Patents by Inventor Richard Wayne Jarvis

Richard Wayne Jarvis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Split manufacturing method for advanced semiconductor circuits
    Patent number: 7195931
    Abstract: A front-end-of-line piece of a semiconductor die is manufactured in a first manufacturing line. A back-end-of-line piece of a semiconductor die is manufactured using a second manufacturing line, which will typically be different than the first manufacturing line. The front-end-of-line piece and the back-end-of-line piece are combined during a joining process to form a semiconductor die. The semiconductor die is subsequently tested to determine if the semiconductor die is a functional semiconductor die.
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: March 27, 2007
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Richard Wayne Jarvis, Michael G. McIntyre
  • Split manufacturing method for advanced semiconductor circuits
    Publication number: 20040102019
    Abstract: A front-end-of-line piece of a semiconductor die is manufactured in a first manufacturing line. A back-end-of-line piece of a semiconductor die is manufactured using a second manufacturing line, which will typically be different than the first manufacturing line. The front-end-of-line piece and the back-end-of-line piece are combined during a joining process to form a semiconductor die. The semiconductor die is subsequently tested to determine if the semiconductor die is a functional semiconductor die.
    Type: Application
    Filed: November 27, 2002
    Publication date: May 27, 2004
    Inventors: Richard Wayne Jarvis, Michael G. McIntyre