Patents by Inventor Rick Tufty
Rick Tufty has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11991856Abstract: An enclosure for an electronic system that is configured to act as a heat exchanger to remove heat from a cooling liquid that is circulated through the electronic system for cooling the electronic components thereof which are submerged in the cooling liquid in direct contact therewith. The enclosure uses an arrangement of a combination of external fins on one or more walls and fluid passages formed in one or more of the walls through which the cooling liquid is circulated for cooling. The fluid passages and the external fins are preferably formed on the same wall. The fins and the fluid passages can be formed on any number of walls of the enclosure.Type: GrantFiled: May 7, 2021Date of Patent: May 21, 2024Assignee: LiquidCool Solutions, Inc.Inventors: Rick Tufty, Steve Shafer
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Publication number: 20230232524Abstract: Liquid submersion cooled electronic devices and systems are described that use one or more cooling liquids, for example one or more dielectric cooling liquids, to submersion cool individual electronic devices or an array of electronic devices. A clamshell or sandwich construction of the device housing is used to define a wet zone containing heat producing electronic components of the electronic device to be cooled by the dielectric cooling liquid, and a dry zone where input/output and power connectors are provided.Type: ApplicationFiled: January 17, 2023Publication date: July 20, 2023Inventors: Lyle Rick TUFTY, Steve SHAFER
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Patent number: 11452241Abstract: A server system formed by a first group of liquid submersion cooled servers, which are part of one or more server module assemblies mounted on the rack. A first power shelf is mounted on the rack and is electrically connected to the first group of liquid submersion cooled servers to provide electrical power to the first group. In addition, a second group of liquid submersion cooled servers, which are part of one or more server module assemblies is also mounted on the rack below the first group. A second power shelf is mounted on the rack below the first group and below the first power shelf, and the second power shelf is electrically connected to the second group of liquid submersion cooled servers to provide electrical power to the second group.Type: GrantFiled: November 17, 2020Date of Patent: September 20, 2022Assignee: LiquidCool Solutions, Inc.Inventors: Lyle Rick Tufty, Steve Shafer, Rafael Alba, Gary Allen Reed
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Publication number: 20210368650Abstract: An enclosure for an electronic system that is configured to act as a heat exchanger to remove heat from a cooling liquid that is circulated through the electronic system for cooling the electronic components thereof which are submerged in the cooling liquid in direct contact therewith. The enclosure uses an arrangement of a combination of external fins on one or more walls and fluid passages formed in one or more of the walls through which the cooling liquid is circulated for cooling. The fluid passages and the external fins are preferably formed on the same wall. The fins and the fluid passages can be formed on any number of walls of the enclosure.Type: ApplicationFiled: May 7, 2021Publication date: November 25, 2021Inventors: Rick TUFTY, Steve SHAFER
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Patent number: 11122704Abstract: Liquid submersion cooling devices and systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool individual electronic devices or an array of electronic devices. In one embodiment, the electronic device includes a non-pressurized device housing defining an interior space where pressure in the interior space equals or is only slightly different than pressure outside the non-pressurized device housing.Type: GrantFiled: November 15, 2019Date of Patent: September 14, 2021Assignee: LiquidCool Solutions, Inc.Inventors: Sean Michael Archer, Steve Shafer, David Roe, Lyle Rick Tufty
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Patent number: 11032939Abstract: An enclosure for an electronic system that is configured to act as a heat exchanger to remove heat from a cooling liquid that is circulated through the electronic system for cooling the electronic components thereof which are submerged in the cooling liquid in direct contact therewith. The enclosure uses an arrangement of a combination of external fins on one or more walls and fluid passages formed in one or more of the walls through which the cooling liquid is circulated for cooling. The fluid passages and the external fins are preferably formed on the same wall. The fins and the fluid passages can be formed on any number of walls of the enclosure.Type: GrantFiled: December 17, 2018Date of Patent: June 8, 2021Assignee: LiquidCool Solutions, Inc.Inventors: Rick Tufty, Steve Shafer
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Publication number: 20210153390Abstract: A server system formed by a first group of liquid submersion cooled servers, which are part of one or more server module assemblies mounted on the rack. A first power shelf is mounted on the rack and is electrically connected to the first group of liquid submersion cooled servers to provide electrical power to the first group. In addition, a second group of liquid submersion cooled servers, which are part of one or more server module assemblies is also mounted on the rack below the first group. A second power shelf is mounted on the rack below the first group and below the first power shelf, and the second power shelf is electrically connected to the second group of liquid submersion cooled servers to provide electrical power to the second group.Type: ApplicationFiled: November 17, 2020Publication date: May 20, 2021Inventors: Lyle Rick TUFTY, Steve SHAFER, Rafael ALBA, Gary Allen REED
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Publication number: 20200107468Abstract: Liquid submersion cooling devices and systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool individual electronic devices or an array of electronic devices. In one embodiment, the electronic device includes a non-pressurized device housing defining an interior space where pressure in the interior space equals or is only slightly different than pressure outside the non-pressurized device housing.Type: ApplicationFiled: September 28, 2018Publication date: April 2, 2020Inventors: Sean Michael Archer, Steve Shafer, David Roe, Lyle Rick Tufty
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Publication number: 20200107470Abstract: Liquid submersion cooling devices and systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool individual electronic devices or an array of electronic devices. In one embodiment, the electronic device includes a non-pressurized device housing defining an interior space where pressure in the interior space equals or is only slightly different than pressure outside the non-pressurized device housing.Type: ApplicationFiled: November 15, 2019Publication date: April 2, 2020Inventors: Sean Michael ARCHER, Steve SHAFER, David ROE, Lyle Rick TUFTY
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Patent number: 10609839Abstract: Liquid submersion cooling devices and systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool individual electronic devices or an array of electronic devices. In one embodiment, the electronic device includes a non-pressurized device housing defining an interior space where pressure in the interior space equals or is only slightly different than pressure outside the non-pressurized device housing.Type: GrantFiled: September 28, 2018Date of Patent: March 31, 2020Assignee: LIQUIDCOOL SOLUTIONS, INC.Inventors: Sean Michael Archer, Steve Shafer, David Roe, Lyle Rick Tufty
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Patent number: 10390458Abstract: Liquid submersion cooling systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool an array of electronic devices. In some embodiments described herein, rather than using pump pressure to return the cooling liquid back to a cooling liquid reservoir, gravity can be used to return the cooling liquid to a reservoir via a cooling liquid gravity return manifold, and a pump can only be used on the liquid supply side to deliver the cooling liquid to each electronic device.Type: GrantFiled: September 20, 2018Date of Patent: August 20, 2019Assignee: LIQUIDCOOL SOLUTIONS, INC.Inventors: Lyle Rick Tufty, Gary Allan Reed, Sean Michael Archer, Rafael Alba
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Publication number: 20190124790Abstract: An enclosure for an electronic system that is configured to act as a heat exchanger to remove heat from a cooling liquid that is circulated through the electronic system for cooling the electronic components thereof which are submerged in the cooling liquid in direct contact therewith. The enclosure uses an arrangement of a combination of external fins on one or more walls and fluid passages formed in one or more of the walls through which the cooling liquid is circulated for cooling. The fluid passages and the external fins are preferably formed on the same wall. The fins and the fluid passages can be formed on any number of walls of the enclosure.Type: ApplicationFiled: December 17, 2018Publication date: April 25, 2019Inventors: Rick TUFTY, Steve SHAFER
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Patent number: 10271456Abstract: An enclosure for an electronic system that is configured to act as a heat exchanger to remove heat from a cooling liquid that is circulated through the electronic system for cooling the electronic components thereof which are submerged in the cooling liquid in direct contact therewith. The enclosure uses an arrangement of a combination of external fins on one or more walls and fluid passages formed in one or more of the walls through which the cooling liquid is circulated for cooling. The fluid passages and the external fins are preferably formed on the same wall. The fins and the fluid passages can be formed on any number of walls of the enclosure.Type: GrantFiled: September 28, 2015Date of Patent: April 23, 2019Assignee: LIQUIDCOOL SOLUTIONS, INC.Inventors: Rick Tufty, Steve Shafer
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Publication number: 20190090383Abstract: Liquid submersion cooling systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool an array of electronic devices. In some embodiments described herein, rather than using pump pressure to return the cooling liquid back to a cooling liquid reservoir, gravity can be used to return the cooling liquid to a reservoir via a cooling liquid gravity return manifold, and a pump can only be used on the liquid supply side to deliver the cooling liquid to each electronic device.Type: ApplicationFiled: September 20, 2018Publication date: March 21, 2019Inventors: Lyle Rick TUFTY, Gary Allan REED, Sean Michael ARCHER, Rafael ALBA
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Publication number: 20160095253Abstract: An enclosure for an electronic system that is configured to act as a heat exchanger to remove heat from a cooling liquid that is circulated through the electronic system for cooling the electronic components thereof which are submerged in the cooling liquid in direct contact therewith. The enclosure uses an arrangement of a combination of external fins on one or more walls and fluid passages formed in one or more of the walls through which the cooling liquid is circulated for cooling. The fluid passages and the external fins are preferably formed on the same wall. The fins and the fluid passages can be formed on any number of walls of the enclosure.Type: ApplicationFiled: September 28, 2015Publication date: March 31, 2016Inventors: Rick TUFTY, Steve SHAFER
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Patent number: 7889461Abstract: An internal support interface which provides vibration and acoustic isolation. A stationary shaft has a medial portion about which a rotatable member rotates. An end portion of the shaft has an annular base surface surrounding a stub shaft projection. A substantially planar housing member has a support post which extends from an annular interior surface in adjacent, non-contacting proximity to the stub shaft projection to form a gap therebetween. An annular damping member mutually contactingly surrounds the stub shaft projection and the support post while being compressed between the base surface of the shaft and the interior surface of the housing member.Type: GrantFiled: May 11, 2007Date of Patent: February 15, 2011Assignee: Maxtor CorporationInventors: Paul Stasiewicz, Rick Tufty, Gary Holland
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Publication number: 20070291407Abstract: An internal support interface which provides vibration and acoustic isolation. A stationary shaft has a medial portion about which a rotatable member rotates. An end portion of the shaft has an annular base surface surrounding a stub shaft projection. A substantially planar housing member has a support post which extends from an annular interior surface in adjacent, non-contacting proximity to the stub shaft projection to form a gap therebetween. An annular damping member mutually contactingly surrounds the stub shaft projection and the support post while being compressed between the base surface of the shaft and the interior surface of the housing member.Type: ApplicationFiled: May 11, 2007Publication date: December 20, 2007Applicants: Maxtor CorporationInventors: PAUL STASIEWICZ, Rick Tufty, Gary Holland
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Patent number: 6285524Abstract: A data storage disk drive is provided with a spindle which supports a plurality of disks having at least one magnetic disk surface to form a spindle assembly for rotation of the disk surfaces about a common axis and a rotary actuator which supports magnetic transducers for movement in unison about respective disk surfaces. The disk drive includes a disk drive enclosure having die-cast generated predetermined zero draft geometries for mounting the spindle motor shaft and the actuator bearing shaft. The enclosure includes a base casting and a cover casting, each casting including structure for locating and retaining electrical connectors used for connecting to a planar electronics card located outside the drive enclosure. The disk drive includes an effective and easily manufacturable electrical path from a flex circuit to an actuator comb. The disk drive includes a tubular chemical breather filter arranged with integral housing and diffusion channels formed in the cover casting.Type: GrantFiled: May 22, 1995Date of Patent: September 4, 2001Assignee: International Business Machines CorporationInventors: Jeffrey Fred Boigenzahn, Darrell Eugene Bratvold, Dale Clark Goeke, Michael Scott Good, Dale E. Goodman, Richard Edward Lagergren, Gregory Allen Lyons, Brian Lee Rappel, James Michael Rigotti, Lyle Rick Tufty
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Patent number: 5872679Abstract: A data storage disk drive is provided with a spindle which supports a plurality of disks having at least one magnetic disk surface to form a spindle assembly for rotation of the disk surfaces about a common axis and a rotary actuator which supports magnetic transducers for movement in unison about respective disk surfaces. The disk drive includes a disk drive enclosure having die-cast generated predetermined zero draft geometries for mounting the spindle motor shaft and the actuator bearing shaft. The enclosure includes a base casting and a cover casting, each casting including structure for locating and retaining electrical connectors used for connecting to a planar electronics card located outside the drive enclosure. The disk drive includes an effective and easily manufacturable electrical path from a flex circuit to an actuator comb. The disk drive includes a tubular chemical breather filter arranged with integral housing and diffusion channels formed in the cover casting.Type: GrantFiled: July 1, 1998Date of Patent: February 16, 1999Assignee: International Business Machines CorporationInventors: Jeffrey Fred Boigenzahn, Darrell Eugene Bratvold, Richard Edward Lagergren, Gregory Allen Lyons, Brian Lee Rappel, James Michael Rigotti, Lyle Rick Tufty