Patents by Inventor Richard R. Butera

Richard R. Butera has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6127196
    Abstract: Methods for testing a [A] tape carrier package (TCP) for an integrated circuit device that includes two sets of test pads. A first set of test pads are located along the outer edges of the TCP and are used to test the performance of the integrated circuit device once the TCP has been fabricated and assembled. A second set of test pads is also provided between the TCP outer leads and integrated circuit device for testing the performance of the device once the TCP has been removed from a printed circuit board.
    Type: Grant
    Filed: April 29, 1998
    Date of Patent: October 3, 2000
    Assignee: Intel Corporation
    Inventors: Richard R. Butera, William A. Huffman
  • Patent number: 5310039
    Abstract: An apparatus for the fast and efficient transfer of integrated circuits between three locations: an input location, a test site location, and an output location. The apparatus includes a front and a rear work press assembly for transferring integrated circuits between the locations and for applying pressure during testing. The work press assemblies is constructed of a variable length shaft coupled to an arm extension which is coupled to a work press. The work press assemblies can each move between three horizontal positions, a first horizontal position associated with the input location, a second horizontal position associated with the test site location, and a third horizontal position associated with the output location. The work press assemblies move independently of one another.
    Type: Grant
    Filed: August 19, 1992
    Date of Patent: May 10, 1994
    Assignee: Intel Corporation
    Inventors: Richard R. Butera, Robert S. Childress, Amin Heydarpour, Jagdish Sagar