Abstract: A process for protecting a MEMS device used in a UV illuminated application from damage due to a photochemical activation between the UV flux and package gas constituents, formed from the out-gassing of various lubricants and passivants put in the device package to prevent sticking of the MEMS device's moving parts. This process coats the exposed surfaces of the MEMS device and package's optical window surfaces with a metal-halide film to eliminate this photochemical activation and therefore significantly extend the reliability and lifetime of the MEMS device.

Abstract: A process for protecting a MEMS device used in a UV illuminated application from damage due to a photochemical activation between the UV flux and package gas constituents, formed from the out-gassing of various lubricants and passivants put in the device package to prevent sticking of the MEMS device's moving parts. This process coats the exposed surfaces of the MEMS device and package's optical window surfaces with a metal-halide film to eliminate this photochemical activation and therefore significantly extend the reliability and lifetime of the MEMS device.

Abstract: An optical correlator (10) that uses a spatial light modulator (11) to illuminate a pattern of on and off pixels into a length of an optical fiber (12). The spatial light modulator (11) is optically coupled to the length of fiber (12) so that the illumination enters the fiber along that length. The optical fiber (12) also carries light representing a bitstream of data. At the optical fiber, the illumination from the spatial light modulator interacts with the illumination of the optical bitstream. A detector (14) is optically coupled to the same length of fiber (12) and detects the resulting optical response to determine if a correlation exists.

Abstract: A process for protecting a MEMS device used in a UV illuminated application from damage due to a photochemical activation between the UV flux and package gas constituents, formed from the out-gassing of various lubricants and passivants put in the device package to prevent sticking of the MEMS device's moving parts. This process coats the exposed surfaces of the MEMS device and package's optical window surfaces with a metal-halide film to eliminate this photochemical activation and therefore significantly extend the reliability and lifetime of the MEMS device.

Abstract: A process for protecting a MEMS device used in a UV illuminated application from damage due to a photochemical activation between the UV flux and package gas constituents, formed from the out-gassing of various lubricants and passivants put in the device package to prevent sticking of the MEMS device's moving parts. This process coats the exposed surfaces of the MEMS device and package's optical window surfaces with a metal-halide film to eliminate this photochemical activation and therefore significantly extend the reliability and lifetime of the MEMS device.

Abstract: An optical correlator (10) that uses a spatial light modulator (11) to illuminate a pattern of on and off pixels into a length of an optical fiber (12). The spatial light modulator (11) is optically coupled to the length of fiber (12) so that the illumination enters the fiber along that length. The optical fiber (12) also carries light representing a bitstream of data. At the optical fiber, the illumination from the spatial light modulator interacts with the illumination of the optical bitstream. A detector (14) is optically coupled to the same length of fiber (12) and detects the resulting optical response to determine if a correlation exists.

Abstract: A method of passivating a hermetically sealed micromechanical device (14) with a passivant (100). A predetermined quantity of the passivant (100) is placed within the cavity (54) of a lid (42) after the lid and package base (46) have been activated. Thereafter, by heating the package (10) including the passivant, the passivant will sublime within the hermetically sealed package (10) to provide a monolayer of passivant across the active surfaces of the micromechanical die (14). An improved hermetic seal is achieved since the passivant is sublimed after the laser weld process. In addition, the effectiveness of the passivation process is improved since the passivation is performed after the package is sealed, without the risk of any impurities entering into the package to degrade the effectiveness of the passivation.

Abstract: Methods of reducing artifacts in SLM-based display systems (10, 20), whose images are based on data displayed by bit-weight for pulse-width modulated intensity levels. A first method is suitable for systems (20) that use multiple SLMs (14) to concurrently display images of different colors, which are combined at the image plane. The data for each color are staggered in time (FIG. 4). A second method is suitable for either multiple SLM systems (20) or for systems (10) that use a single SLM (14) and a color wheel (17) to display differently colored images sequentially. The data for each color is arranged in a different data sequence (FIG. 5). In either method, the intensity transitions do not occur at the same time.

Abstract: Methods of reducing artifacts in SLM-based display systems (10, 20), whose images are based on data displayed by bit-weight for pulse-width modulated intensity levels. A first method is suitable for systems (20) that use multiple SLMs (14) to concurrently display images of different colors, which are combined at the image plane. The data for each color are staggered in time (FIG. 4). A second method is suitable for either multiple SLM systems (20) or for systems (10) that use a single SLM (14) and a color wheel (17) to display differently colored images sequentially. The data for each color is arranged in a different data sequence (FIG. 5). In either method, the intensity transitions do not occur at the same time.

Abstract: Methods of reducing artifacts in SLM-based display systems (10, 20), whose images are based on data displayed by bit-weight for pulse-width modulated intensity levels. A first method is suitable for systems (20) that use multiple SLMs (14) to concurrently display images of different colors, which are combined at the image plane. The data for each color are staggered in time (FIG. 4). A second method is suitable for either multiple SLM systems (20) or for systems (10) that use a single SLM (14) and a color wheel (17) to display differently colored images sequentially. The data for each color is arranged in a different data sequence (FIG. 5). In either method, the intensity transitions do not occur at the same time.

Abstract: A method of providing control signals for resetting mirror elements (10,20) of a digital micro-mirror device (DMD) having reset groups (FIG. 4), or for resetting moveable elements of other micro-mechanical devices that operate with similar principles. A bias voltage is applied to the mirrors and their landing sites, and an address voltage is applied under the mirrors. (FIG. 3). The address voltage is held at an intermediate level except during a reset period. During this reset period, the address voltage is increased. Also, during reset, the bias applied to mirrors to be reset is pulsed and offset, and the bias applied to mirrors not to be reset is increased. (FIGS. 5 and 6).

Abstract: A processing fixture and method of fabricating micromechanical devices, such as digital micromirror devices, that allows fragile structures on wafer 22 to be protected from debris during the saw operation and subsequent cleaning operations. The wafer 22 is attached to a vacuum fixture 26 after partially sawing the wafer 22 to create saw kerfs. The backside of the wafer 22 is then ground down to the saw kerfs 24 to separate the devices 32. Each device 32 is held on the fixture by a vacuum in the headspace above the device 32. In an alternate embodiment the devices are separated by sawing completely through the wafer while in the fixture.

Abstract: A processing fixture and method of fabricating micromechanical devices, such as digital micromirror devices, that allows fragile structures on wafer 22 to be protected from debris during the saw operation and subsequent cleaning operations. The wafer 22 is attached to a vacuum fixture 26 after partially sawing the wafer 22 to create saw kerfs. The backside of the wafer 22 is then ground down to the saw kerfs 24 to separate the devices 32. Each device 32 is held on the fixture by a vacuum in the headspace above the device 32. In an alternate embodiment the devices are separated by sawing completely through the wafer while in the fixture.

Abstract: A method for controlling a digital micromirror device 40 resulting in decreased mechanical stress, longer device lifetimes, decreased incidence of spontaneous bit reset, and increased pulse-width modulation accuracy. To reduce the device stress, the bias voltage 142 applied to the mirror 50 may be reduced after the mirror 50 has been latched. To prevent premature mirror changes, the address electrode bias voltage 140 may be reduced after the mirror is driven to the desired position. To ensure that the mirror 50 returns to the neutral position during reset, the mirror bias voltage 142 may be raised from ground potential to approximately halfway between the two addressing voltages during the reset period 152. To reduce the effects of hinge memory and to ensure that the mirror 50 rotates toward the proper address electrode, the mirror bias voltage 142 may be gradually increased to allow the mirror 50 time to rotate towards the proper address electrode.

Abstract: A method of preventing sticking of moving parts of a micro-mechanical device. A set of microwave frequencies, which will cause water molecules to resonate, is determined. From this set of frequencies, an applied frequency that will provide an efficient energy coupling from the source to the device is selected. The device is continuously irradiated with radiation of this frequency.

Abstract: Methods are disclosed by which the effects of a defective electromechanical pixel (20) having a beam (30) and a hinge (34,36) are mitigated. These methods may damage the hinge (34,36) or the beam (30) and comprise the step of applying a voltage sufficient to damage the hinge (34,36) or beam (30) of said electromechanical pixel (20) by mechanical overstress, thermal overstress, electrochemical reaction, or thermally induced chemical reaction. Other methods are also disclosed.

Abstract: A preferred embodiment of the present invention provides a method of addressing a digital micromirror device (DMD) having an array of electromechanical pixels (20) comprising deflectable beams (30) wherein each of the pixels (20) assume one of two or more selected stable states according to a set of selective address voltages. A first step of the preferred method is electromechanically latching, by applying a bias voltage with an AC and a DC component to the array of pixels (20), each of the pixels (20) in one of the selected stable states. A second step is applying a new set of selective address voltages to all the pixels (20) in the array. A third step is electromechanically unlatching, by removing the bias voltage from the array, the pixels (20) from their previously addressed state. A fourth step is allowing the array of pixels (20) to assume a new state in accordance with the new set of selective address voltages.

Abstract: Methods are disclosed by which the effects of a defective electromechanical pixel (20) having a beam (30) and a hinge (34,36) are mitigated. These methods may damage the hinge (34,36) or the beam (30) and comprise the step of applying a voltage sufficient to damage the hinge (34,36) or beam (30) of said electromechanical pixel (20) by mechanical overstress, thermal overstress, electrochemical reaction, or thermally induced chemical reaction. Other methods are also disclosed.

Abstract: A preferred embodiment of the present invention provides a method of addressing a digital micromirror device (DMD) having an array of electromechanical pixels (20) comprising deflectable beams (30) wherein each of the pixels (20) assume one of two or more selected stable states according to a set of selective address voltages. A first step of the preferred method is electromechanically latching, by applying a bias voltage with an AC and a DC component to the array of pixels (20), each of the pixels (20) in one of the selected stable states. A second step is applying a new set of selective address voltages to all the pixels (20) in the array. A third step is electromechanically unlatching, by removing the bias voltage from the array, the pixels (20) from their previously addressed state. A fourth step is allowing the array of pixels (20) to assume a new state in accordance with the new set of selective address voltages.

Abstract: A memory circuit for use with a spatial light modulator having an array of electrically addressable, micro-mechanical, modulating elements, whose address electrodes determine how that element will affect incident light. The memory circuit has at least one static memory cell in communication with the address electrodes of each modulating element. Each memory cell receives data for determining its micro-mechanical movement via a bit-line down each column of memory cells. A row select signal determines whether the data will be written to that row. A two-level voltage line supplies power to each memory cell, with one level being used for writing to the cell and another level being used for operating the modulating element.