Abstract: A method and apparatus for connecting signal leads to an integrated circuit transmits a distribution signal on a lead. A substrate is provided with leads interconnecting a number of bonding pads. The integrated circuit has a corresponding number of bonding pads. An insulation layer is interposed between the integrated circuit and the substrate except for the bonding pads. The distribution lead is connected to the bonding pads on the substrate. The bonding pads of the substrate and the bonding pads of integrated circuit are interconnected. With this approach, signals may be distributed radially from a central point to equidistant circuits instead of sequentially or serially through a number of circuits.

Abstract: A reproducing apparatus for producing copies of a document selectively at one of a plurality of copy image magnifications by moving original exposure. A feeder advances the document past a viewing system selectively at one of a plurality of velocities corresponding to the copy image magnifications. An edge of the document is sensed as it is advanced by the feeder. Responsive to the sensing of the document edge exposure is initiated selectively after expiration of one of a plurality of time intervals corresponding to the copy image magnification and the velocities of document advancement. In accordance with an alternative embodiment the document feeder advances the document past a plurality of document viewing positions corresponding to different desired copy image magnifications and the time intervals correspond to the viewing position as well.