Patents by Inventor Robert D. Horning

Robert D. Horning has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5683594
    Abstract: This patent relates to the fabrication of diaphragm-based microstructures used primarily for sensing physical phenomena by detecting a change in deflection, resonance, or curvature of the diaphragm. The methods of fabrication described and claimed herein relate primarily to diaphragm-based diaphragms made of silicon, either single crystal or polycrystalline in form, although other materials may be used.
    Type: Grant
    Filed: March 24, 1994
    Date of Patent: November 4, 1997
    Assignee: Honeywell, Inc.
    Inventors: G. Benjamin Hocker, David W. Burns, Akintunde I. Akinwande, Robert D. Horning, Amir R. Mirza, Thomas G. Stratton, Deidrich J. Saathoff, James K. Carney, Scott A. McPherson
  • Patent number: 5550373
    Abstract: A monolithically constructed infrared, tunable Fabry-Perot cavity filter-detector for spectroscopic detection of particular substances having an absorption line in the wavelength range from 2 to 12 microns. The filter-detector has a hermetically sealed Fabry-Perot cavity that has a mirror which has an adjustable distance relative to another mirror of the cavity. The former mirror is adjusted by piezoelectric film on the mirror support or with piezoelectric stacks or wall supporting the mirror. There may be electrodes situated near the mirrors for capacitive sensing of the distance between the mirrors. Light to be filtered and detected comes in through a window wafer which may have diffractive or refractive microlenses, plus an optional spatial filter. After passing through the window wafer, the light is filtered by the tunable mirrors of the Fabry-Perot cavity. The portion of the light that is passed by the cavity is detected by an infrared microbolometer or a CCD array.
    Type: Grant
    Filed: December 30, 1994
    Date of Patent: August 27, 1996
    Assignee: Honeywell Inc.
    Inventors: Barrett E. Cole, Bernard S. Fritz, Robert D. Horning
  • Patent number: 5318652
    Abstract: Low temperature wafer bonding process enhancement makes a wafer surface hydrophobic, preparing it with a buffered oxide etchant and then exposing it to H.sub.2 O.sub.2 before thermoelectric bonding. Has particular application to diaphragm-based pressure sensor construction.
    Type: Grant
    Filed: December 21, 1992
    Date of Patent: June 7, 1994
    Assignee: Honeywell, Inc.
    Inventors: Robert D. Horning, Thomas G. Stratton, Deidrich J. Saathoff
  • Patent number: 5295395
    Abstract: The formation of diaphragms by silicon wafer bonding provides for a structure having at least two such diaphragms with cavities in the wafers to which the diaphragm layer is bonded. Passageways through the wafers provide for communication of a fluid to the diaphragms. In some locations less than all of a plurality of diaphragms may be bonded to only one wafter having a cavity adjacent the diaphragm.
    Type: Grant
    Filed: February 7, 1991
    Date of Patent: March 22, 1994
    Inventors: G. Benjamin Hocker, David W. Burns, Akintunde I. Akinwande, Robert D. Horning, Amir R. Mirza, Thomas G. Stratton, Deidrich J. Saathoff, James K. Carney, Scott A. McPherson