Patents by Inventor Rizwan Fazil

Rizwan Fazil has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Warpage compensating RF shield frame
    Patent number: 11664328
    Abstract: An integrated circuit package shield comprising a frame comprising two or more segments, the segments to interlock with one another along a substrate and the segments comprising electrically conductive material to electrically couple to the substrate; and a lid to cover the frame, the lid comprising a conductive material to electrically couple to the substrate.
    Type: Grant
    Filed: September 28, 2021
    Date of Patent: May 30, 2023
    Assignee: Intel Corporation
    Inventor: Rizwan Fazil
  • WARPAGE COMPENSATING RF SHIELD FRAME
    Publication number: 20220013473
    Abstract: An integrated circuit package shield comprising a frame comprising two or more segments, the segments to interlock with one another along a substrate and the segments comprising electrically conductive material to electrically couple to the substrate; and a lid to cover the frame, the lid comprising a conductive material to electrically couple to the substrate.
    Type: Application
    Filed: September 28, 2021
    Publication date: January 13, 2022
    Applicant: Intel IP Corporation
    Inventor: Rizwan Fazil
  • Warpage compensating RF shield frame
    Patent number: 11158585
    Abstract: An integrated circuit package shield comprising a frame comprising two or more segments, the segments to interlock with one another along a substrate and the segments comprising electrically conductive material to electrically couple to the substrate; and a lid to cover the frame, the lid comprising a conductive material to electrically couple to the substrate.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: October 26, 2021
    Assignee: Intel IP Corporation
    Inventor: Rizwan Fazil
  • WARPAGE COMPENSATING RF SHIELD FRAME
    Publication number: 20210320071
    Abstract: An integrated circuit package shield comprising a frame comprising two or more segments, the segments to interlock with one another along a substrate and the segments comprising electrically conductive material to electrically couple to the substrate; and a lid to cover the frame, the lid comprising a conductive material to electrically couple to the substrate.
    Type: Application
    Filed: March 27, 2018
    Publication date: October 14, 2021
    Applicant: Intel IP Corporation
    Inventor: Rizwan Fazil