Abstract: A structure and method for fabricating a semiconductor device is described. A device structure including a gate structure, a source region and a drain region is disposed on a first surface of a substrate. Contact holes are etched through the source and drain regions and through a first portion of the substrate. The contact holes are filled with a conductive material to produce contact studs coupled to the source and drain regions. A second portion of the substrate is removed. A surface of the contact studs is exposed through a second surface of the substrate opposite to the gate structure for connection to a wiring layer disposed over the second surface of the substrate.

Abstract: A structure and method for fabricating a semiconductor device is described. A device structure including a gate structure, a source region and a drain region is disposed on a first surface of a substrate. Contact holes are etched through the source and drain regions and through a first portion of the substrate. The contact holes are filled with a conductive material to produce contact studs coupled to the source and drain regions. A second portion of the substrate is removed. A surface of the contact studs is exposed through a second surface of the substrate opposite to the gate structure for connection to a wiring layer disposed over the second surface of the substrate.

Abstract: A method and system for modeling an integrated circuit. The method includes converting a representation of the integrated circuit into design shapes of design levels of a design of the integrated circuit; adding control shapes to the design, the control shapes not defining any physical part of the integrated circuit; extracting layout-dependent stress parameters of the devices from the design levels of the design based on the control shapes and the design shapes; converting the layout-dependent stress parameters to stress parameters using a stress algorithm; generating stressed device parameters from the stress parameters using a compact model; and simulating performance of the integrated circuit using the stressed device parameters in a simulation model of the integrated circuit design.

Abstract: A method and system for modeling an integrated circuit. The method includes converting a representation of the integrated circuit into design shapes of design levels of a design of the integrated circuit; adding control shapes to the design, the control shapes not defining any physical part of the integrated circuit; extracting layout-dependent stress parameters of the devices from the design levels of the design based on the control shapes and the design shapes; converting the layout-dependent stress parameters to stress parameters using a stress algorithm; generating stressed device parameters from the stress parameters using a compact model; and simulating performance of the integrated circuit using the stressed device parameters in a simulation model of the integrated circuit design.

Abstract: A memory cell (e.g., static random access memory (SRAM) cell) includes a plurality of back-gated n-type field effect transistors (nFETs), and a plurality of double-gated p-type field effect transistors (pFETs) operatively coupled to the plurality of nFETs.

Abstract: Enhanced silicon-on-insulator transistors and methods are provided for implementing enhanced silicon-on-insulator transistors. The enhanced silicon-on-insulator (SOI) transistors include a thin buried oxide (BOX) layer under a device channel and a thick self-aligned buried oxide (BOX) region under SOI source/drain diffusions. A selective epitaxial growth is utilized in the source/drain regions to implement appropriate strain to enhance both PFET and NFET devices simultaneously.

Abstract: Enhanced silicon-on-insulator (SOI) buried oxide (BOX) structures and methods are provided for implementing enhanced SOI BOX structures. An oxygen implant step is performed from a backside into a thinned silicon substrate layer. An anneal step forms thick buried oxide (BOX) regions from oxygen implants in the silicon substrate layer. The oxygen implant step forms an isolated region near the oxygen implants. A backside implant step selectively dopes the isolated region for forming a backgate for an SOI device being formed including a selected one of anti-fuse (AF) devices, and SOI transistors including PFET and NFET devices.

Abstract: A method for optimizing and transforming a compiler program in a computer system. The method comprises the steps of constructing a compiler comprising a program augmentation capability; and, locating this capability in association with phases of a standard compilation process. The program augmentation capability may comprise symbolic automatic differentiation, or generation of Taylor series, or generation of Hessian or Jacobian matrices.

Abstract: A method for optimizing and transforming a compiler program in a computer system. The method comprises the steps of constructing a compiler comprising a program augmentation capability; and, locating this capability in association with phases of a standard compilation process. The program augmentation capability may comprise symbolic automatic differentiation, or generation of Taylor series, or generation of Hessian or Jacobian matrices.

Abstract: A method using a generate-and-verify computer program product to generate by repetitive passes a design rules checking computer program, wherein the design rules are described in a file called a runset. The design rules checking program is used for exhaustive testing of VLSI chips for compliance to the design rules of a given VLSI fabrication process. The runset is repeatedly iterated in loop fashion with respect to a testcase file containing groups of layout structures or shapes used for verifying the correctness of the runset. A general purpose shapes processing program creates an error shapes file for storing geometrical errors found in each said layout structure. Two additional shapes are used in the verification process: user boundary shapes for defining areas in which errors are not to be detected for a given design rule, and automated boundary shapes created to surround each said layout structure with a boundary that defines regions where error shapes can occur.