Abstract: The present invention relates to seal ring back-up devices suitable for use on glands in sealing systems. In particular, the present invention relates to seal ring back-up devices that have been designed to fit into essentially all types of glands and close extrusion gaps. Some embodiments of the present invention provide a seal ring back-up device having an annular body having an inner diameter, an outer diameter, and a scarf cut; and where the annular body is configured to fit a gland and engage a seal ring.

Abstract: The present invention relates to seal ring back-up devices suitable for use on glands in sealing systems. In particular, the present invention relates to seal ring back-up devices that have been designed to fit into essentially all types of glands and close extrusion gaps. Some embodiments of the present invention provide a seal ring back-up device having an annular body having an inner diameter, an outer diameter, and a scarf cut; and where the annular body is configured to fit a gland and engage a seal ring.

Abstract: A pressure vessel having a cell with a locking pin, and a cap and associated methods and systems. The locking pin may be configured to engage the cap when the pressure vessel is pressurized to prevent rotation of the cap without depression of the cap.

Abstract: A pressure vessel having a cell with a locking pin, and a cap and associated methods and systems. The locking pin may be configured to engage the cap when the pressure vessel is pressurized to prevent rotation of the cap without depression of the cap.

Abstract: An apparatus(19) for holding a testing substrate in a wafer prober (16) has a plate (34) hinged to a head stage (18) of the equipment. The plate has two concentric openings to form a ledge (35) for holding the testing substrate (10). Additionally, the ledge has two asymmetrically placed locating pins (38) to allow automatic alignment of the testing substrate which has corresponding alignment holes. A latch (36) locks the plate against the head stage to securely fix the testing substrate in place so that it can make and maintain contact with a pogo pin area (26) on the head stage. The tester also has a wafer support chuck (20) upon which a semiconductor wafer (22) is placed with its active surface up. The head stage of the tester is closed so that the testing substrate contacts the active surface of the semiconductor wafer, and electrical testing may then be performed on the semiconductor wafer.