Abstract: A rotational indexer is provided that may be rotated to move semiconductor wafers or other items between various stations arranged in a circular array; the items being moved may be supported by arms of the indexer during such movement. The rotational indexer may be further configured to also cause the items being moved to rotate about other rotational axes to cause rotation of the items relative to the arms supporting them.

Abstract: A test wafer having two spaced-apart accelerometers mounted thereon is disclosed. The accelerometers may be positioned at locations located along a common axis passing through the center of gravity of the test wafer. The test wafer may include a controller that may be used to transmit acceleration data collected by the accelerometers to another device. In some implementations, a semiconductor processing tool is provided that includes a test wafer receptacle for storing a test wafer that remains with the semiconductor processing tool and that may be retrieved by a wafer handling robot for performing a test cycle during periods when the wafer handling robot is not performing substrate transport operations.

Abstract: Systems and techniques for forming buffer gas microclimates around semiconductor wafers in environments external to a semiconductor processing chamber are disclosed. Such systems may include slot doors that may allow for single wafers to be removed from a multi-wafer stack while limiting outflow of buffer gas from a multi-wafer storage system, as well as buffer gas distributors that move in tandem with robot arms used to transport wafers for at least some of the movements of such robot arms.

Abstract: Disclosed herein, a contact pad for use on a robot arm in transfer chamber in a wafer processing tool is provided, comprising an elastomer body and a high hardness powder doping a surface of the elastomer body.

Abstract: Methods, systems and apparatuses for high throughput substrate transfer are provided. According to various embodiments, the methods and systems described use robots having dedicated end effectors for hot and cold wafers or other substrates). Throughput is increased by optimizing the transfer of both the hot and the cold wafers. Also described are wafer transfer apparatuses having end effectors configured for supporting either hot or cold wafers. In certain embodiments, dual arm robots having dedicated hot and cold wafer arms are provided. Also provided are methods of transferring substrates that to improve overall throughput. The methods involve transferring hot and cold substrates at different accelerations.

Abstract: Methods and systems for the touch auto-calibration for robot placement of substrate in process modules are provided. Touch auto-calibration allows for the automatic calibration of robot end effector positioning with respect to an aligning base in a process module. Touch auto-calibration also allows for calibration of process modules at temperatures and pressures similar to the temperatures and pressures experienced during production. The end effector has one or more aligning surfaces configured to align it with the aligning base upon contact with the aligning base. After contact, the position of the end effector and the calibrated position of the end effector during a pick or place move can then be determined. In some implementations, the positioning of the end effector as it transfers a substrate during production is based on a placement coordinate with the placement correction applied.

Abstract: A robot with an integrated aligner is provided that allows for the alignment of a semiconductor wafer while the semiconductor wafer transits between multiple stations. The robot with an integrated aligner may contain a rotational wafer support configured to rotate and/or translate, one or multiple robotic arms, and a sensor. The robot may pick and place the semiconductor wafer with the robotic arm from or into a station and from or onto the rotational wafer support. The robot may be configured to rotate the semiconductor wafer into a desired orientation when the semiconductor wafer is on the rotational wafer support. The rotation of the semiconductor wafer into a desired orientation may be aided the sensor. The robot may have a positioning mechanism which moves it between different positions in a semiconductor tool.

Abstract: A robot for use in vacuum chambers is disclosed. The robot may be mounted within an oblong transfer chamber and may be translated within the transfer chamber by an umbilical arm operating in conjunction with a linear motion guide and carriage. Motors or drive systems for the robot may be housed in atmospheric conditions, and the transfer chamber may be kept at a vacuum. The robot may include one or more arms configured for wafer handling. The robot may include one or more motors or drive systems and a multi-axial seal to realize independent extension/retraction of each arm and overall simultaneous rotation of the arm assembly.

Abstract: An apparatus is provided for lifting a substrate. The apparatus comprises a first piece and a second piece. The apparatus further comprises a set of first contact points in a plane and a set of second contact points, where at least one contact point from each set is present on the first piece and the second piece. The apparatus also comprises an actuator that translates the first piece, substantially parallel to the plane, between a first position and a second position relative to the second piece. Additionally, the first position arranges the set of first contact points so that all of the contact points of the set of first contact points are able to engage the substrate, and the second position arranges the set of second contact points so that all of the contact points of the second set of contact points are able to engage the substrate.

Abstract: Methods and systems for the touch auto-calibration for robot placement of substrate in process modules are provided. Touch auto-calibration allows for the automatic calibration of robot end effector positioning with respect to an aligning base in a process module. Touch auto-calibration also allows for calibration of process modules at temperatures and pressures similar to the temperatures and pressures experienced during production. The end effector has one or more aligning surfaces configured to align it with the aligning base upon contact with the aligning base. After contact, the position of the end effector and the calibrated position of the end effector during a pick or place move can then be determined. In some implementations, the positioning of the end effector as it transfers a substrate during production is based on a placement coordinate with the placement correction applied.

Abstract: A robot with an integrated aligner is provided that allows for the alignment of a semiconductor wafer while the semiconductor wafer transits between multiple stations. The robot with an integrated aligner may contain a rotational wafer support configured to rotate and/or translate, one or multiple robotic arms, and a sensor. The robot may pick and place the semiconductor wafer with the robotic arm from or into a station and from or onto the rotational wafer support. The robot may be configured to rotate the semiconductor wafer into a desired orientation when the semiconductor wafer is on the rotational wafer support. The rotation of the semiconductor wafer into a desired orientation may be aided the sensor. The robot may have a positioning mechanism which moves it between different positions in a semiconductor tool.

Abstract: A calibrated mass damper for use with end effectors for semiconductor wafer handling robots is described. The calibrated mass damper reduces vibrational response in an end effector carrying a semiconductor wafer without requiring modification of the end effector structure.

Abstract: A robot for use in semiconductor vacuum chambers is disclosed. The robot may include two independently-driven arms configured for wafer handling. The robot may include three motors or drive systems and a tri-axial seal to realize independent extension/retraction of each arm and overall simultaneous rotation of the arm assembly. The robot may provide enhanced throughput efficiency over other robot designs.

Abstract: A robot for use in vacuum chambers is disclosed. The robot may be mounted within an oblong transfer chamber and may be translated within the transfer chamber by an umbilical arm operating in conjunction with a linear motion guide and carriage. Motors or drive systems for the robot may be housed in atmospheric conditions, and the transfer chamber may be kept at a vacuum. The robot may include one or more arms configured for wafer handling. The robot may include one or more motors or drive systems and a multi-axial seal to realize independent extension/retraction of each arm and overall simultaneous rotation of the arm assembly.

Abstract: An apparatus is provided for lifting a substrate. The apparatus comprises a first piece and a second piece. The apparatus further comprises a set of first contact points in a plane and a set of second contact points, where at least one contact point from each set is present on the first piece and the second piece. The apparatus also comprises an actuator that translates the first piece, substantially parallel to the plane, between a first position and a second position relative to the second piece. Additionally, the first position arranges the set of first contact points so that all of the contact points of the set of first contact points are able to engage the substrate, and the second position arranges the set of second contact points so that all of the contact points of the second set of contact points are able to engage the substrate.

Abstract: A calibrated mass damper for use with end effectors for semiconductor wafer handling robots is described. The calibrated mass damper reduces vibrational response in an end effector carrying a semiconductor wafer without requiring modification of the end effector structure.

Abstract: A robot for use in semiconductor vacuum chambers is disclosed. The robot may include two independently-driven arms configured for wafer handling. The robot may include three motors or drive systems and a tri-axial seal to realize independent extension/retraction of each arm and overall simultaneous rotation of the arm assembly. The robot may provide enhanced throughput efficiency over other robot designs.

Abstract: A device for aligning a flatted object to a desired orientation. The flatted object has a substantially circular perimeter and a flatted chord portion and may be a silicon wafer or a cover for an electrostatic chuck. The device includes multiple conically shaped rollers that center and rotationally align the object, each roller having a bottom lip for supporting the object. Centering rollers are mounted so that they contact the circular perimeter of the object when it is in the desired orientation. Rotational alignment rollers are mounted so that they contact the flatted chord portion of the object when it is in the desired orientation. When placed on the alignment device, the flatted object passively moves to the desired orientation under the force of gravity.

Abstract: A device for aligning a flatted object to a desired orientation. The flatted object has a substantially circular perimeter and a flatted chord portion and may be a silicon wafer or a cover for an electrostatic chuck. The device includes multiple conically shaped rollers that center and rotationally align the object, each roller having a bottom lip for supporting the object. Centering rollers are mounted so that they contact the circular perimeter of the object when it is in the desired orientation. Rotational alignment rollers are mounted so that they contact the flatted chord portion of the object when it is in the desired orientation. When placed on the alignment device, the flatted object passively moves to the desired orientation under the force of gravity.