Abstract: A method and system for quantifying manufacturing complexity of electrical designs randomly places simulated defects on image data representing electrical wiring design. The number of distinct features in the image data without the simulated defects and the number of distinct features in the image data with the simulated defects are determined and the differences between the two obtained. The difference number is used as an indication of shorting potential or probability that shorts in the wiring may occur in the electrical wiring design. The simulating of the defects in the image data may be repeated and the difference value from each simulation or run may be used to obtain a statistical average or representative shorting potential or probability for the design.

Abstract: A method and system for quantifying manufacturing complexity of electrical designs randomly places simulated defects on image data representing electrical wiring design. The number of distinct features in the image data without the simulated defects and the number of distinct features in the image data with the simulated defects are determined and the differences between the two obtained. The difference number is used as an indication of shorting potential or probability that shorts in the wiring may occur in the electrical wiring design. The simulating of the defects in the image data may be repeated and the difference value from each simulation or run may be used to obtain a statistical average or representative shorting potential or probability for the design.

Abstract: A method and system for quantifying manufacturing complexity of electrical designs randomly places simulated defects on image data representing electrical wiring design. The number of distinct features in the image data without the simulated defects and the number of distinct features in the image data with the simulated defects are determined and the differences between the two obtained. The difference number is used as an indication of shorting potential or probability that shorts in the wiring may occur in the electrical wiring design. The simulating of the defects in the image data may be repeated and the difference value from each simulation or run may be used to obtain a statistical average or representative shorting potential or probability for the design.

Abstract: A method and system for quantifying manufacturing complexity of electrical designs randomly places simulated defects on image data representing electrical wiring design. The number of distinct features in the image data without the simulated defects and the number of distinct features in the image data with the simulated defects are determined and the differences between the two obtained. The difference number is used as an indication of shorting potential or probability that shorts in the wiring may occur in the electrical wiring design. The simulating of the defects in the image data may be repeated and the difference value from each simulation or run may be used to obtain a statistical average or representative shorting potential or probability for the design.

Abstract: A multilayer ceramic repair process which provides a new electrical repair path to connect top surface vias. The repair path is established between a defective net and a redundant repair net contained within the multilayer ceramic substrate. The defective net and the repair net each terminate at surface vias of the substrate. A laser is used to form post fired circuitry on and in the substrate. This is followed by the electrical isolation of the defective net from the electrical repair structure and passivation of the electrical repair line.

Abstract: A multilayer ceramic repair process which provides a new electrical repair path to connect top surface vias. The repair path is established between a defective net and a redundant repair net contained within the multilayer ceramic substrate. The defective net and the repair net each terminate at surface vias of the substrate. A laser is used to form post fired circuitry on and in the substrate. This is followed by the electrical isolation of the defective net from the electrical repair structure and passivation of the electrical repair line.

Abstract: A multilayer ceramic repair process which provides a new electrical repair path to connect top surface vias. The repair path is established between a defective net and a redundant repair net contained within the multilayer ceramic substrate. The defective net and the repair net each terminate at surface vias of the substrate. A laser is used to form post fired circuitry on and in the substrate. This is followed by the electrical isolation of the defective net from the electrical repair structure and passivation of the electrical repair line.

Abstract: A multilayer thin film structure (MLTF) is provided having no extraneous via-pad connection strap plated metallurgy for defective vias needing removal. The method for making or repairing the MLTF comprises determining interconnection defects in the MLTF at a thin film layer adjacent to the top metal layer of the structure, applying a top surface dielectric layer and forming vias in the layer, applying a metal conducting layer and removing the metal conducting layer for via-pad connection straps of defective vias and at the intersection of XY lines used in the repair, defining the top surface metallization including a series of orthogonal X conductor repair lines and Y conductor repair lines using a photoresist and lithography and then using a phototool to selectively expose the photoresist to define top surface strap connections needed to repair the interconnections and/or make EC's, and forming the top surface metallization using additive or subtractive metallization techniques.

Abstract: Temperature gradients between a ceramic substrate of high thermal conductivity and the braze materials used to attach a metallic device such as a cap are reduced by using an embedded internal heat source in the substrate to minimize the thermal gradient, thereby minimizing the stresses that can result in substrate cracking when a cap is brazed onto the substrate.

Abstract: A laser ablation apparatus and method removes undesired portions of a workpiece. An industrial laser generates a beam of optical energy and directs the beam at the workpiece. A mechanism in the path of the beam for shapes the cross-section of the beam and includes first and second linear actuators on opposite sides of the beam path. Each of the actuators includes a plurality of linear members, with each linear member being adjacent to and in contact with another linear member, and means for individually inserting and retracting each of said members into and out of said beam path a desired distance to thereby shape the beam so as to ablate only undesired portions of the workpiece.

Abstract: The present invention relates generally to a new structure and a method for repairing electrical lines, and more particularly, the invention encompasses a structure and a method for repairing electrical lines on a ceramic or a semiconductor substrate. On a substrate that has an open or an electrical discontinuity, one or more trenches or grooves are made next to the open, or discontinuity and using standard deposition process one or more metals are deposited in the open to provide or restore electrical continuity while the excess deposition material is allowed to drain or propagate into the trench.

Abstract: The present invention relates generally to a new structure and a method for repairing electrical lines, and more particularly, the invention encompasses a structure and a method for repairing electrical lines on a ceramic or a semiconductor substrate. On a substrate that has an open or an electrical discontinuity, one or more trenches or grooves are made next to the open, or discontinuity and using standard deposition process one or more metals are deposited in the open to provide or restore electrical continuity while the excess deposition material is allowed to drain or propagate into the trench.

Abstract: A titanium chelate catalyst for a room temperature vulcanizable silicone rubber composition which does not form nodules upon storage where the catalyst has the formula, ##STR1## where s varies from 0.7 to 1.3 and t varies from 0.7 to 1.3. Preferably s varies from 0.8 to 1.2 and t varies from 0.8 to 1.2.

Abstract: The adhesion of self-bonding, low modulus, one package, room temperature vulcanizable silicone compositions to a variety of substrates is effectively promoted by incorporating in the silicone composition, before curing, a small effective amount of an adhesion promoting composition comprising predominantly at least one diorganocyclopolysiloxane compound of the formula: ##STR1## wherein R.sup.1 may be C.sub.1 -C.sub.6 alkyl, C.sub.1 -C.sub.6 gamma-trihaloalkyl or phenyl; R.sup.2 is alkylene of from 2 to 6 carbon atoms; R.sup.3, R.sup.4 and R.sup.5 are, independently, C.sub.1 -C.sub.6 alkyl or C.sub.2 -C.sub.6 alkanoyl; and n is either 3 or 4.

Abstract: The adhesion of self-bonding, low modulus, one package, room temperature vulcanizable silicone compositions to a variety of substrates is effectively promoted by incorporation in the silicone composition, before curing, a small effective amount of an adhesion promoting composition comprising predominantly at least one diorganocyclopolysiloxane compound of the formula: ##STR1## wherein R.sup.1 may be C.sub.1 -C.sub.6 alkyl, C.sub.1 -C.sub.6 gamma-trihaloalkyl or phenyl; R.sup.2 is alkylene of from 2 to 6 carbon atoms; R.sup.3, R.sup.4 and R.sup.5 are, independently, C.sub.1 -C.sub.6 alkyl or C.sub.2 -C.sub.6 alkanoyl; and n is either 3 or 4.

Abstract: A titanium chelate catalyst for a room temperature vulcanizable silicone rubber compositions which does not form nodules upon storage where the catalyst has the formula, ##STR1## where s varies from 0.7 to 1.3 and t varies from 0.7 to 1.3. Preferably s varies from 0.8 to 1.2 and t varies from 0.8 to 1.2.

Abstract: A process and composition for producing a cross-linking agent component for two-component room temperature vulcanizable silicone rubber compositions comprising the reaction product of 25 to 75 parts of a silicate selected from the class consisting of alkyl silicates of the formula,R.sub.a.sup.2 Si(OR.sup.1).sub.4.sub.-a ,and a liquid partial hydrolysis product of the aforementioned alkyl silicates, 10 to 40 parts of a polysiloxane fluid of the formula,R.sub.n.sup.3 SiO.sub.4.sub.-n/2 ,where the polysiloxane fluid is chain-stopped with --OH groups and R.sub.3.sup.3 SiO.sub.1/2 units, where the ratio of the R.sub.3.sup.3 SiO.sub.1/2 units to --OH radicals varies from 3:1 to 1:1 and 10 to 40 parts of a metal salt of an acid selected from the class consisting of monocarboxylic acids and dicarboxylic acid and the metal ion is selected from lead to manganese in the electromotive series of metals and is, more preferably, tin, and R.sup.1, R.sup.2 and R.sup.