Abstract: Solder pot apparatus comprising a tank divided into first and second sections by a common wall with holes therein below the level of molten solder in the sections for the transfer of molten metal between the sections. The wall has relatively low heat conductivity. The sections are heated by separately controlled heating elements, the heating elements for the second section having a heating capacity higher than that of the first section, so that solder ingots may be rapidly melted in the second section without substantially affecting the solder temperature in the first section. A ramp extends from the first section to the second section and a powered skimmer stirs metal, and removes dross from metal, in the first section and pushes the dross over the ramp into the second section. Also, the apparatus includes a metal surface level sensor in the second section and signals and an ingot feeder conrolled by the sensor.

Abstract: A method and apparatus for soldering tubular, metal return bends to the ends of tubes in which the article carrying the tubes with the bends secured thereto is first pivoted around a horizontal axis from a horizontal loading and unloading first position to a second position in which the bends and tube ends are immersed in molten solder in a pot and is then pivoted around such axis into a third position in which the bends are above the ends of the tubes, the solder between the ends of the tubes and the bends being permitted to cool and solidify in the third position. Intermediate the first and second positions and intermediate the second and third positions, pivotally mounted burners heat at least the bends to a temperature at least as high as the melting temperature of the solder, the heating between the second and third positions being for the purposes of causing any solder in the bends to flow out of the bends and of minimizing or eliminating icicles of solder on the bends.