Abstract: A vertical molding machine has an upper mold, a lower mold matched with the upper mold to define a molding cavity therebetween and at least one cleaning device having a base body mounted to a side of the upper mold. A top surface of the lower mold is acted as a mating surface. The base body defines a passageway with one end opened freely for receiving external gas. The base body further defines at least one blowhole. One end of the blowhole is connected with the passageway and the other end thereof penetrates through the base body to be exposed towards the mating surface of the lower mold so as to make the external gas flown onto the mating surface of the lower mold blow through the passageway and the blowholes.

Abstract: A soldering apparatus has a fixture receiving an electronic component and a conducting wire, with a free end of the conducting wire superimposed on the soldering area of the electronic component, a convey mechanism capable of transmitting the fixture downstream, a daubing device, and a soldering device. The daubing device has a level movable element capable of moving along a convey direction of the convey mechanism, and a vertical movable element mounted on the level movable element and capable of moving along an upward and downward direction. A carrier mounted to the vertical movable element has a solder paste can for loading the solder paste, and an output portion for dispensing the solder paste to the soldering area. The soldering device has a soldering head heating the solder paste for shrinking the insulator, with the core wire exposing and connected to the soldering area by the cool solder paste.