Patents by Inventor Richard P. Sheridan

Richard P. Sheridan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bridge stack integrated circuit package system
    Patent number: 7994619
    Abstract: An integrated circuit package system is provided including mounting a first device on a carrier, mounting a second device over the first device and the carrier in an offset face-to-face configuration, and connecting the first device and the second device at an overlap.
    Type: Grant
    Filed: November 1, 2006
    Date of Patent: August 9, 2011
    Assignee: Stats Chippac Ltd.
    Inventors: Richard P. Sheridan, Eric Gongora, Douglas J. Mathews
  • BRIDGE STACK INTEGRATED CIRCUIT PACKAGE SYSTEM
    Publication number: 20080111222
    Abstract: An integrated circuit package system is provided including mounting a first device on a carrier, mounting a second device over the first device and the carrier in an offset face-to-face configuration, and connecting the first device and the second device at an overlap.
    Type: Application
    Filed: November 1, 2006
    Publication date: May 15, 2008
    Applicant: STATS CHIPPAC LTD.
    Inventors: Richard P. Sheridan, Eric Gongora, Douglas J. Matthews
  • Method of making a chip carrier package using laser ablation
    Patent number: 6660559
    Abstract: A chip carrier package is made by using a laser-ablatable solder mask to cover areas of conductive traces on the surface of a substrate that were left uncovered during conventional processes using photoresist. These areas of the conductive traces are uncovered by using a laser to remove overlying portions of the solder mask. If a YAG laser is used, the conductive traces are removed at the same time the solder mask ablated. However, is a CO2 laser is used, a conventional etching process removes the exposed portions of the traces after the solder mask is ablated.
    Type: Grant
    Filed: June 25, 2001
    Date of Patent: December 9, 2003
    Assignee: Amkor Technology, Inc.
    Inventors: Ronald P. Huemoeller, Richard P. Sheridan