal treatment of workpieces, in particular printed circuit boards or the like equipped with electrical and electronic components, said device comprising a process chamber (1) in which there is formed or arranged at least one heating zone or cooling zone which has a heating device or a cooling device and through which the workpieces are transported along a transporting section while being heated or cooled, wherein a pressurized gaseous fluid can be introduced into the heating zone or the cooling zone via inflow openings (18).

Abstract: The present invention relates to a device for thermally treating workpieces, in particular printed circuit boards or the like that are equipped with electrical and electronic components, comprising at least one process chamber in which at least one heating or cooling zone is formed or disposed, wherein a temperature-controlled gaseous fluid can be introduced into said heating or cooling zone, wherein the workpieces pass through the heating or cooling zone and heat is transferred particularly in a convective manner between the workpieces and the temperature-controlled fluid, and comprising at least one temperature measuring element disposed in the process chamber, wherein at least one sensor element that has a defined mass is disposed in the process chamber, such that heat is convectively transferred between the sensor element and the fluid, and an apparatus is provided for cooling and/or heating the sensor element, wherein the temperature of the sensor element can be measured by the temperature measuring elem

Abstract: A facility for the thermal treatment of workpieces has a processing or heating chamber and at least one transport device, extending essentially completely through the processing or heating chamber, with which the workpieces to be treated can be transported through the processing or heating chamber. At least two processing or heating levels are hereby located on top of one another in the processing or heating chamber, with each processing or heating level having at least one separate transport device. This type of facility can preferably be used as a soldering facility, particularly a reflow soldering facility, or as a facility for the hardening or drying of plastics or adhesives.

Abstract: A facility for the thermal treatment of workpieces has a processing or heating chamber and at least one transport device, extending essentially completely through the processing or heating chamber, with which the workpieces to be treated can be transported through the processing or heating chamber. At least two processing or heating levels are hereby located on top of one another in the processing or heating chamber, with each processing or heating level having at least one separate transport device. This type of facility can preferably be used as a soldering facility, particularly a reflow soldering facility, or as a facility for the hardening or drying of plastics or adhesives.