Abstract: An inflatable pouch for packaging a circuit board is formed from two superposed sheets of an electrostatically dissipative plastic. The plastic sheets are welded together to form two air chambers therebetween, each having a plurality of passages therein and they are folded over along a transverse centerline so as to form a bottom end along the centerline, an open end opposite the bottom end and opposing front and rear walls. The side portions of the front and rear walls are welded together to form the side edges of the pouch. The passages in the front wall adjacent the open end of the pouch include enlarged portions which are transversely offset from and interengageable with corresponding enlarged portions in the rear wall to prevent a circuit board from sliding out the top of the pouch. Both air chambers are inflatable through a single inlet aperture which is sealable with a clamp.