Abstract: A tamper-proof page assembly utilizes a ribbon to string the assembly together by passing the ribbon through holes in the pages of the assembly. The ends of the ribbon are sealed to a cover page thereof with a thermosetting plastic slug. Removal of the slug leaves tell-tale marks on, or destroys the integrity of, the surface of the cover page to which it is adhered. The ribbon material is chosen such that it melts or disintegrates immediately above the chosen curing or setting temperature of the slug. Attempting to tamper with the seal by heating the slug above the curing temperature destroys the ribbon and additionally causes an increase in the mechanical hardness of the slug. Additional tamper detecting apparatuses include sequential numbers on pages, soluble indicia patterns on the pages for use with an ink pen containing an appropriate solvent, laminated pages, and pages having polished surfaces. The page assembly can be clipped into a ring binder when the pages are loosely strung together by the ribbon.

Abstract: A die assembly incorporating a resilient die face and/or backing for sealing and/or patterning or texturing plastic and other like material through the use of RF heating. The die face contains all of the texturing, embossing, printing and the like of the surface of the material or object being simulated. The die face and/or the resilient backing material are imbedded or otherwise provided or formed with conductive and/or resistive material to enhance the dielectric heating operation, as well as to provide heat flow toward the plastic load immediately upon the institution of the RF heating operation.The resilient die faces may be integrated with the cutting edges forming fixed or compound die assemblies for cutting and/or sealing operations which may be performed substantially contemporaneously with the patterning or texturing operations.