Patents by Inventor Richard Regner
Richard Regner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6766736Abstract: Stencils are provided for more precisely aligning stencil orifices with terminals or “targets” on a substrate. One such stencil is adapted for registration with an electronic substrate, such as a PCB, about a locus. The stencil includes a stencil body and an array of printing orifices passing through the stencil body. The printing orifices may have varying sizes, with the size of each printing orifice being a function of a distance of the printing orifice from the locus. Various methods are also provided, including methods for applying solder on electronic substrates using stencils and methods and systems for designing such stencils.Type: GrantFiled: August 30, 2001Date of Patent: July 27, 2004Assignee: Micron Technology, Inc.Inventors: Richard Regner, John Godfrey, Tony Teitenberg, Gary L. Chadwick
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Publication number: 20030041753Abstract: Stencils are provided for more precisely aligning stencil orifices with terminals or “targets” on a substrate. One such stencil is adapted for registration with an electronic substrate, such as a PCB, about a locus. The stencil includes a stencil body and an array of printing orifices passing through the stencil body. The printing orifices may have varying sizes, with the size of each printing orifice being a function of a distance of the printing orifice from the locus. Various methods are also provided, including methods for applying solder on electronic substrates using stencils and methods and systems for designing such stencils.Type: ApplicationFiled: August 30, 2001Publication date: March 6, 2003Inventors: Richard Regner, John Godfrey, Tony Teitenberg, Gary L. Chadwick
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Patent number: 6391468Abstract: Solder paste is deposited using a solder stencil with an aperture having a concave edge in order to reduce the formation of solder balls. The solder deposit may be formed on a pad such that the paste has a concave edge. Solder paste deposits may be made on adjacent pads with the concave surfaces facing one another.Type: GrantFiled: March 30, 2001Date of Patent: May 21, 2002Assignee: Micron Technology, Inc.Inventors: Richard Regner, Scott Butler, Carey Blue
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Publication number: 20010011676Abstract: Solder paste is deposited using a solder stencil with an aperture having a concave edge in order to reduce the formation of solder balls. The solder deposit may be formed on a pad such that the paste has a concave edge. Solder paste deposits may be made on adjacent pads with the concave surfaces facing one another.Type: ApplicationFiled: March 30, 2001Publication date: August 9, 2001Inventors: Richard Regner, Scott Butler, Carey Blue
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Patent number: 6248452Abstract: Solder paste is deposited using a solder stencil with an aperture having a concave edge in order to reduce the formation of solder balls. The solder deposit may be formed on a pad such that the paste has a concave edge. Solder paste deposits may be made on adjacent pads with the concave surfaces facing one another.Type: GrantFiled: April 17, 2000Date of Patent: June 19, 2001Assignee: Micron Technology, Inc.Inventors: Richard Regner, Scott Butler, Carey Blue
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Patent number: 6094832Abstract: Solder paste is deposited using a solder stencil with an aperture having a concave edge in order to reduce the formation of solder balls. The solder deposit may be formed on a pad such that the paste has a concave edge. Solder paste deposits may be made on adjacent pads with the concave surfaces facing one another.Type: GrantFiled: March 17, 1999Date of Patent: August 1, 2000Assignee: Micron Technology, Inc.Inventors: Richard Regner, Scott Butler, Carey Blue
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Patent number: 6012231Abstract: Solder paste is deposited using a solder stencil with an aperture having a concave edge in order to reduce the formation of solder balls. The solder deposit may be formed on a pad such that the paste has a concave edge. Solder paste deposits may be made on adjacent pads with the concave surfaces facing one another.Type: GrantFiled: December 8, 1997Date of Patent: January 11, 2000Assignee: Micron Technology, Inc.Inventors: Richard Regner, Scott Butler, Carey Blue
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Patent number: 4547932Abstract: Disclosed is a process for shirring tubular casings, in particular sausage casings, in which the casing is conveyed in the direction of its longitudinal axis and shirred against a counterforce by means of a shirring tool. The shirred tubing portion is divided into individual shirred sticks of a predetermined length and, if appropriate, the cut-off shirred sticks are further compressed. While being shirred and in the shirred state the casing is internally supported. For cutting-off a shirred tubing portion, the transport of the casing in the direction of its longitudinal axis is momentarily interrupted, the internal support is withdrawn from the severing region, and the unshirred or deshirred tubing section is severed at the rear aperture of the shirring tool. During severing, the not-yet-shirred casing surrounded by the shirring tool is permanently internally supported.Type: GrantFiled: June 15, 1984Date of Patent: October 22, 1985Assignee: Hoechst AktiengesellschaftInventors: Arno Romeike, Richard Regner, Alois Weinheimer
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Patent number: 4353940Abstract: A process is disclosed for coating the inside surface of a length of tubing comprising the steps of forming at least one loop of tubing with a downwardly inclined portion and an upwardly inclined portion; filling the cavity of the tubing forming the loop with a coating liquid; transporting the tubing along its longitudinal axis in a substantially vertically upward direction to coat the inside of the tubing above the level of the coating liquid with an initial layer of coating liquid; constricting the tubing adjacent to and above the level of the coating liquid along a constriction zone transverse to the longitudinal axis of the tubing, the constriction zone progressively diminishing in width in the direction of travel of the tubing to reduce the thickness of the initial layer and form a thin layer of desired thickness on the inside of the tubing issuing from the constriction zone; filling the cavity of the tubing issuing from the metering device with support gas; and exposing the tubing to heat at a sufficienType: GrantFiled: March 26, 1981Date of Patent: October 12, 1982Assignee: Hoechst AktiengesellschaftInventors: Reinhold Becker, Heinz Kalberer, Richard Regner
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Patent number: 4353939Abstract: Disclosed is a process for coating the inside of a length of tubing comprising the steps of forming at least one loop of tubing with a downwardly inclined portion and an upwardly inclined portion; filling the cavity of the tubing forming the loop with a coating liquid; transporting the tubing along its longitudinal axis in a substantially vertically upward direction to coat the inside surface of the tubing above the level of the coating liquid with an initial layer of coating liquid; constricting the tubing adjacent to and above the level of the coating liquid with a metering device having a constriction zone which flattens a portion of the tubing passing therethrough to substantially eliminate all of the initial layer thereon and partially flattens the remaining portion of the tubing to allow a desired quantity of coating liquid to remain on the tubing issuing from the constriction zone; filling the cavity of the tubing issuing from the constriction zone with support gas; and, exposing the tubing to the actiType: GrantFiled: March 26, 1981Date of Patent: October 12, 1982Assignee: Hoechst AktiengesellschaftInventors: Reinhold Becker, Heinz Kalberer, Richard Regner
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Patent number: 4185358Abstract: A method and apparatus for shirring sausage casings in which in the method the casing is moved in a direction of its longitudinal axis and while so moving has a force applied to shirr the casing which moves about the longitudinal axis of the casing. At the same time that the force is applied to shirr a force also is applied to oppose the movement of the casing. Also, the casing may be restrained against twisting about its axis upstream of the application of the shirring force. The apparatus includes rollers for forwarding a collapsed casing, an annular element adapted to rotate about the longitudinal axis of the casing to shirr the casing and a backing element adapted to hold the forward end of the casing in a fluid, tight manner and having a passage through which an inflating gas may pass to inflate the casing.Type: GrantFiled: August 9, 1978Date of Patent: January 29, 1980Assignee: Hoechst AktiengesellschaftInventors: Richard Regner, Gerd Schug
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Patent number: 3988804Abstract: A method and apparatus for shirring sausage casings in which in the method the casing is moved in a direction of its longitudinal axis and while so moving has a force applied to shirr the casing which moves about the longitudinal axis of the casing. At the same time that the force is applied to shirr a force also is applied to oppose the movement of the casing. Also, the casing may be restrained against twisting about its axis upstream of the application of the shirring force. The apparatus includes rollers for forwarding a collapsed casing, an annular element adapted to rotate about the longitudinal axis of the casing to shirr the casing and a backing element adapted to hold the forward end of the casing in a fluid, tight manner and having a passage through which an inflating gas may pass to inflate the casing.Type: GrantFiled: September 21, 1972Date of Patent: November 2, 1976Assignee: Hoechst AktiengesellschaftInventors: Richard Regner, Gerd Schug