Patents by Inventor Richard L. Hopla

Richard L. Hopla has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor stress buffer coating edge bead removal compositions and method for their use
    Patent number: 7335319
    Abstract: An edge bead remover composition that includes at least one ketone selected from the group consisting of: wherein R1 and R2 are independently selected from the group consisting of: methyl, ethyl, n-propyl, n-butyl, sec-butyl, and isobutyl, and wherein n equals 1 or 2; at least one ester other than lactones; and at least one lactone.
    Type: Grant
    Filed: February 6, 2003
    Date of Patent: February 26, 2008
    Assignee: Arch Specialty Chemicals, Inc.
    Inventors: Laurie J. Peterson, Richard L. Hopla, Ahmad A. Naiini, William D. Weber, Pamela J. Waterson
  • Semiconductor stress buffer coating edge bead removal compositions and method for their use
    Publication number: 20030227005
    Abstract: An edge bead remover composition that includes at least one ketone selected from the group consisting of: 1
    Type: Application
    Filed: February 6, 2003
    Publication date: December 11, 2003
    Applicant: ARCH SPECIALTY CHEMICALS, INC.
    Inventors: Laurie J. Peterson, Richard L. Hopla, Ahmad A. Naiini, William D. Weber, Pamela J. Waterson