Abstract: A request for aggregate data stored in an aggregates database is received from a client device. A key-to-value dimension widening rule that applies to an aggregated data element of the requested data is identified. The key-to-value dimension widening rule includes a value dimension. A quantity of data elements that combined to form the aggregated data element is determined. A widened value dimension for the aggregated data element is calculated using the determined quantity and the value dimension. The widened value dimension is reported to the client device in response to the request.

Abstract: A request for aggregate data stored in an aggregates database is received from a client device. A key-to-value dimension widening rule that applies to an aggregated data element of the requested data is identified. The key-to-value dimension widening rule includes a value dimension. A quantity of data elements that combined to form the aggregated data element is determined. A widened value dimension for the aggregated data element is calculated using the determined quantity and the value dimension. The widened value dimension is reported to the client device in response to the request.

Abstract: A semiconductor device suitable for use in a pressure sensor is disclosed. A uniformly thin die is provided by chemically etching a back side of a wafer. Piezoelectric elements formed integrally within the die generate electrical signals in response to flexing the die. Conductive leads formed integrally within the die electrically communicate the generated electrical signals to support circuitry formed integrally within the die proximate the piezoelectric elements. In an example embodiment, the piezoresistive elements take the form of silicon resistors formed integrally via doping and diffusion in a Wheatstone bridge configuration. In one application, the die serves as a deformable diaphragm, seated atop an aperture of a threaded pressure sensor housing.

Abstract: A semiconductor device suitable for use in a pressure sensor is disclosed. A uniformly thin die is provided by chemically etching a backside of a wafer. Piezoelectric elements formed integrally within the die generate electrical signals in response to flexing the die. Conductive leads formed integrally within the die electrically communicate the generated electrical signals to support circuitry formed integrally within the die proximate the piezoelectric elements. In an example embodiment, the piezoresistive elements take the form of silicon resistors formed integrally via doping and diffusion in a Wheatstone bridge configuration. In one application, the die serves as a deformable diaphragm, seated atop an aperture of a threaded pressure sensor housing.

Abstract: The formation of a semiconductor sensing device is disclosed, where the device can be used to sense pressure, for example. The device is formed by etching the entire backside of a semiconductor substrate or wafer. This streamlines the fabrication process by omitting a number of steps that would otherwise be required to selectively etch certain locations of the substrate. This also improves device performance and compactness by allowing associated support circuitry to be formed closer to a sensing region, and more particularly piezoelectric elements of the sensing region.

Abstract: A computer-implemented method including receiving advertising campaign characteristics with a minimum frequency target for an advertising campaign; selecting, based on the received advertising campaign characteristics, a station having one or more advertising spots available; determining, based on the one or more advertising spots, whether the minimum frequency target is attainable for the selected station; and making an offer to the selected station, in response to the determination, to obtain advertising for the advertising campaign.

Abstract: A mailing system including: a mail item creation station; elements for assessing the weight of each mail item in a selected set of mail items; elements for generating a digital signal representing the weight of each mail item; elements for counting the number of mail items in the selected set and generating a digital signal representing the number; and elements for communicating with a network and for sending the weight data signals and the number data signal over the network in a structured manner, to a postal service provider. Preferably the mailing items are pre-printed with a mail impression mark which may include a printed postage impression mark on a selected set of mail items, for example items in a particular weight range.