Patents by Inventor Risto Tuominen
Risto Tuominen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20160212855Abstract: Manufacturing method and circuit module, which comprises an insulator layer and, inside the insulator layer, at least one component, which comprises contact areas, the material of which contains a first metal. On the surface of the insulator layer are conductors, which comprise at least a first layer and a second layer, in such a way that at least the second layer contains a second metal. The circuit module comprises contact elements between the contact areas and the conductors for forming electrical contacts. The contact elements, for their part, comprise, on the surface of the material of the contact area, an intermediate layer, which contains a third metal, in such a way that the first, second, and third metals are different metals and the contact surface area (ACONT 1), between the intermediate layer and the contact area is less that the surface area (APAD) of the contact area.Type: ApplicationFiled: March 30, 2016Publication date: July 21, 2016Applicant: GE Embedded Electronics OyInventors: Petteri Palm, Risto Tuominen, Antti Iihola
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Publication number: 20160174387Abstract: The present invention concerns an electronic module with at least one component embedded in insulating material.Type: ApplicationFiled: December 15, 2014Publication date: June 16, 2016Inventor: Risto Tuominen
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Patent number: 9363898Abstract: This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component is glued to the surface of a conductive layer, from which conductive layer conductive patterns are later formed. After gluing the component, an insulating-material layer, which surrounds the component attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After the gluing of the component, feed-throughs are also made, through which electrical contacts can be made between the conductive layer and the contact zones of the component. After this, conductive patterns are made from the conductive layer, to the surface of which the component is glued.Type: GrantFiled: February 17, 2015Date of Patent: June 7, 2016Assignee: GE Embedded Electronics OyInventors: Risto Tuominen, Petteri Palm, Antti Iihola
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Patent number: 9324647Abstract: Manufacturing method and circuit module, which comprises an insulator layer and, inside the insulator layer, at least one component, which comprises contact areas, the material of which contains a first metal. On the surface of the insulator layer are conductors, which comprise at least a first layer and a second layer, in such a way that at least the second layer contains a second metal. The circuit module comprises contact elements between the contact areas and the conductors for forming electrical contacts. The contact elements, for their part, comprise, on the surface of the material of the contact area, an intermediate layer, which contains a third metal, in such a way that the first, second, and third metals are different metals and the contact surface area (ACONT 1), between the intermediate layer and the contact area is less that the surface area (APAD) of the contact area.Type: GrantFiled: August 10, 2015Date of Patent: April 26, 2016Assignee: GE Embedded Electronics OyInventors: Petteri Palm, Risto Tuominen, Antti Lihola
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Publication number: 20150348878Abstract: Manufacturing method and circuit module, which comprises an insulator layer and, inside the insulator layer, at least one component, which comprises contact areas, the material of which contains a first metal. On the surface of the insulator layer are conductors, which comprise at least a first layer and a second layer, in such a way that at least the second layer contains a second metal. The circuit module comprises contact elements between the contact areas and the conductors for forming electrical contacts. The contact elements, for their part, comprise, on the surface of the material of the contact area, an intermediate layer, which contains a third metal, in such a way that the first, second, and third metals are different metals and the contact surface area (ACONT 1), between the intermediate layer and the contact area is less that the surface area (APAD) of the contact area.Type: ApplicationFiled: August 10, 2015Publication date: December 3, 2015Applicant: GE Embedded Electronics OyInventors: Petteri Palm, Risto Tuominen, Antti Iihola
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Publication number: 20150289379Abstract: Method for the manufacture of a circuit board containing a component and circuit board containing a component. The invention is based on first manufacturing (101-102 or 101-103) an intermediate product, which contains the insulator layer of the circuit board and the components, which are set in place inside the insulator layer, in such a way that the contact elements of the components face the surface of the intermediate product. After this, the intermediate product is transferred to the circuit-board manufacturing line, on which a suitable number of conducting-pattern layers and, if necessary, insulator layers are manufactured (104) on one or both sides of the intermediate product, in such a way that, when manufacturing the first conducting-pattern layer, the conductor material forms an electrical contact with the contact elements of the components. Alternatively, stages (101-105) can also be performed on a single manufacturing line.Type: ApplicationFiled: March 18, 2015Publication date: October 8, 2015Applicant: GE Embedded Electronics OyInventors: Risto Tuominen, Petteri Palm, Antti Iihola
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Patent number: 9107324Abstract: Manufacturing method and circuit module, which comprises an insulator layer and, inside the insulator layer, at least one component, which comprises contact areas, the material of which contains a first metal. On the surface of the insulator layer are conductors, which comprise at least a first layer and a second layer, in such a way that at least the second layer contains a second metal. The circuit module comprises contact elements between the contact areas and the conductors for forming electrical contacts. The contact elements, for their part, comprise, on the surface of the material of the contact area, an intermediate layer, which contains a third metal, in such a way that the first, second, and third metals are different metals and the contact surface area (ACONT 1), between the intermediate layer and the contact area is less that the surface area (APAD) of the contact area.Type: GrantFiled: April 1, 2014Date of Patent: August 11, 2015Assignee: GE Embedded Electronics OyInventors: Petteri Palm, Risto Tuominen, Antti Iihola
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Publication number: 20150163966Abstract: An electronic module with EMI protection is disclosed. The electronic module comprises a component with contact terminals and conducting lines in a first wiring layer. There is also a dielectric between the component and the first wiring layer such that the component is embedded in the dielectric. Contact elements provide electrical connection between at least some of the contact terminals and at least some of the conducting lines. The electronic module also comprises a second wiring layer inside the dielectric. The second wiring layer comprises a conducting pattern that is at least partly located between the component and the first wiring layer and provides EMI protection between the component and the conducting lines.Type: ApplicationFiled: February 16, 2015Publication date: June 11, 2015Applicant: GE Embedded Electronics OyInventor: Risto Tuominen
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Publication number: 20150163920Abstract: This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component is glued to the surface of a conductive layer, from which conductive layer conductive patterns are later formed. After gluing the component, an insulating-material layer, which surrounds the component attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After the gluing of the component, feed-throughs are also made, through which electrical contacts can be made between the conductive layer and the contact zones of the component. After this, conductive patterns are made from the conductive layer, to the surface of which the component is glued.Type: ApplicationFiled: February 17, 2015Publication date: June 11, 2015Applicant: GE Embedded Electronics OyInventors: Risto Tuominen, Petteri Palm, Antti Iihola
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Patent number: 8984746Abstract: A method for the manufacture of a circuit board containing a component and circuit board containing a component. The invention is based on first manufacturing an intermediate product, which contains the insulator layer of the circuit board and the components, which are set in place inside the insulator layer in such a way that the contact elements of the components face the surface of the intermediate product. After this, the intermediate product is transferred to the circuit-board manufacturing line, on which a suitable number of conductor-pattern layers and, if necessary, insulator layers are manufactured on one or both sides of the intermediate product, in such a way that, when manufacturing the first conductor-pattern layer, the conductor material forms an electrical contact with the contact elements of the components. Alternatively, stages can also be performed on a single manufacturing line.Type: GrantFiled: March 15, 2007Date of Patent: March 24, 2015Assignee: GE Embedded Electronics OyInventors: Risto Tuominen, Petteri Palm, Antti Lihola
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Patent number: 8964409Abstract: An electronic module with EMI protection is disclosed. The electronic module comprises a component (1) with contact terminals (2) and conducting lines (4) in a first wiring layer (3). There is also a dielectric (5) between the component (1) and the first wiring layer (3) such that the component (1) is embedded in the dielectric (5). Contact elements (6) provide electrical connection between at least some of the contact terminals (2) and at least some of the conducting lines (4). The electronic module also comprises a second wiring layer (7) inside the dielectric (5). The second wiring layer (7) comprises a conducting pattern (8) that is at least partly located between the component (1) and the first wiring layer (3) and provides EMI protection between the component (1) and the conducting lines (4).Type: GrantFiled: February 5, 2010Date of Patent: February 24, 2015Assignee: GE Embedded Electronics OyInventor: Risto Tuominen
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Publication number: 20150043177Abstract: The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.Type: ApplicationFiled: August 25, 2014Publication date: February 12, 2015Inventors: Risto Tuominen, Petteri Palm
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Patent number: 8817485Abstract: A single-layer component package comprising: a single conductive-pattern layer having a first surface; an insulating-material layer on the first surface of the single conductive-pattern layer; in an installation cavity inside the insulating-material layer, a semiconductor component having flat contact zones; and solid contact pillars containing copper and solderlessly, metallurgically and electrically connecting the flat contact zones to the single conductive-pattern layer.Type: GrantFiled: October 21, 2009Date of Patent: August 26, 2014Assignee: GE Embedded Electronics OyInventors: Risto Tuominen, Petteri Palm
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Publication number: 20140208588Abstract: This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component is glued to the surface of a conductive layer, from which conductive layer conductive patterns are later formed. After gluing the component, an insulating-material layer, which surrounds the component attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After the gluing of the component, feed-throughs are also made, through which electrical contacts can be made between the conductive layer and the contact zones of the component. After this, conductive patterns are made from the conductive layer, to the surface of which the component is glued.Type: ApplicationFiled: March 31, 2014Publication date: July 31, 2014Applicant: GE EMBEDDED ELECTRONICS OYInventors: Risto Tuominen, Petteri Palm, Antti Iihola
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Publication number: 20140210090Abstract: Manufacturing method and circuit module, which comprises an insulator layer and, inside the insulator layer, at least one component, which comprises contact areas, the material of which contains a first metal. On the surface of the insulator layer are conductors, which comprise at least a first layer and a second layer, in such a way that at least the second layer contains a second metal. The circuit module comprises contact elements between the contact areas and the conductors for forming electrical contacts. The contact elements, for their part, comprise, on the surface of the material of the contact area, an intermediate layer, which contains a third metal, in such a way that the first, second, and third metals are different metals and the contact surface area (ACONT 1), between the intermediate layer and the contact area is less that the surface area (APAD) of the contact area.Type: ApplicationFiled: April 1, 2014Publication date: July 31, 2014Applicant: GE EMBEDDED ELECTRONICS OYInventors: Petteri Palm, Risto Tuominen, Antti Iihola
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Publication number: 20140131870Abstract: Manufacturing method and a multi-chip package, which comprises a conductor pattern and insulation, and, inside the insulation, a first component, the contact terminals of which face towards the conductor pattern and are conductively connected to the conductor pattern. The multi-chip package also comprises inside the insulation a second semiconductor chip, the contact terminals of which face towards the same conductor pattern and are conductively connected through contact elements to this conductor pattern. The semiconductor chips are located in such a way that the first semiconductor chip is located between the second semiconductor chip and the conductor pattern.Type: ApplicationFiled: January 23, 2014Publication date: May 15, 2014Applicant: GE Embedded Electronics OyInventors: Antti Iihola, Risto Tuominen
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Patent number: 8704359Abstract: This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component (6) is glued (5) to the surface of a conductive layer, from which conductive layer conductive patterns (14) are later formed. After gluing the component (6), an insulating-material layer (1), which surrounds the component (6) attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After the gluing of the component (6), feed-throughs are also made, through which electrical contacts can be made between the conductive layer and the contact zones (7) of the component. After this, conductive patterns (14) are made from the conductive layer, to the surface of which the component (6) is glued.Type: GrantFiled: May 31, 2011Date of Patent: April 22, 2014Assignee: GE Embedded Electronics OyInventors: Risto Tuominen, Petteri Palm, Antti Iihola
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Patent number: 8699233Abstract: Manufacturing method and circuit module, which comprises an insulator layer (1) and, inside the insulator layer (1), at least one component (6), which comprises contact areas (7), the material of which contains a first metal. On the surface of the insulator layer (1) are conductors (22), which comprise at least a first layer (12) and a second layer (32), in such a way that at least the second layer (32) contains a second metal. The circuit module comprises contact elements between the contact areas (7) and the conductors (22) for forming electrical contacts. The contact elements, for their part, comprise, on the surface of the material of the contact area (7), an intermediate layer (2), which contains a third metal, in such a way that the first, second, and third metals are different metals and the contact surface area (ACONT 1), between the intermediate layer (2) and the contact area (7) is less that the surface area (APAD) of the contact area (7).Type: GrantFiled: May 11, 2009Date of Patent: April 15, 2014Assignee: GE Embedded Electronics OyInventors: Petteri Palm, Risto Tuominen, Antti Iihola
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Publication number: 20140059851Abstract: The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil and a conductor pattern on the surface of the conductor foil. A component is attached to the conductor layer and the conductor layer is thinned, in such a way that the conductor material of the conductor layer is removed from outside the conductor pattern.Type: ApplicationFiled: November 11, 2013Publication date: March 6, 2014Applicant: IMBERA ELECTRONICS OYInventors: Risto Tuominen, Antti Lihola, Petteri Palm
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Patent number: 8659134Abstract: Manufacturing method and a multi-chip package, which comprises a conductor pattern (1) and insulation (2), and, inside the insulation, a first component (3), the contact terminals (4) of which face towards the conductor pattern (1) and are conductively connected to the conductor pattern (1). The multi-chip package also comprises inside the insulation (2) a second semiconductor chip (13), the contact terminals (14) of which face towards the same conductor pattern (1) and are conductively connected through contact elements (15) to this conductor pattern (1). The semiconductor chips are located in such a way that the first semiconductor chip (3) is located between the second semiconductor chip (13) and the conductor pattern (1).Type: GrantFiled: July 21, 2009Date of Patent: February 25, 2014Assignee: GE Embedded Electronics OyInventors: Antti Iihola, Risto Tuominen