Patents by Inventor Rimma Volodarsky
Rimma Volodarsky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7122473Abstract: The present invention provides at least one nozzle that sprays a rotating workpiece with an etchant at an edge thereof. The at least one nozzle is located in an upper chamber of a vertically configured processing subsystem that also includes mechanisms for plating, cleaning and drying in upper and lower chambers.Type: GrantFiled: August 16, 2004Date of Patent: October 17, 2006Assignee: ASM Nutool, Inc.Inventors: Jalal Ashjaee, Rimma Volodarsky, Cyprian E. Uzoh, Bulent M. Basol, Homayoun Talieh
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Patent number: 6969456Abstract: The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.Type: GrantFiled: December 28, 2001Date of Patent: November 29, 2005Assignee: ASM Nutool, Inc.Inventors: Konstantin Volodarsky, Boguslaw A. Nagorski, Rimma Volodarsky, Douglas W. Young, Cyprian Uzoh, Homayoun Talieh
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Patent number: 6884334Abstract: The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.Type: GrantFiled: December 28, 2001Date of Patent: April 26, 2005Assignee: ASM NuTool, Inc.Inventors: Konstantin Volodarsky, Boguslaw A. Nigorski, Rimma Volodarsky, Douglas W. Young, Cyprian Uzoh, Homayoun Talieh
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Publication number: 20050079713Abstract: The present invention provides at least one nozzle that sprays a rotating workpiece with an etchant at an edge thereof.Type: ApplicationFiled: August 16, 2004Publication date: April 14, 2005Inventors: Jalal Ashjaee, Rimma Volodarsky, Cyprian Uzoh, Bulent Basol, Homayoun Talieh
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Publication number: 20050040049Abstract: A particular anode assembly can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a semiconductor wafer. The anode assembly includes a rotatable shaft disposed within a chamber in which the operation is performed, an anode housing connected to the shaft, and a porous pad support plate attached to the anode housing. The support plate has a top surface adapted to support a pad which is to face the wafer, and, together with the anode housing, defines an anode cavity. A consumable anode may be provided in the anode cavity to provide plating material to the solution. A solution delivery structure by which the solution can be delivered to said anode cavity is also provided. The solution delivery structure may be contained within the chamber in which the operation is performed. A shield can also be mounted between the shaft and an associated spindle to prevent leakage of the solution from the chamber.Type: ApplicationFiled: August 10, 2004Publication date: February 24, 2005Inventors: Rimma Volodarsky, Konstantin Volodarsky, Cyprian Uzoh, Homayoun Talieh, Douglas Young
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Patent number: 6777338Abstract: The present invention provides at least one nozzle that sprays a rotating workpiece with an etchant at an edge thereof. The at least one nozzle is located in an upper chamber of a vertically configured processing subsystem that also includes mechanisms for plating, cleaning and drying in upper and lower chambers.Type: GrantFiled: January 15, 2002Date of Patent: August 17, 2004Assignee: Nutool, Inc.Inventors: Jalal Ashjaee, Rimma Volodarsky, Cyprian E. Uzoh, Bulent M. Basol, Homayoun Talieh
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Patent number: 6773576Abstract: A particular anode assembly can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a semiconductor wafer. The anode assembly includes a rotatable shaft disposed within a chamber in which the operation is performed, an anode housing connected to the shaft, and a porous pad support plate attached to the anode housing. The support plate has a top surface adapted to support a pad which is to face the wafer, and, together with the anode housing, defines an anode cavity. A consumable anode may be provided in the anode cavity to provide plating material to the solution. A solution delivery structure by which the solution can be delivered to said anode cavity is also provided. The solution delivery structure may be contained within the chamber in which the operation is performed. A shield can also be mounted between the shaft and an associated spindle to prevent leakage of the solution from the chamber.Type: GrantFiled: September 20, 2002Date of Patent: August 10, 2004Assignee: NuTool, Inc.Inventors: Rimma Volodarsky, Konstantin Volodarsky, Cyprian Uzoh, Homayoun Talieh, Douglas W. Young
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Publication number: 20040140287Abstract: A method of removing unwanted edge copper from an edge region of a wafer is provided. The method is applied subsequent to an electrochemical process to deposit a copper layer on a surface of a wafer. The edge region, which has the unwanted edge copper, includes a front edge surface, a back edge surface and a bevel. During the removal as the wafer is rotated, a stream of etchant solution from a front edge nozzle is delivered to the front edge surface of the wafer while another stream is delivered to the back edge surface from a back edge nozzle. Rotational motion of the wafer directs the etchant, which is delivered by the front and back edge nozzles, to the bevel and thereby causing removal of the unwanted copper from the edge region of the wafer.Type: ApplicationFiled: September 30, 2003Publication date: July 22, 2004Inventors: Jeffery Bogart, Rimma Volodarsky, Paul Lindquist, Bulent M. Basol
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Publication number: 20030015435Abstract: A particular anode assembly can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a semiconductor wafer. The anode assembly includes a rotatable shaft disposed within a chamber in which the operation is performed, an anode housing connected to the shaft, and a porous pad support plate attached to the anode housing. The support plate has a top surface adapted to support a pad which is to face the wafer, and, together with the anode housing, defines an anode cavity. A consumable anode may be provided in the anode cavity to provide plating material to the solution. A solution delivery structure by which the solution can be delivered to said anode cavity is also provided. The solution delivery structure may be contained within the chamber in which the operation is performed. A shield can also be mounted between the shaft and an associated spindle to prevent leakage of the solution from the chamber.Type: ApplicationFiled: September 20, 2002Publication date: January 23, 2003Inventors: Rimma Volodarsky, Konstantin Volodarsky, Cyprian Ozoh, Homayoun Talieh, Douglas W. Young
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Patent number: 6478936Abstract: A particular anode assembly can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a semiconductor wafer. The anode assembly includes a rotatable shaft disposed within a chamber in which the operation is performed, an anode housing connected to the shaft, and a porous pad support plate attached to the anode housing. The support plate has a top surface adapted to support a pad which is to face the wafer, and, together with the anode housing, defines an anode cavity. A consumable anode may be provided in the anode cavity to provide plating material to the solution. A solution delivery structure by which the solution can be delivered to said anode cavity is also provided. The solution delivery structure may be contained within the chamber in which the operation is performed. A shield can also be mounted between the shaft and an associated spindle to prevent leakage of the solution from the chamber.Type: GrantFiled: May 11, 2000Date of Patent: November 12, 2002Assignee: NuTool Inc.Inventors: Rimma Volodarsky, Konstantin Volodarsky, Cyprian Uzoh, Homayoun Talieh, Douglas W. Young
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Publication number: 20020155648Abstract: The present invention provides at least one nozzle that sprays a rotating workpiece with an etchant at an edge thereof.Type: ApplicationFiled: January 15, 2002Publication date: October 24, 2002Inventors: Jalal Ashjaee, Rimma Volodarsky, Cyprian E. Uzoh, Bulent M. Basol, Homayoun Talieh
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Publication number: 20020121435Abstract: The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.Type: ApplicationFiled: December 28, 2001Publication date: September 5, 2002Inventors: Konstantin Volodarsky, Boguslaw A. Nagorski, Rimma Volodarsky, Douglas W. Young, Cyprian Uzoh, Homayoun Talieh
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Publication number: 20020056646Abstract: The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.Type: ApplicationFiled: January 7, 2002Publication date: May 16, 2002Inventors: Konstantin Volodarsky, Boguslaw A. Nigorski, Rimma Volodarsky, Douglas W. Young, Cyprian Uzoh, Homayoun Talieh
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Patent number: 6352623Abstract: The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.Type: GrantFiled: December 17, 1999Date of Patent: March 5, 2002Assignee: Nutool, Inc.Inventors: Konstantin Volodarsky, Boguslaw A. Nagorski, Rimma Volodarsky, Douglas W. Young, Cyprian Uzoh, Homayoun Talieh