Abstract: Connection lines are routed within an integrated circuit. A first set of the connection lines are pre-routed. The first set of connection lines carry signals which have a higher likelihood of being influenced by crosstalk. The first set of connection lines are routed to tracks where minimal capacitive coupling will result. For example, this may be in a track immediately adjacent to a power line or a ground line. Alternatively, or in addition, this may be in a track between two empty tracks. After the first set of connection lines have been routed, a second set of connection lines are routed. The second set of connection lines carry signals which have a lower likelihood of being influenced by crosstalk. The second connection lines are routed to tracks which are not utilized by the first set of connection lines.

Abstract: Signals are routed within a routing channel between a first logic block and a second logic block. A power signal within a power conductor is routed as part of a bottom layer of the routing channel. The bottom layer is located above a substrate for the integrated circuit. A ground signal is also routed within a ground conductor as part of the bottom layer of the routing channel. Data lines are routed in a top layer of the routing channel. The data lines carry data signals within the routing channel. Connection lines are routed within a middle layer of the routing channel. The middle layer is between the bottom layer of the routing channel and the top layer of the routing channel. The connecting lines connect a subset of the data lines in the top layer, the ground conductor in the bottom layer and the power conductor in the bottom layer to the first logic block and to the second logic block.