Patents by Inventor Richard T. Girard

Richard T. Girard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for preparing semiconductor wafers
    Patent number: 4897141
    Abstract: Profound improvements and advantages are realized in the process of cutting semiconductor ingots to provide wafers if the adhesive used to bond said ingot to a mounting or cutting beam contains hollow microspheres.
    Type: Grant
    Filed: June 9, 1988
    Date of Patent: January 30, 1990
    Assignee: Valtech Corporation
    Inventor: Richard T. Girard
  • Mounting beam for preparing wafers
    Patent number: 4667650
    Abstract: A self-dressing mounting beam for slicing wafers from ingots of various materials, especially semiconductors, is described. The mounting beam is a composite material comprising an organic polymer, particles of abrasive and hollow microspheres. The ingot is mounted on the beam and sliced using an inside diameter saw. The saw penetrates the mounting beam as well as the ingot, so that the self-dressing feature is realized with each pass of the blade.
    Type: Grant
    Filed: November 21, 1985
    Date of Patent: May 26, 1987
    Assignee: PQ Corporation
    Inventors: Richard T. Girard, John R. McLaughlin