Abstract: A thermally efficient, cost efficient and compact LED device having an LED module and a circuit board. The LED module having an LED substrate and an LED chip mounted on a mounting surface of the LED substrate. The circuit board is composed of a circuit board substrate and has a plurality of conductive tracks on a surface of the circuit board substrate. The LED substrate is embedded in the circuit board substrate.

Abstract: A lighting arrangement includes at least a first and a second LED lighting element arranged next to each other on a carrier surface. The spacer element has, at least in a portion thereof which is in contact with the second LED lighting element, a width which is less than 20% of a width of the first LED lighting element. The first LED lighting element comprises a spacer element projecting into a direction in parallel to the carrier surface. The second LED lighting element is arranged in contact with the spacer element such that it is arranged aligned relative to the first LED lighting element, and such that the first and second LED lighting elements are arranged at a distance forming a gap between the first and second LED lighting elements.

Abstract: A lighting arrangement includes at least a first and a second LED lighting element arranged next to each other on a carrier surface. The spacer element has, at least in a portion thereof which is in contact with the second LED lighting element, a width which is less than 20% of a width of the first LED lighting element. The first LED lighting element comprises a spacer element projecting into a direction in parallel to the carrier surface. The second LED lighting element is arranged in contact with the spacer element such that it is arranged aligned relative to the first LED lighting element, and such that the first and second LED lighting elements are arranged at a distance forming a gap between the first and second LED lighting elements.

Abstract: A lighting arrangement 10 is described with an LED element 30. A reference frame part 14 comprises a frame opening 26 bordered by frame edges 28a, 28b, 28c, 28d. The LED element 30 is arranged such that light is emitted through the frame opening 26 and is partially shielded at least at a first frame edge 28b. The reference frame part further comprises reference portions 20a, 20b, 20c, 20d to define positions relative to the frame 5 opening. A first reference portion 20a, 20b is provided on a first surface portion of the reference frame part 14 arranged parallel to a light emitting surface 38 of the LED element 30. A second reference portion 20c is arranged on a second surface portion of the reference frame part 14 arranged perpendicular to the first surface portion. A third reference portion 20d is arranged on a third surface portion of the reference frame part 14 arranged 10 perpendicular to both the first and second surface portions.

Abstract: A vehicle lighting arrangement with an LED element emits light through the frame opening and is partially shielded at least at a first frame edge. A reference frame part includes a frame opening bordered by frame edges, and reference portions to define positions relative to the frame opening. A first reference portion is provided on a first surface portion and is arranged parallel to a light emitting surface of the LED. A second reference portion is arranged on a second surface portion and is arranged perpendicular to the first surface portion. A third reference portion is arranged on a third surface portion and is arranged perpendicular to both the first and second surface portions. An optical element for shaping an illumination beam from the LED through the frame opening is in contact with the reference frame part to define a position of the optical element relative to the frame opening.

Abstract: An LED device comprises an LED module and a circuit board. The LED module comprises an LED substrate and an LED chip mounted on a mounting surface of the LED substrate. The circuit board comprises a circuit board substrate and a plurality of conductive tracks on a first surface of the circuit board substrate. The LED substrate is embedded in the circuit board substrate. This arrangement provides a thermally efficient, cost efficient and compact LED device.