Patents by Inventor Robert Charles Camilletti

Robert Charles Camilletti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090130463
    Abstract: Coated substrates comprising an inorganic barrier coating and an interfacial coating, wherein the interfacial coating comprises a cured product of a silicone resin having silicon-bonded radiation-sensitive groups; and methods of preparing the coated substrates.
    Type: Application
    Filed: September 18, 2006
    Publication date: May 21, 2009
    Inventors: John Dean Albaugh, Masaaki Amako, Robert Charles Camilletti, Dong Choi, William Weidner, Ludmil Zambov
  • Patent number: 6144106
    Abstract: The instant invention pertains to a multi-layer tamper proof electronic coating wherein the first layer is a protecting layer produced from a preceramic silicon containing material and at least one filler. The second layer is a resin sealer coat produced from a sealer resin selected from the group consisting of colloidal inorganic-based siloxane resins, benzocyclobutene based resins, polyimide polymers, siloxane polyimides and parylenes. An optional third layer is a cap coating layer selected from SiO.sub.2 coating, SiO.sub.2 /ceramic oxide coating, silicon containing coatings, silicon carbon containing coatings, silicon nitrogen containing coatings, silicon oxygen nitrogen coatings, silicon nitrogen carbon containing coatings and/or diamond like coatings.
    Type: Grant
    Filed: September 29, 1997
    Date of Patent: November 7, 2000
    Assignee: Dow Corning Corporation
    Inventors: Clayton R. Bearinger, Robert Charles Camilletti, Loren Andrew Haluska, Keith Winton Michael
  • Patent number: 5916944
    Abstract: Disclosed is a method of forming tamper-proof coatings on electronic devices. The method comprises applying a coating of a silica precursor resin and a filler onto the electronic device, wherein the filler is one which reacts in an oxidizing atmosphere to liberate enough heat to damage the electronic device. The coated electronic device is then heated at a temperature sufficient to convert the silica precursor resin to a silica containing ceramic matrix.
    Type: Grant
    Filed: September 29, 1997
    Date of Patent: June 29, 1999
    Assignee: Dow Corning Corporation
    Inventors: Robert Charles Camilletti, Loren Andrew Haluska, Keith Winton Michael
  • Patent number: 5904791
    Abstract: A method of adhering an electronic component to substrate in which a layer of a preceramic polymer is applied between the electronic component and the substrate to which it is to be adhered followed by heating to convert the preceramic polymer into a ceramic. The method forms a strong bond which is not affected by the environment. The method is valuable for adhering integrated circuit chips to carriers or circuit boards.
    Type: Grant
    Filed: June 2, 1997
    Date of Patent: May 18, 1999
    Assignee: Dow Corning Corporation
    Inventors: Clayton R. Bearinger, Robert Charles Camilletti, Grish Chandra, Theresa Eileen Gentle, Loren Andrew Haluska
  • Patent number: 5863595
    Abstract: This invention pertains to a method of forming a coating on an electronic substrate and to the electronic substrates coated thereby. The method comprises applying on the electronic substrate a coating composition comprising an aqueous alkanol dispersion of colloidal silica and partial condensate of RSi(OH).sub.3 where R is selected from the group consisting of an alkyl radical having from 1 to 3 carbon atoms, the vinyl radical, the 3,3,3-trifluoropropyl radical, the gamma-glycidoxypropyl radical and the gamma-methacryloxypropyl radical with the provision that at least 70% of the R radicals are methyl, and thereafter ceramifying the coating by heating at a temperature of about 200.degree. C. to 1000.degree. C. The use of the coating composition comprising an aqueous alkanol dispersion of colloidal silica and partial condensate of RSi(OH).sub.3 allows for the formation of thick planarizing coatings on the electronic substrate.
    Type: Grant
    Filed: January 10, 1997
    Date of Patent: January 26, 1999
    Assignee: Dow Corning Corporation
    Inventors: Robert Charles Camilletti, Diana Kay Deese, Loren Andrew Haluska, Mark Jon Loboda, Keith Winton Michael
  • Patent number: 5807611
    Abstract: The present invention relates to a ceramic coating composition comprising a preceramic material such as silicon oxide precursors, silicon carbonitride precursors, silicon carbide precursors, and silicon nitride precursors and a flux material such as B.sub.2 O.sub.3, PbO.sub.2, P.sub.2 O.sub.5, and Bi.sub.2 O.sub.3. The present invention also relates to a substrate such as an electronic device having said coating applied and ceramified thereon.
    Type: Grant
    Filed: October 4, 1996
    Date of Patent: September 15, 1998
    Assignee: Dow Corning Corporation
    Inventors: Clayton R. Bearinger, Robert Charles Camilletti, Loren Andrew Haluska, Keith Winton Michael
  • Patent number: 5780163
    Abstract: A method of forming a protective covering on an electronic or microelectronic device to prevent inspection. A first silica-containing ceramic layer is applied to the surface of the device to planarize its surface. A second silicon carbide coating layer is applied to the surface of the first silica-containing ceramic layer to form a hermetic barrier. A third porous silica-containing ceramic layer is formed on the surface of the second silicon carbide coating layer. The third porous silica-containing ceramic layer is impregnated with an opaque material or filler. A fourth metal layer or metal pattern is applied over the third opaque porous silica-containing ceramic layer. The fourth metal layer or pattern is then coated with a fifth layer similar to the third opaque porous silica-containing ceramic layer.
    Type: Grant
    Filed: June 5, 1996
    Date of Patent: July 14, 1998
    Assignee: Dow Corning Corporation
    Inventors: Robert Charles Camilletti, Loren Andrew Haluska, Keith Winton Michael
  • Patent number: 5776235
    Abstract: Thick opaque ceramic coatings are used to protect delicate microelectronic devices against excited energy sources, radiation, light, abrasion, and wet etching techniques. The thick opaque ceramic coating are prepared from a mixture containing phosphoric anhydride, i.e., phosphorous pentoxide (P.sub.2 O.sub.5), and a pre-ceramic silicon-containing material. It is preferred to also include tungsten carbide (WC) and tungsten metal (W) in the coating mixture. The coating is pyrolyzed to form a ceramic SiO.sub.2 containing coating. A second coating of plasma enhanced chemical vapor deposited (PECVD) silicon carbide (SiC), diamond, or silicon nitride (Si.sub.3 N.sub.4), can be applied over the thick opaque ceramic coating to provide hermeticity. These coatings are useful on patterned wafers, electronic devices, and electronic substrates. The thick opaque ceramic coating is unique because it is resistant to etching using wet chemicals, i.e., acids such as H.sub.3 PO.sub.4 and H.sub.2 SO.sub.4, or bases.
    Type: Grant
    Filed: October 4, 1996
    Date of Patent: July 7, 1998
    Assignee: Dow Corning Corporation
    Inventors: Robert Charles Camilletti, Loren Andrew Haluska, Keith Winton Michael
  • Patent number: 5753374
    Abstract: A method for forming a cap on an electronic device to prevent inspection. First, a silica-containing ceramic is applied to the surface the electronic device to planarize the surface. Next, a silicon carbide coating is applied to the surface of the silica containing ceramic to form a hermetic barrier. A layer of porous silica-containing ceramic is then formed on the surface of the silicon carbide coating. Finally, the porous silica-containing ceramic is impregnated with an opaque material.
    Type: Grant
    Filed: November 27, 1995
    Date of Patent: May 19, 1998
    Assignee: Dow Corning Corporation
    Inventors: Robert Charles Camilletti, Loren Andrew Haluska, Keith Winton Michael
  • Patent number: 5744244
    Abstract: Disclosed is a method of forming tamper-proof coatings on electronic devices. The method comprises applying a coating of a silica precursor resin and an inorganic salt onto the electronic device, wherein the inorganic salt is one which reacts with a wet etch to yield an acid or base that damages the electronic device. The coated electronic device is then heated at a temperature sufficient to convert the silica precursor resin to a silica containing ceramic matrix.
    Type: Grant
    Filed: June 19, 1997
    Date of Patent: April 28, 1998
    Assignee: Dow Corning Corporation
    Inventors: Robert Charles Camilletti, Loren Andrew Haluska, Keith Winton Michael
  • Patent number: 5730792
    Abstract: Thick opaque ceramic coatings are used to protect delicate microelectronic devices against excited energy sources, radiation, light, abrasion, and wet etching techniques. The thick opaque ceramic coating are prepared from a mixture containing tungsten carbide (WC), tungsten metal (W), and phosphoric anhydride, i.e., phosphorous pentoxide (P.sub.2 O.sub.5), carried in an aqueous alkanol dispersion of colloidal silica and partial condensate of methylsilanetriol. The coating is pyrolyzed to form a ceramic SiO.sub.2 containing coating. A second coating of plasma enhanced chemical vapor deposited (PECVD) silicon carbide (SiC), diamond, or silicon nitride (Si.sub.3 N.sub.4), can be applied over the thick opaque ceramic coating to provide hermeticity. These coatings are useful on patterned wafers, electronic devices, and electronic substrates. The thick opaque ceramic coating is unique because the methyl silsesquioxane resin is resistant to etching using wet chemicals, i.e., acids such as H.sub.3 PO.sub.4 and H.sub.
    Type: Grant
    Filed: October 4, 1996
    Date of Patent: March 24, 1998
    Assignee: Dow Corning Corporation
    Inventors: Robert Charles Camilletti, Loren Andrew Haluska, Keith Winton Michael
  • Patent number: 5710203
    Abstract: Disclosed are compositions which can be used to form tamper-proof coatings on electronic devices. These compositions contain a silica precursor resin and a filler which reacts in an oxidizing atmosphere to liberate heat. Such compositions form coatings which, when oxidized by techniques such as plasma etching, wet etching, or cross-sectioning, liberate heat which causes destruction of the underlying substrate and, thus, inhibits further examination.
    Type: Grant
    Filed: November 7, 1994
    Date of Patent: January 20, 1998
    Assignee: Dow Corning Corporation
    Inventors: Robert Charles Camilletti, Loren Andrew Haluska, Keith Winton Michael
  • Patent number: 5693701
    Abstract: Disclosed is a method of forming tamper-proof coatings on electronic devices. The method comprises applying a coating of a silica precursor resin and an inorganic salt onto the electronic device, wherein the inorganic salt is one which reacts with a wet etch to yield an acid or base that damages the electronic device. The coated electronic device is then heated at a temperature sufficient to convert the silica precursor resin to a silica containing ceramic matrix.
    Type: Grant
    Filed: October 26, 1995
    Date of Patent: December 2, 1997
    Assignee: Dow Corning Corporation
    Inventors: Robert Charles Camilletti, Loren Andrew Haluska, Keith Winton Michael
  • Patent number: 5693565
    Abstract: A semiconductor integrated circuit (IC) die is made with enhanced resilience to handling, testing, and storage, associated with its qualification and distribution as a KNOWN GOOD DIE (KGD). The IC device has a mechanically tough and chemically inert top layer to protect it from damage. The device contacts are made of thin film metals which facilitate reversible electrical connections used in KGD testing. The overall contact structure protects the device from irreversible damage during the connection, test, and disconnection sequence.
    Type: Grant
    Filed: July 15, 1996
    Date of Patent: December 2, 1997
    Assignee: Dow Corning Corporation
    Inventors: Robert Charles Camilletti, Mark Jon Loboda, Keith Winton Michael