Abstract: A new method provides test equipment having a humidification capability. Such method includes the steps of fabricating equipment having (a) a chamber for stress-testing products placed therein, and (b) a cavity for receiving a module. The equipment is installed in a product test facility and used for stress-testing (by, e.g., "temperature cycling") a first group of products placed in the chamber. Later (perhaps several months or years later), the module is mounted in the cavity, a second group of products is placed in the chamber and humidity-controlled air is circulated across the second group of products. The new method is particularly useful for manufacturers or testers of products like electronic printed circuit boards initially requiring only a temperature-related testing capability but later needing to add humidity-related testing regimens.

Abstract: An apparatus for testing circuit boards, the apparatus comprising a plurality of hand manipulable baskets adapted to contain a plurality of generally planar circuit boards. Each of the baskets includes a plurality of first electrical connectors adapted to engage electrical connectors on the circuit boards, and a second electrical connector electrically connected with each of the first electrical connectors. Air can flow freely through the baskets and over the circuit boards supported therein. The apparatus further comprises a test chamber for enclosing the baskets and including an electrical connector electrically connectable with the second electrical connectors on the baskets, and walls within the test chamber cooperating with the baskets to define an air plenum directing air flow through the baskets and over the circuit boards supported therein.