Abstract: Exemplary impedance matching circuit for an amplifier device comprises a broadband impedance transformer configured to transform, over a fundamental frequency range, an impedance associated with an input port or an output port of the impedance matching circuit; and to transmit RF signals having a fundamental frequency within the fundamental frequency range. The impedance matching circuit also includes a phase shifter circuit configured to transmit, with substantially matched impedance, the RF signals having a fundamental frequency within the fundamental frequency range, and to phase-shift higher-order harmonics of the RF signals. The impedance matching circuit also includes a high-pass impedance transformer configured to match an impedance of the RF signals having a fundamental frequency within the fundamental frequency range; and to transmit, with low reflection, second-order harmonics of the RF signals.

Abstract: Embodiments of an RF amplifier package include a body section comprising an upper surface having first and second opposing edge sides, and a die pad vertically recessed beneath the upper surface and comprising first and second opposing sides and a third side intersecting with the first and second sides. Embodiments also include first and second leads disposed on the upper surface, the second lead extending from adjacent to the second side to the second edge side; and a biasing strip connected to the second lead and disposed on the upper surface adjacent to the third side. Other embodiments include packaged RF amplifiers comprising an RF amplifier package, and an RF transistor mounted on the die pad and comprising: a control terminal electrically coupled to the first lead, a reference potential terminal directly facing and electrically connected to the die pad, and an output terminal electrically connected to the second lead.

Abstract: An RF package includes a metal flange, an RF input lead, an RF output lead, and an electrically conductive die attach area. An RF transistor that is configured to amplify an RF signal is mounted in the die attach area. The RF transistor includes an input terminal that is electrically coupled to the RF input lead, an output terminal that is electrically coupled to the RF output lead, and a reference potential terminal that is electrically connected to the die attach area. A first capacitor having one or more upper metal plates, and a dielectric region is mounted in the die attach area and is electrically coupled to the RF transmission path of the RF signal. The first capacitor is configured to simultaneously match an impedance of the RF transistor at a fundamental frequency of the RF signal and to filter a higher order harmonic of the fundamental frequency.

Abstract: The present invention relates to a compound of general formula (I) which can transport holes in an organic optoelectronic device, and to blends and solutions comprising the compound of general formula (I): wherein X is C, Si or Ge; A is a group of formula (II) wherein Z is N, P, NH, O or S; E is C1-10 alkyl or H; W is substituted or unsubstituted C5-14 aryl or substituted or unsubstituted C6-16 alkyl; e is an integer from 1 to 4; and z is 1 or 2; B, C and D are each independently A, H, C1-C12 alkyl, C5-14 aryl or OH; and a, b, c and d are each independently an integer from 1 to 5.

Abstract: An RF package includes a metal flange, an RF input lead, an RF output lead, and an electrically conductive die attach area. An RF transistor that is configured to amplify an RF signal is mounted in the die attach area. The RF transistor includes an input terminal that is electrically coupled to the RF input lead, an output terminal that is electrically coupled to the RF output lead, and a reference potential terminal that is electrically connected to the die attach area. A first capacitor having one or more upper metal plates, and a dielectric region is mounted in the die attach area and is electrically coupled to the RF transmission path of the RF signal. The first capacitor is configured to simultaneously match an impedance of the RF transistor at a fundamental frequency of the RF signal and to filter a higher order harmonic of the fundamental frequency.

Abstract: A system and method to control environmental parameters of predefined zones within a structure. An embodiment of the system uses damper assemblies that are entirely wireless as a result of energy capturing devices which convert air flow within the HVAC system ductwork into electrical current and a wireless control module that remove the need for hard-wiring for power or control. Still further, an embodiment of the system uses wireless components to monitor the environmental parameters of a structure's zones, process and communicate necessary zone adjustments, and actuate system components.

Abstract: A phase shifter includes first and second RF terminals, a reference potential terminal; a lumped element LC network connected to the first and second RF terminals and the reference potential terminal, and first and second active semiconductor devices connected to the lumped element LC network and to the reference potential terminal. Each of the first and second active semiconductor devices include a control terminal and first and second output terminals. The lumped element LC network presents a reactance across the first and second RF terminals that shifts the phase of an RF signal as between the first and second RF terminals. The first and second active semiconductor devices are configured to tune the phase shift of the RF signal by controlling the reactance across the first and second RF terminals.

Abstract: The invention relates to a microbial delivery system where biochar acts as a carrier for microbes.

Abstract: A peaking amplifier is disclosed. The peaking amplifier includes a driver stage, a final stage, and an interstage matching network. The driver stage has a load impedance and is configured to generate a driver output based on an input signal. The final stage has a final stage input impedance and is configured to generate a peaking output based on the driver output. The interstage matching network is coupled to the driver stage and the final stage. The interstage matching network is configured to transform the final stage input impedance to the load impedance for the driver stage when the peaking amplifier is ON and to provide a short to an input of the final stage when the peaking amplifier is in an OFF state.

Abstract: A light-emitting composition comprises a polymer and a phosphorescent light-emitting material. The polymer comprises conjugating repeat units of formula (I) and up to 20 mol % of conjugation-blocking repeat units of repeat units of formula (II): Ar1 represents an aryl or heteroaryl group; R1, which may be the same or different in each occurrence, is a substituent; p is 0 or an integer; Ar2 in each occurrence independently represents a substituted or unsubstituted aryl or heteroaryl group; and Sp1 represents an acyclic spacer group that does not provide any conjugation path between the two groups Ar2. Optionally, p is 0, 1, 2, 3 or 4 and each R1 is a non-polar substituent. Each R1 is advantageously selected from C1-30 hydrocarbyl substituents. A light-emitting device comprises an anode, a cathode and a light-emitting layer between the anode and the cathode, the light-emitting layer comprising a light-emitting composition as described.

Abstract: Various aspects of the disclosed technology relate to thermal model obfuscation. A thermal model for a first assembly is received. An obfuscated thermal model is then generated from the thermal model. The generation comprises replacing names associated with one or more objects in the assembly with obfuscated names. The obfuscated thermal model can be used in thermal simulation of a second assembly, of which the first assembly is a component.

Abstract: Exemplary embodiments including an amplifier circuit that includes a radio-frequency (RF) amplifier comprising an input terminal and an output terminal, the RF amplifier being configured to amplify, across a wideband frequency range, an RF signal applied to the input terminal to generate an amplified RF signal at the output terminal. The amplifier circuit also includes a first impedance matching network connected to the RF amplifier output terminal. The first impedance matching network includes a first reactive circuit, having substantially fixed impedance, connected between the RF amplifier input terminal and ground; a second reactive circuit; and a switching device configured to couple the second reactive circuit to the first reactive circuit in an ON state, and to decouple the second reactive circuit from the first reactive circuit in an OFF state. In some embodiments, the amplifier circuit can include a second impedance matching network connected to the RF amplifier input terminal.

Abstract: A system to provide a multi-function connection capability to contain and provide for stacking, mounting self-registering Multi-Function Junction (MF/J) boxes that contain a multiplicity of control electronics and can be stacked, removed, replaced, and/or upgraded with a minimal of steps or connection processes in order to simplify methods and conserve on or add value, capabilities to materials and electrical/mechanical equipment. The system can be engaged or utilized by any EMS/First Responder/Service Technician, authorized personnel in any field, Contractor, manufacturer, BOS integrator and any assembler of systems that require a multiplicity of interfacing devices to be in proximity, connection or contact to each other.

Abstract: An RF semiconductor amplifier package includes a flange shaped body section, an electrically conductive die pad centrally located on the body section, and an electrically insulating window frame disposed on an upper surface of the body section. A first electrically conductive lead is disposed on the window frame adjacent to a first side of the die pad and extends away from the first side of the die pad towards a first edge side of the body section. A second electrically conductive lead is disposed on the window frame adjacent to a second side of the die pad and extends away from the second side of the die pad towards a second edge side of the body section. A first electrically conductive biasing strip is disposed on the window frame, continuously connected to the second lead, and extends along and a third side of the die pad.

Abstract: Biochars and methods for treating biochars are provided that are useful in various applications, including, but not limited to, applications related to the raising, care, maintenance, disease prevention, disease treatment and odor control of animals.

Abstract: Treated biochar and methods for treating biochar are provided. The method for treating the biochar includes forcing, assisting or accelerating the movement of an infiltrant into the pores of the biochar, whereby the treatment affects properties of the biochar that provide for a more reliable and predictable biochar for use in various applications, including, but not limited to, agricultural applications.

Abstract: An amplifier circuit includes an RF amplifier that is configured to amplify an RF signal between a first terminal and a second terminal across an RF frequency range. The amplifier circuit includes a multi-stage impedance matching network having a broadband impedance transformer, a phase shifter, and a high-pass impedance transformer connected in series with one another between a first port of the amplifier circuit and the first terminal. The broadband impedance transformer provides impedance transformation in the RF frequency range. The phase shifter shifts a phase output port reflection coefficient in a second order harmonic frequency range that overlaps with a second order harmonic of the fundamental RF frequency. The high-pass impedance transformer transmits an RF signal in the RF frequency range while providing impedance transformation in the RF frequency range and transmits RF signals in the second order harmonic frequency range with low impedance.

Abstract: A method for creating treated biochar is provided that includes infusing a liquid additive into the pores of biochar, such as a fertilizer solution or other additive beneficial to plant growth. The method further includes the removal of materials and/or other additives from the pores of biochar. The present invention further provides biochar having pores filled with a liquid solution containing an additive, where the additive may include, but not be limited to, an additive beneficial to plant growth.

Abstract: Treated biochar and methods for treating biochar are provided. The method for treating the biochar includes forcing, assisting or accelerating the movement of an infiltrant into the pores of the biochar, whereby the treatment affects properties of the biochar that provide for a more reliable and predictable biochar for use in various applications, including, but not limited to, agricultural applications.