Patents by Inventor Richard R. Draudt

Richard R. Draudt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming via holes in multilayer circuits
    Patent number: 5294567
    Abstract: The invention is directed to a method for rapidly forming a dense pattern of via holes in multilayer electronic circuits in which via holes in the dielectric layers are formed by drilling with an excimer laser under controlled operating conditions.
    Type: Grant
    Filed: October 8, 1993
    Date of Patent: March 15, 1994
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Jay R. Dorfman, Richard R. Draudt, Thomas D. Lantzer, Arthur H. Mones, David L. Sutton
  • Multi-plate lamination fixture
    Patent number: 5228946
    Abstract: A multi-plate lamination fixture includes at least a first, an intermediate and a bottom plate, of which the intermediate and either the bottom or the top plate each have a keyway therein adjacent one surface thereof and in which the intermediate and the other of the bottom or the top plate have a key projecting past the other surface thereof thereby to permit registered stackability of the plates. The intermediate and either the bottom or the top plate each also have a recess extending into one surface thereof for at least a predetermined distance, while the intermediate and the other of the bottom or the top plate have a pin projecting past the other surface thereof. The projecting pins are received in the recess of the adjacent plates to further assure accurate location of the stacked plates forming the lamination fixture.
    Type: Grant
    Filed: December 17, 1991
    Date of Patent: July 20, 1993
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Richard R. Draudt