Abstract: This disclosure provides recombinant DNA constructs and transgenic plants having enhanced traits such as increased yield, increased nitrogen use efficiency, and enhanced drought tolerance or water use efficiency. Transgenic plants may include field crops as well as plant propagules and progeny of such transgenic plants. Methods of making and using such transgenic plants are also provided. This disclosure also provides methods of producing seed from such transgenic plants, growing such seed, and selecting progeny plants with enhanced traits. Also disclosed are transgenic plants with altered phenotypes which are useful for screening and selecting transgenic events for the desired enhanced trait.

Abstract: A semiconductor package comprising a non-conductive film which defines opposed top and bottom film surfaces and includes a plurality of vias disposed therein. Disposed on the top film surface is a plurality of upper leads which circumvent respective ones of the vias. Similarly, disposed on the bottom film surface is a plurality of lower leads which circumvent respective ones of the vias and are electrically connected to respective ones of the upper leads. At least one transmission line element is also disposed on the top film surface and electrically connected to at least one of the upper leads. Attached to the top film surface and electrically connected to at least one of the upper leads and the transmission line element is at least one semiconductor die. A package body at least partially covers the semiconductor die, the upper leads, the transmission line element, and the top film surface.

Abstract: A laser module includes an alignment plate having a template plate having a laser diode aperture and a photodiode aperture. A weld plate and a reflector are coupled to the template plate. The structure further includes a heat sink coupled to the alignment plate. A photodiode subassembly is mounted within the photodiode aperture and to the heat sink. Further, a laser diode subassembly is mounted within the laser diode aperture and to the heat sink. In the above manner, the photodiode subassembly, laser diode subassembly and reflected are precisely aligned.