Abstract: A radio frequency (RF) cavity resonator having a resonator chamber and one or more RF coupling loop assemblies is presented. The RF coupling loop assembly has a connector with a first connector interface coupled to an inner conductor and a second connector interface coupled to an outer conductor, the first and second connector interfaces forming a pair when mated, the second connector interface rotatable about a collinear axis of the connector and the first connector interface not rotatable about the collinear axis of the connector; a wire loop coupler; and a bandwidth selection element at least partially coupled to the coupling loop assembly. In response to changing the bandwidth selection setting while the RF cavity resonator is operational, the wire loop changes orientation about the collinear axis of the connector and causes the RF resonator chamber to output an RF carrier signal having a bandwidth of the new bandwidth setting.

Abstract: A radio frequency (RF) cavity resonator having a resonator chamber and one or more RF coupling loop assemblies is presented. The RF coupling loop assembly has a connector with a first connector interface coupled to an inner conductor and a second connector interface coupled to an outer conductor, the first and second connector interfaces forming a pair when mated, the second connector interface rotatable about a collinear axis of the connector and the first connector interface not rotatable about the collinear axis of the connector; a wire loop coupler; and a bandwidth selection element at least partially coupled to the coupling loop assembly. In response to changing the bandwidth selection setting while the RF cavity resonator is operational, the wire loop changes orientation about the collinear axis of the connector and causes the RF resonator chamber to output an RF carrier signal having a bandwidth of the new bandwidth setting.

Abstract: An RF cavity resonator that includes: a resonator chamber for containing an RF field; an RF coupling element coupled to the resonator chamber for introducing the RF field into and extracting the RF field from the resonator chamber; a tuning assembly for causing the RF field to resonate at a desired frequency, wherein at least a portion of the tuning assembly is coupled within the resonator chamber; and a heat transport element included in the tuning assembly for transporting heat from the RF cavity resonator, the heat transport element comprising a phase change material, a housing for enclosing the phase change material, means for circulating the phase change material within the housing, and an electrically conductive surface for isolating the phase change material from the RF field, wherein the phase change material undergoes a phase change during circulation within the housing.

Abstract: An RF cavity resonator (400) that includes: a resonator chamber (410) for containing an RF field; an RF coupling element (450, 452) coupled to the resonator chamber for introducing the RF field into and extracting the RF field from the resonator chamber; a tuning assembly (420) for causing the RF field to resonate at a desired frequency, wherein at least a portion of the tuning assembly is coupled within the resonator chamber; and a heat transport element (440) for transporting heat from the RF cavity resonator, wherein at least a portion of the heat transport element is coupled within the resonator chamber, the heat transport element including a phase change material, a housing for enclosing the phase change material, means for circulating the phase change material within the housing, and an electrically conductive surface for isolating the phase change material from the RF field.

Abstract: An electronic control module 100 is provided wherein a power device 102 is secured to a rigidizer, or heat spreader, 110 such that a thermally conductive path is created for a conduction of heat from the power device to the rigidizer. A thermally conductive and electrically insulated interface 208, preferably anodized aluminum, is disposed between device 102 and rigidizer 110 and is solder bonded to each of the device and the rigidizer, facilitating the creation of a thermal path from the device to the rigidizer. In order to solder bond the device to the interface and the interface to the rigidizer, solderable coatings 206, 210, 214 are respectively applied to the surfaces 207 and 209 of the interface and surface 215 of the rigidizer.