Patents by Inventor Robert Babula

Robert Babula has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Vertical removal of excess solder from a circuit substrate
    Patent number: 7353983
    Abstract: A method for vertical removal of excess solder from a circuit substrate includes the use of a sacrificial circuit substrate with a plurality of pads and vias that are solder-wettable. The pads and vias of the sacrificial circuit substrate are placed in vertical proximity to the excess solder of the circuit substrate. The excess solder is heated until it is liquid, wherein the excess solder is wicked vertically onto the pads and into the vias of the sacrificial circuit substrate. Thereafter, the sacrificial circuit substrate is lifted from the proximity of the circuit substrate while the solder is in a liquid, taking the excess solder with it but leaving a predetermined amount on the circuit substrate.
    Type: Grant
    Filed: October 28, 2003
    Date of Patent: April 8, 2008
    Assignee: Temic Automotive of North America, Inc.
    Inventors: William C. Weigler, Robert Babula, James E. Herbold, Thomas P. Gall, Steven G. Sharkey
  • Vertical removal of excess solder from a circuit substrate
    Publication number: 20050087588
    Abstract: A method for vertical removal of excess solder from a circuit substrate includes the use of a sacrificial circuit substrate with a plurality of pads and vias that are solder-wettable. The pads and vias of the sacrificial circuit substrate are placed in vertical proximity to the excess solder of the circuit substrate. The excess solder is heated until it is liquid, wherein the excess solder is wicked vertically onto the pads and into the vias of the sacrificial circuit substrate. Thereafter, the sacrificial circuit substrate is lifted from the proximity of the circuit substrate while the solder is in a liquid, taking the excess solder with it but leaving a predetermined amount on the circuit substrate.
    Type: Application
    Filed: October 28, 2003
    Publication date: April 28, 2005
    Inventors: William Weigler, Robert Babula, James Herbold, Thomas Gall, Steven Sharkey