Abstract: In order to reduce acoustic noise, an electromagnetic relay (2) includes an insert or bump (20) located between the relay armature (4) and the relay core (8). The insert is flexible and can be mounted on the armature. The insert (20) reduces noise by decelerating the armature (4) at impact with the core (8). The armature (4) can be tilted relative to a surface of the core (8) so that the insert or bump (20) can be positioned away from the primary impact between the core and the armature.

Abstract: An electromagnetic relay (2) includes noise dampening means (20/32/34), such as an elastomeric insert, a noise dampening composition or mataerial, or a resin located at the juncture between the relay armature (4) and the spring (6), which noise dampening means (20/32/34) reduces noise generated by contact between the armature (4) and the spring (6) as the relay (2) is energized and the armature (4) is pulled into the core (8) and when the relay (2) is de-energized and the spring (6) biases the armature (4) away from the core (8).

Abstract: An electromagnetic relay (2) includes noise dampening means (20/32/34), such as an elastomeric insert, a noise dampening composition or mataerial, or a resin located at the juncture between the relay armature (4) and the spring (6), which noise dampening means (20/32/34) reduces noise generated by contact between the armature (4) and the spring (6) as the relay (2) is energized and the armature (4) is pulled into the core (8) and when the relay (2) is de-energized and the spring (6) biases the armature (4) away from the core (8).

Abstract: In order to reduce acoustic noise, an electromagnetic relay (2) includes an insert or bump (20) located between the relay armature (4) and the relay core (8). The insert is flexible and can be mounted on the armature. The insert (20) reduces noise by decelerating the armature (4) at impact with the core (8). The armature (4) can be tilted relative to a surface of the core (8) so that the insert or bump (20) can be positioned away from the primary impact between the core and the armature.

Abstract: An electrical connector comprises a dielectric housing having a slot and an elastomeric connector of uniform width disposed in the slot.

Abstract: A connector (10) including a PC board (12) which is fastened to a block (30) and presses against an elastomeric electrical component (40). Electrical device (20) includes a circuit trace (23) and printed circuit board (12) includes a circuit trace (13) which both engage a flexible film circuit (42) on the elastomeric electrical connector (40). Wedge member (50) engages a bottom edge (40b) of elastomeric electrical component (40) for biasingly engaging the component (40) and urging the component (40) and flexible circuit (42) towards and against circuit traces (13,23). Additionally, good electrical contact and compliance to planar irregularities are maintained between circuit traces (13,23) and flexible film circuit (42) thereby ensuring good electrical contact therebetween.

Abstract: This invention is directed to a socket system for the receipt of an integrated circuit "chip", where such a chip, as known in the art, typically is a planar electronic device having plural leads extending from the periphery thereof. The system, operatively mounted to a planar electronic device, such as a motherboard, comprises a frame having a central recess defined by converging side walls and terminating in a floor, and plural slots about the periphery of the floor for receiving elastomeric connectors for electrically interconnecting the chip leads to the mother board. Overriding the frame, for mechanical engagement therewith, is a force applying member, where such member includes plural ribs extending downwardly from the member and positioned to initially contact the respective converging side walls when the force applying member is caused to mechanically engage the frame.

Abstract: The invention is directed to an electronic docking connector for edge mounting an electronic device, such as a daughter board, to a mother board. The connector comprises a pair of housing members assembled to define an elongated slot planarly aligned with the edge of the mother board. Mounted therein is a pair of opposed force applying, resilient spring members operatively mounted for receiving and applying a compressive force against the electronic device. A flexible film member, containing electrical circuitry thereon, is also mounted within said housing members for electrically interconnecting corresponding circuitry on the mother board, and the electronic device. As an alternative, a dielectric insert is disposed between each spring member and its corresponding flexible film to reduce or eliminate cross talk therein.

Abstract: This disclosure relates to testing apparatus (10), preferably an LGA burn-in test socket, for an integrated chip (28). The apparatus (10), arranged for mounting on a planar electronic device (46), such as a printed circuit board, includes a frame member (12) for mounting to the planar electronic device (46), where the frame member (12) includes a central opening (22) extending between first and second surfaces, and dimensionally sized to receive the chip (28). Recesses (35) are provided for receiving an electronic interface member (18) mounting plural flexible electrical connectors (106), such as an elastomeric connector, as known in the art, for engaging the traces or pads of the chip to the planar device during testing. Further, plural recesses (40) extend from at least the first surface, where each recess includes a compression spring (41). Positioned over and for engagement with the frame member is a floatably mounted force applying member (14) having first and second parallel surfaces.

Abstract: This invention is directed to a mechanical, robotically operated burn-in socket testing apparatus for integrated circuit "chips", where such chips, as known in the art, are typically planar electronic devices. The apparatus, operationally mounted to a planar electronic board, such as a mother board, comprises a first frame member for mounting to the mother board, where the first frame member includes electrical means for engaging chip leads and applying electrical current thereto during the burn-in testing. A second frame member is disposed in sliding engagement with the first frame member, where the second frame member is movable from a first position to a second position.

Abstract: The invention relates to testing apparatus, such as the type known as a burn-in test socket for integrated circuit "chips", where the chips are essentially planar electronic devices having a plurality of chip leads or traces, laterally projecting therefrom, for electrical interconnection to complementary traces on a planar electronic device, such as a mother board, upon which the socket may be mounted, during testing. The socket comprises a frame member for mounting to the planar electronic device, where the frame member includes electrical means for engaging chip leads and applying electrical current thereto during testing. A second element of the socket is a two-piece, adjustable cover member consisting of first and second members floatably mounted together by plural compression springs, where the first and second members are axially movable relative to one another.

Abstract: This invention is directed to a system for precisely aligning a pair of electronic devices, such as an integrated chip test socket electrically interconnected to a motherboard, where such devices are arranged in a parallel relationship. The system includes a method which comprises the steps of fixedly securing plural projections on a planar surface of each of the devices, where each projection includes a flat side or edge and that the flat side of at least two adjacent projections define a first plane or reference line. Arranging the respective planar surfaces in close proximity to one another whereby the projections from one surface contacts the other planar surface. Thereafter, shifting the respective devices relative to one another until the respective first planes or reference lines are aligned into a common plane or line. Finally the devices are fixedly secured together, whereby the electrical interconnections between the devices are precisely aligned.

Abstract: This invention is directed to a chip carrier system for mounting to a first planar electronic device, such as a motherboard or test fixture, where first planar electronic device is provided with a planar, electrical interconnection interface mounted thereto. The chip carrier system includes a frame comprising a peripheral body portion defined by upper and lower planar surfaces, a recess in the lower planar surface to receive the planar, electrical interconnection interface, a central recess terminating in a floor to receive a second planar electronic device, such as an integrated circuit chip, having leads extending therefrom, converging side walls extending from the upper planar surface down to the floor, and plural through slots for receiving the leads. Cooperating therewith is a force applying member adapted to provide a normal force to the second planar electronic device and be mechanically secured to the frame.

Abstract: A docking station (10) slidably receives a device (12) to provide make, break or tap functions, respectively, in a circuit interface. The circuit interface includes a pair of connector housings (17, 18) provided with flexible (or compressible) electrical connectors (19, 20), respectively. A camming member (28, 29; 31, 32; 44) separates the connector housings (17, 18) as the device (12) is slidably inserted into the docking station (10), thereby assuring a substantially zero insertion force on the circuit interface. Preferably, the circuit interface is between the flexible electrical connectors (19, 20), a printed circuit board (13), and a flexible etched circuit (15). The flexible etched circuit (15) is provided with a stiffener (24) resiliently biased by springs (27).

Abstract: This invention is directed to an electrical connector for sequentially connecting plural contacts provided along the respective mating surfaces of a pair of planar electronic devices, where the devices are joined to or mounted within a pair of pivotally arranged housing members. The connector comprises a first housing mounted to one of the planar devices, such as a mother board, where first housing includes an open end and a closed end, and a second housing mounting the other planar electronic device, such as a daughter board, second housing includes an open end and a closed end, and that the respective closed ends include cooperative means for hingely engaging each other. By this arrangement, as the planar electronic devices are pivotally moved about the cooperative means from a nonparallel position to a parallel position of electrical engagement, the respective plural contacts between the planar electronic devices enter into engagement in a sequentially predetermined order.

Abstract: A compressible connector assembly which employs a plurality of discrete compressible connectors (10-1 . . .n) bonded together in an array and arranged within a simplified frame housing (12). The bonded structure securely adheres discrete compressible connectors (10-1 . . .n) together using intermediate spacers (14-1 . . .n) which minimize the risk of shorts. In addition, the connector assembly eliminates the expensive conventional molded framework (FIG. 1 ) which is required in existing compressible connector assemblies, and it facilitates close-pitch connections having tighter centerlines than possible in the prior art.

Abstract: An interface for connecting co-planar printed circuit ("PC") boards (10,20) using a compressible circuit (50) for bridging the PC boards (10,20), a base (80) underlying the second PC board and integrally attached thereto, and a support housing (30) which sandwiches the compressible circuit (50) against the two PC boards (10,20). The compressible circuit (50) is insertable into the underside of the support housing (30) and may be electro-optically aligned therewith. The compressible circuit (50) is then staked to the support housing (30), and the support housing is mounted on the two PC boards (10,20). In order to mount the support housing (30) on the PC boards (10,20) with the requisite precision, the support housing (30) is provided with alignment means including resilient finger (39) on the underside, and the second PC board (20) is provided with cooperating guide tabs (25).

Abstract: A flexible electrical connector (16) provides a circuit interface between the bent leads (12) of an integrated circuit package (10) and the respective circuit pads (14) of a printed circuit board (15). The integrated circuit package (10) is mounted on the surface of the printed circuit board (15), and the circuit interface has a substantially zero insertion force therebetween. The flexible electrical connector (16) has closely-spaced circuit traces (17) carried by an elastomeric core (18). The traces (17) accommodate the fine pitch of the leads (12) on the integrated circuit package (10); and the elastomeric core (18) provides a resilient "cushion" which compensates for irregularities or tolerance accumulations in the bent leads (12) as well as the different lead-bending specifications of the respective integrated circuit manufacturers.

Abstract: The invention is directed to an electronic assembly, such as a backplane assembly of the type including a mother board, a connector housing mounted on the mother board, and a daughter board slidably insertable into the connector housing for electrical interconnection to the mother board. The assembly comprises an elongated connector housing having a pair of parallelly disposed spaced apart housing members defining at least one slot therebetween for receiving the daughter board. A force generating member is disposed within the slot, where the force generating members comprises a pair of resilient, essentially L-shaped members. One leg of each of the L-shaped members is fixedly disposed between the mother board and the housing members, while the others of the legs upstand within the slot in a spaced apart relationship to receive the daughter board therebetween, the upstanding legs including at least one pair of opposing elastomeric members to apply a compressive pressure to said daughter board.

Abstract: A combination heat sink (18, 41, 43) and circuit interface comprises a metallic wafer (15) disposed between an integrated circuit (11) and a printed circuit board (14) in a land grid array package (10). A frame (13) for the integrated circuit (11) is nested within the heat sink (18, 41, 43) and a latch (30) is pivotably mounted on the frame (13) for retaining the overall package (10). The circuit interface comprises a plurality of flexible electrical connectors (19) mounted on the wafer (15).