Patents by Inventor Rieka Ouchi

Rieka Ouchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package and method for fabricating package
    Patent number: 9820400
    Abstract: A package that hermetically seals an integrated circuit includes a metal lid (7) and a metal housing (10) having an open upper portion (12). In the package, the housing (10) includes in a wall surface thereof a glass unit (2) that seals a plurality of lead terminals therein. The glass unit (2) is disposed in a wall surface of the housing (10) such that a thickness in a vertical direction of the wall surface on an upper side of the glass unit (2) is determined according to a threshold limit value of a difference in temperature between glass that forms the glass unit (2) and metal that forms the wall surface.
    Type: Grant
    Filed: June 1, 2015
    Date of Patent: November 14, 2017
    Assignee: NEC SPACE TECHNOLOGIES, LTD.
    Inventors: Rieka Ouchi, Yasuhiro Ishii, Hideki Tanaka
  • PACKAGE AND METHOD FOR FABRICATING PACKAGE
    Publication number: 20150359121
    Abstract: A package that hermetically seals an integrated circuit includes a metal lid 7 and a metal housing 10 having an open upper portion. In the package, the housing 10 includes in a wall surface thereof a glass unit 2 that seals a plurality of lead terminals therein. The glass unit 2 is disposed in a wall surface of the housing 10 such that a thickness in a vertical direction of the wall surface on an upper side of the glass unit 2 is determined according to a threshold limit value of a difference in temperature between glass that forms the glass unit 2 and metal that forms the wall surface.
    Type: Application
    Filed: June 1, 2015
    Publication date: December 10, 2015
    Inventors: Rieka OUCHI, Yasuhiro ISHII, Hideki TANAKA
  • Flip-chip type semiconductor device
    Patent number: 7763985
    Abstract: A flip-chip type semiconductor device includes a semiconductor substrate. A plurality of electrode terminals are provided and arranged on a top surface of the semiconductor substrate, a sealing resin layer is formed on the top surface of the semiconductor substrate such that the electrode terminals are completely covered with the sealing resin layer.
    Type: Grant
    Filed: October 24, 2008
    Date of Patent: July 27, 2010
    Assignee: NEC Electronics Corporation
    Inventors: Yoichiro Kurita, Rieka Ouchi, Takashi Miyazaki, Toshiyuki Yamada
  • Flip-chip type semiconductor device
    Patent number: 7554205
    Abstract: A flip-chip type semiconductor device includes a semiconductor substrate. A plurality of electrode terminals are provided and arranged on a top surface of the semiconductor substrate, a sealing resin layer is formed on the top surface of the semiconductor substrate such that the electrode terminals are completely covered with the sealing resin layer.
    Type: Grant
    Filed: May 11, 2007
    Date of Patent: June 30, 2009
    Assignee: NEC Electronics Corporation
    Inventors: Yoichiro Kurita, Rieka Ouchi, Takashi Miyazaki, Toshiyuki Yamada
  • FLIP-CHIP TYPE SEMICONDUCTOR DEVICE
    Publication number: 20090051029
    Abstract: A flip-chip type semiconductor device includes a semiconductor substrate. A plurality of electrode terminals are provided and arranged on a top surface of the semiconductor substrate, a sealing resin layer is formed on the top surface of the semiconductor substrate such that the electrode terminals are completely covered with the sealing resin layer.
    Type: Application
    Filed: October 24, 2008
    Publication date: February 26, 2009
    Applicant: NEC ELECTRONICS CORPORATION
    Inventors: Yoichiro KURITA, Rieka Ouchi, Takashi Miyazaki, Toshiyuki Yamada
  • Flip-chip type semiconductor device
    Publication number: 20070216035
    Abstract: A flip-chip type semiconductor device includes a semiconductor substrate. A plurality of electrode terminals are provided and arranged on a top surface of the semiconductor substrate, a sealing resin layer is formed on the top surface of the semiconductor substrate such that the electrode terminals are completely covered with the sealing resin layer.
    Type: Application
    Filed: May 11, 2007
    Publication date: September 20, 2007
    Applicant: NEC ELECTRONICS CORPORATION
    Inventors: Yoichiro Kurita, Rieka Ouchi, Takashi Miyazaki, Toshiyuki Yamada
  • Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip type semiconductor device
    Patent number: 7238548
    Abstract: A flip-chip type semiconductor device includes a semiconductor substrate. A plurality of electrode terminals are provided and arranged on a top surface of the semiconductor substrate, a sealing resin layer is formed on the top surface of the semiconductor substrate such that the electrode terminals are completely covered with the sealing resin layer.
    Type: Grant
    Filed: August 17, 2004
    Date of Patent: July 3, 2007
    Assignee: NEC Electronics Corporation
    Inventors: Yoichiro Kurita, Rieka Ouchi, Takashi Miyazaki, Toshiyuki Yamada
  • Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip type semiconductor device
    Publication number: 20050040541
    Abstract: A flip-chip type semiconductor device includes a semiconductor substrate. A plurality of electrode terminals are provided and arranged on a top surface of the semiconductor substrate, a sealing resin layer is formed on the top surface of the semiconductor substrate such that the electrode terminals are completely covered with the sealing resin layer.
    Type: Application
    Filed: August 17, 2004
    Publication date: February 24, 2005
    Applicant: NEC ELECTRONICS CORPORATION
    Inventors: Yoichiro Kurita, Rieka Ouchi, Takashi Miyazaki, Toshiyuki Yamada