Patents by Inventor Richard R. LYNN

Richard R. LYNN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8860449
    Abstract: A dual probing tip system uses a slot and rail system to provide variable spacing and lateral and axial compliance of the probing tips mounted on first and second support members. A movable base member is secured on a frame with the base member having a rack of linear teeth and a pair of rails angled toward the front. First and second intermediate carriers each have a slot that engages one of the angled rails. Each of the carriers has stanchions that receive a thumb wheel pinion gear mounted on a shaft. The pinion gear mates with the teeth on the base member for movement of the carriers. Each support member has an axial slot that mated with an axial slot on each one of the carriers. Each support member has a compression spring which allows axial compliance of the support members.
    Type: Grant
    Filed: June 1, 2012
    Date of Patent: October 14, 2014
    Assignee: Tektronix, Inc.
    Inventors: James E. Spinar, Richard R. Lynn
  • Patent number: 8643396
    Abstract: A probing tip for a signal acquisition probe has a non-conductive substrate compatible with thin or thick film processing having opposing horizontal surfaces and side surfaces with two of the side surfaces converging to a point. A contoured probing tip contact is formed at the converging point on the non-conductive substrate with the probing tip contact having first and second intersecting arcuate surface. Electrically conductive material is deposited on the countered probing tip contact using thin or thick film processing for providing electrical contact to test points on a device under test. A resistive element is formed on the non-conductive substrate using thin film processing that is electrically coupled to the probing tip contact and to an input of an amplifier formed on an integrated circuit die mounted on the non-conductive substrate. The output of the amplifier is coupled to a transmission structure formed on a second non-conductive substrate.
    Type: Grant
    Filed: May 31, 2011
    Date of Patent: February 4, 2014
    Assignee: Tektronix, Inc.
    Inventors: James E. Spinar, Richard R. Lynn
  • Publication number: 20120313658
    Abstract: A dual probing tip system uses a slot and rail system to provide variable spacing and lateral and axial compliance of the probing tips mounted on first and second support members. A movable base member is secured on a frame with the base member having a rack of linear teeth and a pair of rails angled toward the front. First and second intermediate carriers each have a slot that engages one of the angled rails. Each of the carriers has stanchions that receive a thumb wheel pinion gear mounted on a shaft. The pinion gear mates with the teeth on the base member for movement of the carriers. Each support member has an axial slot that mated with an axial slot on each one of the carriers. Each support member has a compression spring which allows axial compliance of the support members.
    Type: Application
    Filed: June 1, 2012
    Publication date: December 13, 2012
    Applicant: TEKTRONIX, INC.
    Inventors: JAMES E. SPINAR, RICHARD R. LYNN
  • Publication number: 20120306522
    Abstract: A probing tip for a signal acquisition probe has a non-conductive substrate compatible with thin or thick film processing having opposing horizontal surfaces and side surfaces with two of the side surfaces converging to a point. A contoured probing tip contact is formed at the converging point on the non-conductive substrate with the probing tip contact having first and second intersecting arcuate surface. Electrically conductive material is deposited on the countered probing tip contact using thin or thick film processing for providing electrical contact to test points on a device under test. A resistive element is formed on the non-conductive substrate using thin film processing that is electrically coupled to the probing tip contact and to an input of an amplifier formed on an integrated circuit die mounted on the non-conductive substrate. The output of the amplifier is coupled to a transmission structure formed on a second non-conductive substrate.
    Type: Application
    Filed: May 31, 2011
    Publication date: December 6, 2012
    Applicant: TEKTRONIX, INC.
    Inventors: James E. SPINAR, Richard R. LYNN