Patents by Inventor Richard T. Benkusky

Richard T. Benkusky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sealing of contact openings for conformally coated connectors for printed circuit board assemblies
    Patent number: 4820196
    Abstract: A connector having a housing with a number of cavities that receive connector pins is conformally coated. A thixotropic, curable material is used to seal-off the cavities at the end where the contact tails for the connector pins emerge from the housing. The sealing material seals off the cavities from the environment but does not extend so far into the cavities that electrically insulates the connector portion of the connector pins. The sealing material is preferably both ultravioletly-curable for rapid curing and heat-curable to cure the material in shadow areas.
    Type: Grant
    Filed: October 1, 1987
    Date of Patent: April 11, 1989
    Assignee: Unisys Corporation
    Inventors: Paul J. Roselle, Richard T. Benkusky