Abstract: Docking stations that may facilitate the sharing or transfer of power among a portable computing device, a docking station, and an accessory. One example may provide power from an accessory to a portable computing device. Switches may be used to avoid harm from inadvertent contact with voltages on exposed terminals. Another example may provide power directly from a battery on a portable computing device to an accessory. Another may limit this direct connection to a first type of accessory. Examples may limit a power connection to another type of accessory through a regulator. Another example may power one or more internal circuits either through a portable computing device or an accessory, depending on a mode of operation of the portable computing device.

Abstract: At an electronic accessory of a master electronic device, a connection attribute can be detected that is indicative of a presence or a characteristic of a connection between the electronic accessory and at least one other electronic accessory of the master electronic device. A connection-indicative signal can be generated at the electronic device that includes the connection attribute. The connection-indicative signal can be transmitted to the master electronic device.

Abstract: A connection-indicative signal can be received at a master electronic device from an electronic accessory. The connection-indicative signal can include a connection attribute indicative of a presence or characteristic of a connection between the electronic accessory and at least one other electronic accessory of the master electronic device. A location of the master electronic device can be determined at the master electronic device. The location can be stored at the master electronic device in association with the connection attribute. The master electronic device can detect a locate-accessory input that corresponds to a request to locate the at least one other electronic accessory; or that a locate-accessory condition is satisfied based on another connection attribute included in another connection-indicative signal received from the electronic accessory. The stored location can be retrieved in response to the detecting.

Abstract: Pigs infected with PEDv often die due to dehydration caused by diarrhea. Those that survive do not reach market weight as scheduled resulting in costs to the producer. The invention includes providing electrolyzed water either as treatment for infected animals or as a prophylactic against symptom severity in uninfected animals. The electrolyzed water is used as a substitute for or as a solution with regular drinking water. Duration of symptoms for infected pigs is markedly lessened; severity of symptoms is also reduced providing a much higher survival rate. Time to market is less negatively affected for surviving pigs than those untreated, and weight at scheduled time for sale is also less effected translating into positive financial results over those expected for untreated herds.

Abstract: Docking stations that may interface with various types of accessories. One example may physically and electrically support a connection to a portable computing device in either one or two orientations. One or more receptacles or dedicated or tethered cables may provide connections to one or more accessories. Examples may be able to authenticate and identify themselves to portable computing devices such that the devices know how to configure data outputs provided to the docking stations. An audio channel that converts digital audio signals and provides an analog audio signal at an audio jack may be included. Multiplexing circuitry that allows reversible connectors to be used may also be included.

Abstract: Respiratory symptoms resulting from disease states such as PRRS and Streptococcus infections can be alleviated by administration of electrolyzed water via fog or mist delivery in an animal confinement. The delivery may be in doses spaced evenly throughout the day and may include delivery of between about 1 and about 6 gallons per dose. In one embodiment, the dose is delivered via a distribution system of nozzles over a time period of about 1 minute. In others, the delivery may require 5, 10 or 20 minutes and may include components in addition to the electrolyzed water. It is understood that the mist is inhaled, and is also distributed onto the surfaces in the confinement and on the animals themselves.

Abstract: Docking stations that may facilitate the sharing or transfer of power among a portable computing device, a docking station, and an accessory. One example may provide power from an accessory to a portable computing device. Switches may be used to avoid harm from inadvertent contact with voltages on exposed terminals. Another example may provide power directly from a battery on a portable computing device to an accessory. Another may limit this direct connection to a first type of accessory. Examples may limit a power connection to another type of accessory through a regulator. Another example may power one or more internal circuits either through a portable computing device or an accessory, depending on a mode of operation of the portable computing device.

Abstract: Docking stations that may interface with various types of accessories. One example may physically and electrically support a connection to a portable computing device in either one or two orientations. One or more receptacles or dedicated or tethered cables may provide connections to one or more accessories. Examples may be able to authenticate and identify themselves to portable computing devices such that the devices know how to configure data outputs provided to the docking stations. An audio channel that converts digital audio signals and provides an analog audio signal at an audio jack may be included. Multiplexing circuitry that allows reversible connectors to be used may also be included.

Abstract: Pigs infected with PEDv often die due to dehydration caused by diarrhea. Those that survive do not reach market weight as scheduled resulting in costs to the producer. The invention includes providing electrolyzed water either as treatment for infected animals or as a prophylactic against symptom severity in uninfected animals. The electrolyzed water is used as a substitute for or as a solution with regular drinking water. Duration of symptoms for infected pigs is markedly lessened; severity of symptoms is also reduced providing a much higher survival rate. Time to market is less negatively affected for surviving pigs than those untreated, and weight at scheduled time for sale is also less effected translating into positive financial results over those expected for untreated herds.

Abstract: A method is disclosed for displaying utility consumption of a property portfolio for zones of a display area. First values correspond to utility consumption and second values corresponding to consumption intensity are first determined. The first values for each zone are ranked from high to low values and associated with a size of a geometric form corresponding to each of the zones. Similarly, the second values for each zone are ranked from high to low values and associated with a corresponding color, with a highest of the second values having a first color representing a highest consumption intensity, the smallest of the second values having a second color representing the lowest consumption intensity, and the remaining of the second values are associated with mixtures of the first color and second color. The respective geometric forms for each of the zones are displayed on the map at respective spatial locations.

Abstract: A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

Abstract: A microelectronic package with an integral window mounted in a recessed lip for housing a microelectronic device. The device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can be formed of a low temperature co-fired ceramic (LTCC) or high temperature cofired ceramic (HTCC) multilayered material, with the integral window being simultaneously joined (e.g. co-fired) to the package body during LTCC or HTCC processing. The microelectronic device can be flip-chip bonded and oriented so that a light-sensitive side is optically accessible through the window. The result is a compact, low profile package, having an integral window mounted in a recessed lip, that can be hermetically sealed.

Abstract: A package with an integral window for housing a microelectronic device. The integral window is bonded directly to the package without having a separate layer of adhesive material disposed in-between the window and the package. The device can be a semiconductor chip, CCD chip, CMOS chip, VCSEL chip, laser diode, MEMS device, or IMEMS device. The multilayered package can be formed of a LTCC or HTCC cofired ceramic material, with the integral window being simultaneously joined to the package during LTCC or HTCC processing. The microelectronic device can be flip-chip bonded so that the light-sensitive side is optically accessible through the window. The package has at least two levels of circuits for making electrical interconnections to a pair of microelectronic devices. The result is a compact, low-profile package having an integral window that is hermetically sealed to the package prior to mounting and interconnecting the microelectronic device(s).

Abstract: Disclosed is a highly accurate articulated coordinate measuring machine, comprising a revolute joint, comprising a circular encoder wheel, having an axis of rotation; a plurality of marks disposed around at least a portion of the circumference of the encoder wheel; bearing means for supporting the encoder wheel, while permitting free rotation of the encoder wheel about the wheel's axis of rotation; and a sensor, rigidly attached to the bearing means, for detecting the motion of at least some of the marks as the encoder wheel rotates; a probe arm, having a proximal end rigidly attached to the encoder wheel, and having a distal end with a probe tip attached thereto; and coordinate processing means, operatively connected to the sensor, for converting the output of the sensor into a set of cylindrical coordinates representing the position of the probe tip relative to a reference cylindrical coordinate system.

Abstract: A package with an integral window for housing a microelectronic device. The integral window is bonded directly to the package without having a separate layer of adhesive material disposed in-between the window and the package. The device can be a semiconductor chip, CCD chip, CMOS chip, VCSEL chip, laser diode, MEMS device, or IMEMS device. The package can be formed of a multilayered LTCC or HTCC cofired ceramic material, with the integral window being simultaneously joined to the package during cofiring. The microelectronic device can be flip-chip interconnected so that the light-sensitive side is optically accessible through the window. A glob-top encapsulant or protective cover can be used to protect the microelectronic device and electrical interconnections. The result is a compact, low profile package having an integral window that is hermetically sealed to the package prior to mounting and interconnecting the microelectronic device.

Abstract: A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

Abstract: An apparatus for packaging of microelectronic devices is disclosed, wherein the package includes an integral window. The microelectronic device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can comprise, for example, a cofired ceramic frame or body. The package has an internal stepped structure made of a plurality of plates, with apertures, which are patterned with metallized conductive circuit traces. The microelectronic device can be flip-chip bonded on the plate to these traces, and oriented so that the light-sensitive side is optically accessible through the window. A cover lid can be attached to the opposite side of the package. The result is a compact, low-profile package, having an integral window that can be hermetically-sealed. The package body can be formed by low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the window being simultaneously joined (e.g.

Abstract: A method of fabricating a microelectronic device package with an integral window for providing optical access through an aperture in the package. The package is made of a multilayered insulating material, e.g., a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC). The window is inserted in-between personalized layers of ceramic green tape during stackup and registration. Then, during baking and firing, the integral window is simultaneously bonded to the sintered ceramic layers of the densified package. Next, the microelectronic device is flip-chip bonded to cofired thick-film metallized traces on the package, where the light-sensitive side is optically accessible through the window. Finally, a cover lid is attached to the opposite side of the package. The result is a compact, low-profile package, flip-chip bonded, hermetically-sealed package having an integral window.

Abstract: Disclosed is a system and method for independently evaluating the spatial positional performance of a machine having a movable member, comprising an articulated coordinate measuring machine comprising: a first revolute joint; a probe arm, having a proximal end rigidly attached to the first joint, and having a distal end with a probe tip attached thereto, wherein the probe tip is pivotally mounted to the movable machine member; a second revolute joint; a first support arm serially connecting the first joint to the second joint; and coordinate processing means, operatively connected to the first and second revolute joints, for calculating the spatial coordinates of the probe tip; means for kinematically constraining the articulated coordinate measuring machine to a working surface; and comparator means, in operative association with the coordinate processing means and with the movable machine, for comparing the true position of the movable machine member, as measured by the true position of the probe tip, with

Abstract: A method of making an electrical interconnection from a microelectronic device to a package, comprising ball or wedge compression bonding a gold-based conductor directly to a silicon surface, such as a polysilicon bonding pad in a MEMS or IMEMS device, without using layers of aluminum or titanium disposed in-between the conductor and the silicon surface. After compression bonding, optional heating of the bond above 363 C. allows formation of a liquid gold-silicon eutectic phase containing approximately 3% (by weight) silicon, which significantly improves the bond strength by reforming and enhancing the initial compression bond. The same process can be used for improving the bond strength of Au—Ge bonds by forming a liquid Au-12Ge eutectic phase.