Patents by Inventor Robert Bassman

Robert Bassman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8972620
    Abstract: Systems and methods to simplify population of modular components in an information handling system are disclosed. A method of populating modular components in an information handling system comprises a first step of initializing a populating sequence. A first socket corresponding to a first modular component is then identified. The first socket is flagged if it does not contain the first modular component. The first modular component is then installed in the first socket which is flagged.
    Type: Grant
    Filed: July 2, 2010
    Date of Patent: March 3, 2015
    Assignee: Dell Products L.P.
    Inventors: Stephen Billick, Robert Bassman
  • Publication number: 20120001763
    Abstract: Systems and methods to simplify population of modular components in an information handling system are disclosed. A method of populating modular components in an information handling system comprises a first step of initializing a populating sequence. A first socket corresponding to a first modular component is then identified. The first socket is flagged if it does not contain the first modular component. The first modular component is then installed in the first socket which is flagged.
    Type: Application
    Filed: July 2, 2010
    Publication date: January 5, 2012
    Inventors: Stephen Billick, Robert Bassman
  • Patent number: 6978333
    Abstract: A method and system are provided for reducing impedance discontinuities which occur when two expansion connectors are located very close to one another on a bus in an information handling system. An interconnect is situated between the two expansion connectors and exhibits an impedance which is selected to be sufficiently low to compensate for the amount by which the impedance of the expansion bus connectors exceeds the impedance of the expansion bus connected thereto.
    Type: Grant
    Filed: February 1, 2005
    Date of Patent: December 20, 2005
    Assignee: Dell Products L.P.
    Inventors: Ian Timmins, Michael Leins, Stuart Hayes, Robert Bassman
  • Publication number: 20050130501
    Abstract: A method and system are provided for reducing impedance discontinuities which occur when two expansion connectors are located very close to one another on a bus in an information handling system. An interconnect is situated between the two expansion connectors and exhibits an impedance which is selected to be sufficiently low to compensate for the amount by which the impedance of the expansion bus connectors exceeds the impedance of the expansion bus connected thereto.
    Type: Application
    Filed: February 1, 2005
    Publication date: June 16, 2005
    Applicant: Dell Products L.P.
    Inventors: Ian Timmins, Michael Leins, Stuart Hayes, Robert Bassman
  • Patent number: 6868467
    Abstract: A method and apparatus are provided for reducing impedance discontinuities which occur when two expansion connectors are located very close to one another on a bus in an information handling system. An interconnect is situated between the two expansion connectors and exhibits an impedance which is selected to be sufficiently low to compensate for the amount by which the impedance of the expansion bus connectors exceeds the impedance of the expansion bus connected thereto.
    Type: Grant
    Filed: July 3, 2003
    Date of Patent: March 15, 2005
    Assignee: Dell Products L.P.
    Inventors: Ian Timmins, Michael Leins, Stuart Hayes, Robert Bassman
  • Publication number: 20050001649
    Abstract: A method and apparatus are provided for reducing impedance discontinuities which occur when two expansion connectors are located very close to one another on a bus in an information handling system. An interconnect is situated between the two expansion connectors and exhibits an impedance which is selected to be sufficiently low to compensate for the amount by which the impedance of the expansion bus connectors exceeds the impedance of the expansion bus connected thereto.
    Type: Application
    Filed: July 3, 2003
    Publication date: January 6, 2005
    Applicant: Dell Products L.P.
    Inventors: Ian Timmins, Michael Leins, Stuart Hayes, Robert Bassman
  • Patent number: 6131131
    Abstract: A conventional keyboard-style ACPI interface is greatly enhanced by the inclusion of a bi-directional hardware buffer and a special software protocol that allows multiple byte command and data messages to be sent in a burst fashion. The illustrative enhanced ACPI interface alleviates congestion in data transmission that results from the overhead incurred by transferring messages using multiple interrupts per message. An extended embedded controller includes a buffer for temporary storage of a plurality of data bytes and a program code for controlling data transfers to and from the buffer using a data handling technique that is ACPI-compliant.
    Type: Grant
    Filed: January 22, 1998
    Date of Patent: October 10, 2000
    Assignee: Dell U.S.A., L.P.
    Inventors: Robert Bassman, Anil Rao