Patents by Inventor Ricky Calustre

Ricky Calustre has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit device having exposed contact pads and leads supporting the integrated circuit die and method of forming the device
    Patent number: 9324643
    Abstract: An integrated circuit (IC) device includes an IC die and encapsulation material surrounding the IC die. A first set of leads is coupled to the IC die and has first contact pads exposed on a bottom surface of the encapsulation material adjacent its periphery. A second set of leads is coupled to the IC die and has second contact pads exposed on the bottom surface of the encapsulation material adjacent its periphery. The second set of leads has internal ends extending laterally inwardly from respective ones of the second contact pads to define a die pad area supporting the IC die.
    Type: Grant
    Filed: December 11, 2014
    Date of Patent: April 26, 2016
    Assignee: STMICROELECTRONICS, INC.
    Inventors: Ela Mia Cadag, Ricky Calustre
  • Leadless packages and method of manufacturing same
    Patent number: 9012268
    Abstract: Embodiments of the present disclosure are directed to leadframe strips and methods of forming packages that include first separating adjacent leads of a leadframe strip and subsequently singulating components into individual packages. In one embodiment, the adjacent leads are separated by etching through the leads, thereby providing electrical isolation of the adjacent packages. In that regard, if desired, the individual adjacent packages may be electrically tested in leadframe strip form. Subsequently, the individual packages are formed by sawing through the encapsulation material.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: April 21, 2015
    Assignee: STMicroelectronics, Inc.
    Inventors: Jonathan Jaurigue, Rogelio Real, Francis Ann Llana, Ricky Calustre, Rodolfo Gacusan
  • LEADLESS PACKAGES AND METHOD OF MANUFACTURING SAME
    Publication number: 20150001698
    Abstract: Embodiments of the present disclosure are directed to leadframe strips and methods of forming packages that include first separating adjacent leads of a leadframe strip and subsequently singulating components into individual packages. In one embodiment, the adjacent leads are separated by etching through the leads, thereby providing electrical isolation of the adjacent packages. In that regard, if desired, the individual adjacent packages may be electrically tested in leadframe strip form. Subsequently, the individual packages are formed by sawing through the encapsulation material.
    Type: Application
    Filed: June 28, 2013
    Publication date: January 1, 2015
    Inventors: Jonathan Jaurigue, Rogelio Real, Francis Ann Llana, Ricky Calustre, Rodolfo Gacusan