Patents by Inventor Riichiro Takahashi

Riichiro Takahashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240116903
    Abstract: A compound has a tetra-hydroquinoline skeleton, the compound having inhibitory action against ferroptosis, and exerting therapeutic or preventive effect on diseases, disorders or syndromes related to ferroptosis inhibition, such as multiple sclerosis.
    Type: Application
    Filed: December 24, 2021
    Publication date: April 11, 2024
    Inventors: Ken Nunettsu Asaba, Takehiro Takahashi, Masashi Yamamoto, Kozue Takagaki, Marina Nogami, Riichiro Tsuji, Hiroyuki Meguro, Naoya Ukegawa
  • Patent number: 7727853
    Abstract: A processing method for selectively reducing or removing the region to be exposed with energy ray in a film formed on a substrate, comprising relatively scanning a first exposure light whose shape on the substrate is smaller than the whole first region to be exposed against the whole first region to be exposed to selectively remove or reduce the first region to be exposed, and exposing a whole second region to be exposed inside the whole first region to be exposed with a second exposure light to selectively expose the whole second region to be exposed.
    Type: Grant
    Filed: July 1, 2008
    Date of Patent: June 1, 2010
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tomoyuki Takeishi, Kenji Kawano, Hiroshi Ikegami, Shinichi Ito, Riichiro Takahashi
  • Publication number: 20100104988
    Abstract: There is disclosed a developing method of developing a photo-sensitive resist film in which a desired pattern is exposed, including subjecting the exposed photosensitive resist film to a first developing treatment; supplying a cleaning solution having an oxidizing property or alkalinity with respect to the surface of the resist film to the photosensitive resist film subject to the first developing treatment to perform a first cleaning treatment; subjecting the photosensitive resist film subjected to the first cleaning treatment to a second developing treatment; and subjecting the photosensitive resist film subjected to the second developing treatment to a second cleaning treatment.
    Type: Application
    Filed: December 31, 2009
    Publication date: April 29, 2010
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Kei HAYASAKI, Shinichi ITO, Tatsuhiko EMA, Riichiro TAKAHASHI
  • Patent number: 7669608
    Abstract: There is disclosed a substrate treating method comprising supplying a treating solution onto a substrate, and continuously discharging a first cleaning solution to the substrate from a first discharge region disposed in a nozzle, while moving the nozzle and substrate with respect to each other in one direction, wherein a length of a direction crossing at right angles to the direction of the first discharge region is equal to or more than a maximum diameter or longest side of the substrate, the nozzle continuously spouts a first gas to the substrate from a first jet region, and the length of a direction crossing at right angles to the direction of the first jet region is equal to or more than the maximum diameter or longest side of the substrate.
    Type: Grant
    Filed: November 16, 2004
    Date of Patent: March 2, 2010
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kei Hayasaki, Shinichi Ito, Tatsuhiko Ema, Riichiro Takahashi
  • Publication number: 20090039275
    Abstract: A processing method for selectively reducing or removing the region to be exposed with energy ray in a film formed on a substrate, comprising relatively scanning a first exposure light whose shape on the substrate is smaller than the whole first region to be exposed against the whole first region to be exposed to selectively remove or reduce the first region to be exposed, and exposing a whole second region to be exposed inside the whole first region to be exposed with a second exposure light to selectively expose the whole second region to be exposed.
    Type: Application
    Filed: July 1, 2008
    Publication date: February 12, 2009
    Inventors: Tomoyuki Takeishi, Kenji Kawano, Hiroshi Ikegami, Shinichi Ito, Riichiro Takahashi
  • Patent number: 7399578
    Abstract: A manufacturing method of an alkaline solution, comprising dissolving a gaseous molecule having oxidizing properties or reducing properties in an aqueous alkaline solution.
    Type: Grant
    Filed: July 27, 2006
    Date of Patent: July 15, 2008
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Riichiro Takahashi, Kei Hayasaki, Tomoyuki Takeishi, Shinichi Ito
  • Publication number: 20080050677
    Abstract: A processing method for selectively reducing or removing the region to be exposed with energy ray in a film formed on a substrate, comprising relatively scanning a first exposure light whose shape on the substrate is smaller than the whole first region to be exposed against the whole first region to be exposed to selectively remove or reduce the first region to be exposed, and exposing a whole second region to be exposed inside the whole first region to be exposed with a second exposure light to selectively expose the whole second region to be exposed.
    Type: Application
    Filed: October 5, 2007
    Publication date: February 28, 2008
    Inventors: Tomoyuki Takeishi, Kenji Kawano, Hiroshi Ikegami, Shinichi Ito, Riichiro Takahashi
  • Publication number: 20080035851
    Abstract: A processing method for selectively reducing or removing the region to be exposed with energy ray in a film formed on a substrate, comprising relatively scanning a first exposure light whose shape on the substrate is smaller than the whole first region to be exposed against the whole first region to be exposed to selectively remove or reduce the first region to be exposed, and exposing a whole second region to be exposed inside the whole first region to be exposed with a second exposure light to selectively expose the whole second region to be exposed.
    Type: Application
    Filed: October 5, 2007
    Publication date: February 14, 2008
    Inventors: Tomoyuki Takeishi, Kenji Kawano, Hiroshi Ikegami, Shinichi Ito, Riichiro Takahashi
  • Patent number: 7288466
    Abstract: A processing method for selectively reducing or removing the region to be exposed with energy ray in a film formed on a substrate, comprising relatively scanning a first exposure light whose shape on the substrate is smaller than the whole first region to be exposed against the whole first region to be exposed to selectively remove or reduce the first region to be exposed, and exposing a whole second region to be exposed inside the whole first region to be exposed with a second exposure light to selectively expose the whole second region to be exposed.
    Type: Grant
    Filed: May 14, 2003
    Date of Patent: October 30, 2007
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tomoyuki Takeishi, Kenji Kawano, Hiroshi Ikegami, Shinichi Ito, Riichiro Takahashi
  • Publication number: 20070037099
    Abstract: A manufacturing method of an alkaline solution, comprising dissolving a gaseous molecule having oxidizing properties or reducing properties in an aqueous alkaline solution.
    Type: Application
    Filed: July 27, 2006
    Publication date: February 15, 2007
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Riichiro Takahashi, Kei Hayasaki, Tomoyuki Takeishi, Shinichi Ito
  • Patent number: 7097960
    Abstract: A manufacturing method of an alkaline solution, comprising dissolving a gaseous molecule having oxidizing properties or reducing properties in an aqueous alkaline solution.
    Type: Grant
    Filed: April 15, 2004
    Date of Patent: August 29, 2006
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Riichiro Takahashi, Kei Hayasaki, Tomoyuki Takeishi, Shinichi Ito
  • Publication number: 20060151015
    Abstract: In this disclosure, air flow is formed above chemical liquid film and a move of the chemical liquid is generated by making the air flow into a contact with the surface of chemical liquid. Further, a negative pressure is generated in a space between a processing object substrate and a plate by rotating the plate. Consequently, uniformity of processing of chemical liquid is improved, so that liquid removing step can be carried out effectively. As a result, yield rate of chemical liquid treatment can be improved.
    Type: Application
    Filed: March 10, 2006
    Publication date: July 13, 2006
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Shinichi Ito, Riichiro Takahashi, Tatsuhiko Ema, Katsuya Okamura
  • Patent number: 7067033
    Abstract: In this disclosure, air flow is formed above chemical liquid film and a move of the chemical liquid is generated by making the air flow into a contact with the surface of chemical liquid. Further, a negative pressure is generated in a space between a processing object substrate and a plate by rotating the plate. Consequently, uniformity of processing of chemical liquid is improved, so that liquid removing step can be carried out effectively. As a result, yield rate of chemical liquid treatment can be improved.
    Type: Grant
    Filed: February 11, 2004
    Date of Patent: June 27, 2006
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Shinichi Ito, Riichiro Takahashi, Tatsuhiko Ema, Katsuya Okamura
  • Patent number: 7018481
    Abstract: There is disclosed a substrate treating method comprising supplying a treating solution onto a substrate, and continuously discharging a first cleaning solution to the substrate from a first discharge region disposed in a nozzle, while moving the nozzle and substrate with respect to each other in one direction, wherein a length of a direction crossing at right angles to the direction of the first discharge region is equal to or more than a maximum diameter or longest side of the substrate, the nozzle continuously spouts a first gas to the substrate from a first jet region, and the length of a direction crossing at right angles to the direction of the first jet region is equal to or more than the maximum diameter or longest side of the substrate.
    Type: Grant
    Filed: January 27, 2003
    Date of Patent: March 28, 2006
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kei Hayasaki, Shinichi Ito, Tatsuhiko Ema, Riichiro Takahashi
  • Publication number: 20050087217
    Abstract: There is disclosed a substrate treating method comprising supplying a treating solution onto a substrate, and continuously discharging a first cleaning solution to the substrate from a first discharge region disposed in a nozzle, while moving the nozzle and substrate with respect to each other in one direction, wherein a length of a direction crossing at right angles to the direction of the first discharge region is equal to or more than a maximum diameter or longest side of the substrate, the nozzle continuously spouts a first gas to the substrate from a first jet region, and the length of a direction crossing at right angles to the direction of the first jet region is equal to or more than the maximum diameter or longest side of the substrate.
    Type: Application
    Filed: November 16, 2004
    Publication date: April 28, 2005
    Inventors: Kei Hayasaki, Shinichi Ito, Tatsuhiko Ema, Riichiro Takahashi
  • Publication number: 20050058944
    Abstract: A manufacturing method of an alkaline solution, comprising dissolving a gaseous molecule having oxidizing properties or reducing properties in an aqueous alkaline solution.
    Type: Application
    Filed: April 15, 2004
    Publication date: March 17, 2005
    Applicant: KABUSHIKI KAISHA
    Inventors: Riichiro Takahashi, Kei Hayasaki, Tomoyuki Takeishi, Shinichi Ito
  • Patent number: 6842281
    Abstract: An ultraviolet microscope comprises an observation device which observes a specimen with ultraviolet light; a gas supply device which, during the observation with ultraviolet light, supplies an inert gas to surroundings of the specimen; and a timing control device which controls supply timing of the inert gas by the gas supply device, and the timing control device controls the gas supply device so as to cause preliminary supply of the inert gas before the observation of the specimen with ultraviolet light, and also so as to cause regular supply of the inert gas at least during the observation of the specimen with ultraviolet light.
    Type: Grant
    Filed: April 29, 2002
    Date of Patent: January 11, 2005
    Assignees: Nikon Corporation, Kabushiki Kaisha Toshiba
    Inventors: Atsushi Tsurumune, Jiro Mizuno, Shinichi Ito, Riichiro Takahashi, Tatsuhiko Ema
  • Patent number: 6818387
    Abstract: There is disclosed, as an aspect, a method of forming a pattern which comprising coating a photosensitive resist film on a surface of substrate, subjecting the photosensitive resist film to an exposure process, coating an oxidizing liquid having an oxidative effect on a surface of the photosensitive resist film that has been subjected to the exposure process to thereby perform a pretreatment wherein the surface of the resist film is caused to oxidize by the oxidizing liquid to form an oxide layer thereon, feeding a developing solution to the photosensitive resist film whose surface has been oxidized to thereby perform a development of the resist film, and feeding a rinsing solution to a surface of the substrate to wash the substrate.
    Type: Grant
    Filed: February 15, 2002
    Date of Patent: November 16, 2004
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Riichiro Takahashi, Kei Hayasaki, Shinichi Ito
  • Publication number: 20040159398
    Abstract: In this disclosure, air flow is formed above chemical liquid film and a move of the chemical liquid is generated by making the air flow into a contact with the surface of chemical liquid. Further, a negative pressure is generated in a space between a processing object substrate and a plate by rotating the plate. Consequently, uniformity of processing of chemical liquid is improved, so that liquid removing step can be carried out effectively. As a result, yield rate of chemical liquid treatment can be improved.
    Type: Application
    Filed: February 11, 2004
    Publication date: August 19, 2004
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Shinichi Ito, Riichiro Takahashi, Tatsuhiko Ema, Katsuya Okamura
  • Patent number: 6742944
    Abstract: A manufacturing method of an alkaline solution, comprising dissolving a gaseous molecule having oxidizing properties or reducing properties in an aqueous alkaline solution.
    Type: Grant
    Filed: May 14, 2002
    Date of Patent: June 1, 2004
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Riichiro Takahashi, Kei Hayasaki, Tomoyuki Takeishi, Shinichi Ito