Abstract: An example system for reducing power loss in telecommunications cabling is provided. The system includes a power supply, at least one powered device, and a cabling system electrically and communicatively connecting the power supply to the at least one powered device. The cabling system includes a first positive polarity wire pair and a first negative polarity wire pair. The system includes a corrective circuit module connected to the cabling system. The corrective circuit module includes a second positive polarity wire pair, a second negative polarity wire pair, wiring connecting the first positive polarity wire pair with the second positive polarity wire pair, and wiring connecting the first negative polarity wire pair with the second negative polarity wire pair.

Abstract: Exemplary embodiments are directed to electrical plug assemblies that generally include a plug housing that defines an internal cavity. The electrical plug assemblies generally include a printed circuit board disposed within the internal cavity of the plug housing. The printed circuit board defines a front face and a bottom face. The electrical plug assemblies generally include a plurality of conductive contacts. Each of the plurality of conductive contacts is generally secured relative to the printed circuit board and extends from the bottom face to the front face of the printed circuit board. Exemplary embodiments are also directed to methods of fabricating electrical plug assemblies and electrical plug systems.

Abstract: Exemplary embodiments are directed to modular connector assemblies that generally include a connector and an attachment unit. The connector includes a connector housing, the connector housing including a first coupler element. The attachment unit includes an attachment unit housing, the attachment unit housing including a second coupler element. The first coupler element can be configured and dimensioned to interlock with the second coupler element for movably securing the connector to the attachment unit. Exemplary embodiments are also directed to methods and systems for modular connector assemblies.

Abstract: Exemplary embodiments are directed to modular connector assemblies that generally include a connector and an attachment unit. The connector includes a connector housing, the connector housing including a first coupler element. The attachment unit includes an attachment unit housing, the attachment unit housing including a second coupler element. The first coupler element can be configured and dimensioned to interlock with the second coupler element for movably securing the connector to the attachment unit. Exemplary embodiments are also directed to methods and systems for modular connector assemblies.

Abstract: Exemplary embodiments are directed to electrical plug assemblies that generally include a plug housing that defines an internal cavity. The electrical plug assemblies generally include a printed circuit board disposed within the internal cavity of the plug housing. The printed circuit board defines a front face and a bottom face. The electrical plug assemblies generally include a plurality of conductive contacts. Each of the plurality of conductive contacts is generally secured relative to the printed circuit board and extends from the bottom face to the front face of the printed circuit board. Exemplary embodiments are also directed to methods of fabricating electrical plug assemblies and electrical plug systems.

Abstract: Compensation schemes for a modular jack are provided according to the present disclosure. The compensation schemes advantageously include a first coupling of compensating crosstalk between a first pair of conductors and a second pair of conductors and a second coupling of compensating crosstalk between only a first conductor of the first pair of conductors and only a first conductor of the second pair of conductors, wherein the first and second couplings of compensating crosstalk are of opposite polarities. In exemplary embodiments, the first coupling of compensating crosstalk may be provided by a circuit board, such as a flexible circuit board including a plurality of interconnection elements, e.g., capacitors, for providing the first coupling of compensating crosstalk. Alternatively, the first coupling of compensating crosstalk may be provided by a plurality of plug interface contacts associated with the first and second pairs of conductors.

Abstract: Methods are provided for reducing port to port crosstalk on a multiport assembly. Steps of the method include placing at least one BEMI in at least one compensation region, disposed on a PCB. The BEMI reduces port to port crosstalk noise by generating an opposite polarity signal to an unwanted noise signal generated through port to port adjacency. The PCB includes a plurality of ports, at least including adjacent first and second ports, each of which is an RJ45 jack port. Each port of the plurality of ports includes a plurality of modular insert pins, and is associated with an IDC pin group. The at least one compensation region includes one or more regions for generating noise compensation with respect to crosstalk noise resulting from coupling between respective modular insert pins of, or IDC pins associated with, the first and second ports, respectfully.

Abstract: Compensation schemes for a modular jack are provided according to the present disclosure. The compensation schemes advantageously include a first coupling of compensating crosstalk between a first pair of conductors and a second pair of conductors and a second coupling of compensating crosstalk between only a first conductor of the first pair of conductors and only a first conductor of the second pair of conductors, wherein the first and second couplings of compensating crosstalk are of opposite polarities. In exemplary embodiments, the first coupling of compensating crosstalk may be provided by a circuit board, such as a flexible circuit board including a plurality of interconnection elements, e.g., capacitors, for providing the first coupling of compensating crosstalk. Alternatively, the first coupling of compensating crosstalk may be provided by a plurality of plug interface contacts associated with the first and second pairs of conductors.

Abstract: A method is provided for automatically accommodating plugs having different contract layouts. Steps of the method include providing a jack assembly supporting a plurality of contacts accessible to a plug-receiving space, the plurality of contacts including eight contacts in side-by-side relation and two additional contact pairs positioned in opposed corners of the plug-receiving space, four central contacts of the eight side-by-side contacts defining bi-sectional members, and at least one capacitive element being provided in electrical communication with front end portions of at least two of the bi-sectional members. Noise generated through insertion of a plug into the plug-receiving space is automatically compensated for, whether the plug is an RJ-45 plug configured to interact with the eight contacts in side-by-side relation, or an IEC 60603-7-7 compliant plug configured to interact with at least the two additional contact pairs positioned in opposed corners.

Abstract: An insert device for use in a communication jack includes a housing, and plug interface contacts mounted with respect to the housing. At least one plug interface contact includes a first length extent extending along a first axial path and defining a first reaction surface that includes a first electrically conductive surface. The insert device includes a reactance unit having a reactance circuit operable to reduce or compensate for an electrical noise associated with signals conducted by the plug interface contacts, and a plurality of interconnection elements. At least one interconnection element defines a second reaction surface that includes a second electrically conductive surface. The insert device moves the reactance circuit relative to the plug interface contact by sliding the second reaction surface across the first reaction surface, and presses the second electrically conductive surface against the first electrically conductive surface.

Abstract: Methods are provided for reducing port to port crosstalk on a multiport assembly. Steps of the method include placing at least one BEMI in at least one compensation region, disposed on a PCB. The BEMI reduces port to port crosstalk noise by generating an opposite polarity signal to an unwanted noise signal generated through port to port adjacency. The PCB includes a plurality of ports, at least including adjacent first and second ports, each of which is an RJ45 jack port. Each port of the plurality of ports includes a plurality of modular insert pins, and is associated with an IDC pin group. The at least one compensation region includes one or more regions for generating noise compensation with respect to crosstalk noise resulting from coupling between respective modular insert pins of, or IDC pins associated with, the first and second ports, respectfully.

Abstract: A method is provided for automatically accommodating plugs having different contract layouts. Steps of the method include providing a jack assembly supporting a plurality of contacts accessible to a plug-receiving space, the plurality of contacts including eight contacts in side-by-side relation and two additional contact pairs positioned in opposed corners of the plug-receiving space, four central contacts of the eight side-by-side contacts defining bi-sectional members, and at least one capacitive element being provided in electrical communication with front end portions of at least two of the bi-sectional members. Noise generated through insertion of a plug into the plug-receiving space is automatically compensated for, whether the plug is an RJ-45 plug configured to interact with the eight contacts in side-by-side relation, or an IEC 60603-7-7 compliant plug configured to interact with at least the two additional contact pairs positioned in opposed corners.

Abstract: The present disclosure is directed to systems and methods for a multiport connector assembly, used in telecommunication systems, that is designed to reduce electrical port to port crosstalk noise. The assembly is adapted to reduce noise from adjacent ports by placing balancing isolators and capacitor radiators in noise reducing regions of a printed circuit board. The signals are radiated in properly selected areas to rebalance the noise generated from adjacent transmission ports. By rebalancing noise inherently coupled by adjacency of transmitters, the port to port near-end crosstalk and far-end crosstalk noise is substantially reduced.

Abstract: Systems and methods are disclosed for interfacing with high frequency data transfer media and, more particularly, modular jack housing insert assemblies, such as those that are used as interface connectors for unshielded twisted pair (“UTP”) media, that compensate for electrical noise. The insert generally includes (a) an insert housing member and (b) a plurality of lead frames supported at least in part by said insert housing member. Each of the lead frames generally includes a rear end portion and a front end portion. In addition, each of at least four of the plurality of lead frames typically includes a capacitive element in electrical communication with at least the front end portion of the respective lead frame. The four lead frames are in electrical communication with capacitive elements arranged in two pairs to define a first pair of capacitive element lead frames and a second pair of capacitive element lead frames.

Abstract: The present disclosure is related to a modular insert and associated jack assembly used in telecommunication connector systems that reduces the adjacent lines electro magnetic interference from an adjacent transmitter for different plug assemblies. The internal contacts/lead frames feature a bi-sectional design. Internal EMI line reduction is allowed only when the bi-sectional contacts are electrically mated by a plug with corresponding contact layout. By isolating the contact sections in the interface system, the coupled signal for EMI balance is optionally utilized in a low cost and manufacturable design.

Abstract: Systems and methods are disclosed for interfacing with high frequency data transfer media and, more particularly, modular jack housing insert assemblies, such as those that are used as interface connectors for unshielded twisted pair (“UTP”) media, that compensate for electrical noise. The insert generally includes (a) an insert housing member and (b) a plurality of lead frames supported at least in part by said insert housing member. Each of the lead frames generally includes a rear end portion and a front end portion. In addition, each of at least four of the plurality of lead frames typically includes a capacitive element in electrical communication with at least the front end portion of the respective lead frame. The four lead frames are in electrical communication with capacitive elements arranged in two pairs to define a first pair of capacitive element lead frames and a second pair of capacitive element lead frames.

Abstract: The present disclosure is related to a modular insert and associated jack assembly used in telecommunication connector systems that reduces the adjacent lines electro magnetic interference from an adjacent transmitter for different plug assemblies. The internal contacts/lead frames feature a bi-sectional design. Internal EMI line reduction is allowed only when the bi-sectional contacts are electrically mated by a plug with corresponding contact layout. By isolating the contact sections in the interface system, the coupled signal for EMI balance is optionally utilized in a low cost and manufacturable design.

Abstract: The present disclosure is directed to systems and methods for a multiport connector assembly, used in telecommunication systems, that is designed to reduce electrical port to port crosstalk noise. The assembly is adapted to reduce noise from adjacent ports by placing balancing isolators and capacitor radiators in noise reducing regions of a printed circuit board. The signals are radiated in properly selected areas to rebalance the noise generated from adjacent transmission ports. By rebalancing noise inherently coupled by adjacency of transmitters, the port to port near-end crosstalk and far-end crosstalk noise is substantially reduced.

Abstract: The present disclosure relates to a multiport connector assembly for a telecommunication connector system that is designed to reduce crosstalk noise between adjacent ports by electrical isolation design. The reduction of noise is done by non-conventional methods of connecting hardware shielding techniques. The shield design consists of enclosing alternating modular inserts of a port with a metalized modular housing to reduce the transmitted signals electromagnetic radiation during transmission. Each port within the multiport assembly will typically have a single PCB, a corresponding IDC pin group and a modular insert. The PCB's are typically arranged in a staggered formation within a front housing.

Abstract: An apparatus/system for use in coupling power from a power supply to a device over a network transmission medium is provided. The coupling apparatus/system generally includes one or more common mode chokes that feature a first winding and a second winding, the first winding being electrically connected between the first terminal of the power supply and the first electrical conductor of the network transmission medium, and the second winding being coupled between the first terminal of the power supply and the first electrical conductor of the network transmission medium. The common mode choke generally includes at least one core for coupling the first and second windings of the one or more common mode chokes. An RJ45 to 110 IDC modular connector may be connected to a printed circuit board used to transfer high speed signals for telecommunication interface media connections. The printed circuit board is configured to help reduce near-end crosstalk (NEXT) without compromising impedance.