Abstract: A conductive composition that is sinterable comprises (i) micron- or submicron-sized silver flakes or powders and (ii) a fluxing agent, or an oxygenated solvent, or a peroxide. The composition can be used to adhere semiconductor dies with silver backing to copper-, silver-, or gold lead-frames at sintering temperatures of ?250° C. without the application of pressure.

Abstract: A sintering film comprising one or more metals, one or more metal alloys, or blends of one or more metals and one or more metal alloys, is prepared optionally using a solid or semi-solid organic binder. The organic binder can have fluxing functionality; the organic binder can be one that will partially or completely decompose upon sintering of the metal or metal alloy in the composition. In one embodiment, the sintering film is provided on an end use substrate, such as a silicon die or wafer, or a metal circuit board or foil, or the sintering film is provided on a carrier, such as a metal mesh. Preparation is accomplished by dispersing the metal or metal alloy in a suitable solvent, with or without a binder, and exposing the composition to high temperature to evaporate off the solvent and partially sinter the metal or metal alloy.

Abstract: A conductive composition comprises (i) micro- or submicro-sized silver flake having a tap density of 4.6 g/cc or higher and (ii) a solvent that dissolves any fatty acid lubricant or surfactant present on the surface of the silver. In one embodiment, (iii) a small amount of peroxide is present. No organic resin is present in the composition.

Abstract: A conductive composition that is sinterable comprises (i) micron- or submicron-sized silver flakes or powders and (ii) a fluxing agent, or an oxygenated solvent, or a peroxide. The composition can be used to adhere semiconductor dies with silver backing to copper-, silver-, or gold lead-frames at sintering temperatures of ?250° C. without the application of pressure.

Abstract: Curable compositions exhibit improved adhesion and conductivity by the addition of a metal salt of 8-quinolinol or of an 8-quinolinol derivative as an adhesion and/or conductivity promoter. The metal salt of 8-quinolinol or of an 8-quinolinol derivative is formed by coordination with a metal selected from the group consisting of Cu, Be, Mg, Ca, Sr, Ba, Zn, Cd, Al, Ga, In, TI, Yt, La, Pb, Sb, Bi, Cr, Mo, Mn, Fe, Co, Ni, Pd, Ce, and Pr.

Abstract: This invention is directed to compounds that can be used as antioxidants for exposed metal surfaces, and also as adhesion promoters for adhesive, coating or encapsulant resins that are applied to the metal substrates. These compounds include triazine or isocyanurate compounds bearing reactive or polymerizable functional groups, polyfunctional cyanate esters, and polyfunctional blocked-isocyanates.

Abstract: Benzotriazole adducts contain a benzotriazole segment and a segment with a curable and polymerizable functionality, or an adhesion promoting functionality, particularly suitable for use on metal substrates or in adhesive, sealant or coating compositions for use in proximity to metal substrates.

Abstract: This invention is directed to compounds that can be used as antioxidants for exposed metal surfaces, and also as adhesion promoters for adhesive, coating or encapsulant resins that are applied to the metal substrates. These compounds include triazine or isocyanurate compounds bearing reactive or polymerizable functional groups, polyfunctional cyanate esters, and polyfunctional blocked-isocyanates.

Abstract: Curable compositions that comprise two separately curable chemistry sets or compositions with curing temperatures sufficiently separated so that one chemistry composition can be fully cured during a B-staging process, and the second can be left uncured until a final cure is desired, such as at the final attach of a semiconductor chip to a substrate.

Abstract: Benzotriazole adducts contain a benzotriazole segment and a segment with a curable and polymerizable functionality, or an adhesion promoting functionality, particularly suitable for use on metal substrates or in adhesive, sealant or coating compositions for use in proximity to metal substrates.

Abstract: Curable compositions containing aceto acetonate compounds or related compounds can be used to promote adhesion to metal substrates, either by coating on the metal substrate or by addition to the adhesive formulation.

Abstract: A curable composition comprises a compound having at least one epoxy group and at least one styrenic or cinnamyl group per molecule.

Abstract: This invention is an adhesive paste that consists essentially of a polymeric resin in particulate form and a carrier for the resin. The polymeric resin is present as particles with a particles size of 50 microns or smaller, is insoluble in the carrier at ambient temperature, and is soluble in the carrier at a temperature above ambient temperature. The carrier either reacts with the resin to form a covalent bond, or vaporizes from the adhesive paste, at a temperature above the temperature at which the resin is soluble in the carrier. The paste contains no inorganic fillers, holds its geometry on application, and fuses to a void-free bond.