Abstract: A method includes securing a primary cold plate to a secondary cold plate, wherein the primary cold plate is biased away from the secondary cold plate. The secondary cold plate is aligned with a circuit board having heat-generating components, wherein the primary cold plate is aligned with a processor. The method secures the aligned secondary cold plate to the circuit board with a first surface in thermal engagement with the heat-generating components, wherein the primary cold plate is pressed against the processor to overcome the bias, move the primary cold plate toward the secondary cold plate, position the primary cold plate in thermal engagement with the processor, and compress a thermal interface material between the primary and secondary cold plates. A cooling liquid is passed through a liquid cooling channel within the primary cold plate to draw heat from the processor and from the secondary cold plate.

Abstract: An apparatus includes a primary cold plate, a secondary cold plate, and spring biased retainers moveably securing the primary cold plate to the secondary cold plate. The secondary cold plate is securable to a circuit board for thermal engagement with heat-generating components on the circuit board. The primary cold plate is aligned for thermal engagement with a processor on the circuit board and includes an internal liquid cooling channel. The apparatus further comprises compressible thermal interface material disposed between the primary cold plate and the secondary cold plate to conduct heat from the secondary cold plate to the primary cold plate and remove the heat in a liquid flowing through the liquid cooling channel. The apparatus provides thermal engagement and cooling of multiple components having different heights.

Abstract: An apparatus includes a primary cold plate, a secondary cold plate, and spring biased retainers moveably securing the primary cold plate to the secondary cold plate. The secondary cold plate is securable to a circuit board for thermal engagement with heat-generating components on the circuit board. The primary cold plate is aligned for thermal engagement with a processor on the circuit board and includes an internal liquid cooling channel. The apparatus further comprises compressible thermal interface material disposed between the primary cold plate and the secondary cold plate to conduct heat from the secondary cold plate to the primary cold plate and remove the heat in a liquid flowing through the liquid cooling channel. The apparatus provides thermal engagement and cooling of multiple components having different heights.

Abstract: A method includes securing a primary cold plate to a secondary cold plate, wherein the primary cold plate is biased away from the secondary cold plate. The secondary cold plate is aligned with a circuit board having heat-generating components, wherein the primary cold plate is aligned with a processor. The method secures the aligned secondary cold plate to the circuit board with a first surface in thermal engagement with the heat-generating components, wherein the primary cold plate is pressed against the processor to overcome the bias, move the primary cold plate toward the secondary cold plate, position the primary cold plate in thermal engagement with the processor, and compress a thermal interface material between the primary and secondary cold plates. A cooling liquid is passed through a liquid cooling channel within the primary cold plate to draw heat from the processor and from the secondary cold plate.

Abstract: A cooling system for a memory module comprises a heat conduction assembly for conducting heat from the memory module to liquid-cooled mounting blocks. In one embodiment, each heat conduction assembly includes a frame having opposing first and second supports, first and second heat spreader plates each extending from the first support to the second support, and a pair of flattened heat pipes each extending along a respective one of the heat spreader plates from the first support to the second support. The liquid-cooled mounting blocks releasably support the heat conduction assembly over a memory module socket with the memory module between the heat spreader plates.

Abstract: A liquid-cooled computer memory system includes first and second blocks in fluid communication with a chilled liquid source. A plurality of spaced-apart heat transfer pipes extend along a system board between memory module sockets from the first manifold block to the second manifold block. The heat transfer pipes may be liquid flow pipes circulating the chilled liquid between the memory module sockets. Alternatively, the heat transfer pipes may be closed heat pipes that conduct heat from the memory modules to the liquid-cooled blocks. A separate heat spreader is provided to thermally bridge each memory module to the adjacent heat transfer pipes.

Abstract: A liquid-cooled computer memory system includes first and second blocks in fluid communication with a chilled liquid source. A plurality of spaced-apart heat transfer pipes extend along a system board between memory module sockets from the first manifold block to the second manifold block. The heat transfer pipes may be liquid flow pipes circulating the chilled liquid between the memory module sockets. Alternatively, the heat transfer pipes may be closed heat pipes that conduct heat from the memory modules to the liquid-cooled blocks. A separate heat spreader is provided to thermally bridge each memory module to the adjacent heat transfer pipes.

Abstract: A cooling system for a memory module comprises a heat conduction assembly for conducting heat from the memory module to liquid-cooled mounting blocks. In one embodiment, each heat conduction assembly includes a frame having opposing first and second supports, first and second heat spreader plates each extending from the first support to the second support, and a pair of flattened heat pipes each extending along a respective one of the heat spreader plates from the first support to the second support. The liquid-cooled mounting blocks releasably support the heat conduction assembly over a memory module socket with the memory module between the heat spreader plates.

Abstract: A tool according to one embodiment includes an actuating mechanism including a cam plate; at least one gripper member operatively coupled to the cam plate; and a carriage for supporting the at least one gripper member, wherein the at least one gripper member is actuatable by the cam plate, wherein rotation of the cam plate causes the at least one gripper member to move between a first position and a second position, wherein when the at least one gripper member is in the first position, the tool is able to accept a processor for holding thereof, and wherein when the at least one gripper member is in the second position, the tool securely holds the processor therein. Additional systems and methods are also presented.

Abstract: A method and system to support simultaneous unlatching from a rack of two or more adjacently mounted and vertically aligned hardware components. One interface bracket is secured to one vertical rail of the rack, and a second interface bracket is secured to a second vertical rail of the rack on an opposite side of the rack. A set of latches are provided in communication with each interface bracket, with the number of latches corresponding to the number of hardware components in communication with the interface bracket. Actuation of one of the latches releases fastening of at least one hardware components from the rack, and accommodates removal of the release component from the rack.

Abstract: A tool according to one embodiment includes an actuating mechanism including a cam plate; at least one gripper member operatively coupled to the cam plate; and a carriage for supporting the at least one gripper member, wherein the at least one gripper member is actuatable by the cam plate, wherein rotation of the cam plate causes the at least one gripper member to move between a first position and a second position, wherein when the at least one gripper member is in the first position, the tool is able to accept a processor for holding thereof, and wherein when the at least one gripper member is in the second position, the tool securely holds the processor therein. Additional systems and methods are also presented.

Abstract: A method and system to support simultaneous unlatching from a rack of two or more adjacently mounted and vertically aligned hardware components. One interface bracket is secured to one vertical rail of the rack, and a second interface bracket is secured to a second vertical rail of the rack on an opposite side of the rack. A set of latches are provided in communication with each interface bracket, with the number of latches corresponding to the number of hardware components in communication with the interface bracket. Actuation of one of the latches releases fastening of at least one hardware components from the rack, and accommodates removal of the release component from the rack.

Abstract: A modular electronic system including a mechanism for releasably securing a modular device within a chassis, and for facilitating insertion and removal of the modular device. One embodiment provides a modular device that includes a handle secured to opposing pivotable lever arms. A follower pin secured to one end of the lever arms rides in a slot defined by the chassis. The slot is arranged so that pulling upward on the handle moves the follower pin in one direction along the slot to urge the modular device in a direction further into the device bay, and pushing downward on the handle urges the modular device in a direction out of the device bay, thereby providing a mechanical advantage to the user. When the modular device is fully inserted, retractable locking members provided on the modular device move into windows provided on the chassis, to releasably lock the modular device in the device bay.

Abstract: An apparatus and system are disclosed for securing a heat sink against a central processing unit. The present invention teaches a heat sink securement device having a vertical retention arm that substantially encompasses a heat sink in a vertical direction, a horizontal retention arm that substantially encompasses a heat sink in a horizontal direction, and a tension arm coupled to the vertical and horizontal retention arms and pivotally coupled to the frame, the tension arm simultaneously adjusts a tension on the vertical retention arm and the horizontal retention arm in response to moving the tension arm. In certain embodiments, the retention arms are coupled to the tension arm via coupling member that is offset from pivot point of the tension arm. In other embodiments, the coupling member may include a different coupling member for the vertical and horizontal retention arms, both coupling members offset from the pivot point.

Abstract: An apparatus, system, and method are disclosed for positioning a printed circuit board component. A clamping member applies a clamping force to a levering member linked to a positioning member. The levering member biases the positioning member toward a printed circuit board in response to the clamping force. The positioning member positions the printed circuit board and a component disposed on the printed circuit board in response to the positioning member bias. In one embodiment, the positioning member positions the component to contact a thermal device.

Abstract: An air moving device assembly in a computer system has an air moving device such as a fan or blower within a housing for moving air from an air inlet to an air outlet. A mesh with a plurality of openings covers the air outlet. A back flow damper assembly is positioned over the air outlet. The back flow damper assembly further comprises at least one damper door movable in an open position and a closed position. The damper door has at least one tooth such that when the damper door is in the closed position, the tooth interacts with at least one of the plurality of openings in the mesh. By periodically cycling the air moving device controlled by device management software, the teeth will close and open, loosening debris from the mesh, allowing the debris to be blown out the rear of the housing once the device is turned back on.

Abstract: An information control panel and hinge member is removably joined together as a single unit to a retractable shuttle device utilized with computer servers or processor-based devices. The shuttle device having a first central opening with plural spaced apart detent grooves positioned thereabout. The hinge member includes a second central opening with plural spaced apart tabs positioned thereabout. A screw fastening element positioned through the first and second openings to directly and rotatably secure the hinge member relative to the shuttle device. A latch release means permits the single unit to be easily positioned in plural horizontal and vertical orientation positions that moves between selective ranges of 0 degrees to 90 degrees as the tabs moves relative to the detent grooves. Also, at least a stop member is located on the hinge member adjacent one of the tabs to stop the single unit at the minimum and extreme orientation positions.

Abstract: A dual member handle system and method of operating the same. The system includes a body, a first handle rotably attached to the body, and a second handle rotably attached to the body. The first handle is attached adjacent the second handle. The first handle rotates about a first axis and the second handle rotates about a second axis that is different from the first axis. The method includes rotating a first handle about a first axis and rotating a second handle, while rotating the first handle, about a second axis. The second axis is adjacent to and different from the first axis.

Abstract: An information control panel and hinge member is removably joined together as a single unit to a retractable shuttle device utilized with computer servers or processor-based devices. The shuttle device having a first central opening with plural spaced apart detent grooves positioned thereabout. The hinge member includes a second central opening with plural spaced apart tabs positioned thereabout. A screw fastening element positioned through the first and second openings to directly and rotatably secure the hinge member relative to the shuttle device. A latch release means permits the single unit to be easily positioned in plural horizontal and vertical orientation positions that moves between selective ranges of 0 degrees to 90 degrees as the tabs moves relative to the detent grooves. Also, at least a stop member is located on the hinge member adjacent one of the tabs to stop the single unit at the minimum and extreme orientation positions.

Abstract: A modular electronic system including a mechanism for releasably securing a modular device within a chassis, and for facilitating insertion and removal of the modular device. One embodiment provides a modular device that includes a handle secured to opposing pivotable lever arms. A follower pin secured to one end of the lever arms rides in a slot defined by the chassis. The slot is arranged so that pulling upward on the handle moves the follower pin in one direction along the slot to urge the modular device in a direction further into the device bay, and pushing downward on the handle urges the modular device in a direction out of the device bay, thereby providing a mechanical advantage to the user. When the modular device is fully inserted, retractable locking members provided on the modular device move into windows provided on the chassis, to releasably lock the modular device in the device bay.