Abstract: An epoxy resin reactive diluent composition comprises an epoxy resin diluent (A) and a resin compound (B), wherein the epoxy resin diluent (A) comprises a cis, trans-1,3- and -1,4-cyclohexanedimethylether moiety; and wherein the resin compound (B) comprises one or more epoxy resins other than the epoxy resin diluent (A). A curable epoxy resin composition comprises the epoxy resin reactive diluent composition and a curing agent and/or curing catalyst therefore. A cured epoxy resin is prepared by curing the curable epoxy resin composition.

Abstract: A thermosetting monomer comprising at least two of an aryl-cyanato group and at least two of a phosphorus group.

Abstract: A curable resin composition including (I) at least one thermoset resin composition; and (II) at least one hardener; wherein the powder coating has a balance of properties including a combination of high glass transition temperature and low water absorption.

Abstract: An epoxy resin composition prepared from a dihydroxydiphenyl-cycloalkane compound to form a diglycidyl ether of dihydroxydiphenyl cycloalkane compound which may be useful for making various products including, for example, powder coatings, composites and electrical laminates.

Abstract: An epoxy resin comprising at least one epoxy amide such as at least one of a glycidyl ether amide and a glycidyl ester amide derived from at least one seed oil based alkanolamide; wherein the seed oil based alkanolamide is derived from the reaction of (i) at least one of a fatty acid ester, a fatty acid and a fatty acid triglyceride; and (ii) at least one alkanolamine; and a process for preparing such epoxy resin. An epoxy resin composition can be prepared comprising the epoxy amide above and one or more epoxy resins other than the epoxy amide. A curable epoxy resin composition can also be made from the above epoxy resin composition which contains at least one curing agent and/or at least one curing catalyst.

Abstract: Thermoset polyurethanes comprising a cis, trans-1,3- and -1,4-cyclohexanedimethylether moiety. Adducts of epoxy resins comprising a cis, trans-1,3- and -1,4-cyclohexanedimethylether moiety are used to react with a polyisocyanate to produce the thermoset polyurethanes.

Abstract: A compound comprising a class of sulfonated triorganophosphine compounds of formula R1R2P—R3[—O—(CH2)n—(SO3M)]m, wherein the R1 and R2 are selected individually from alkyl, aralkyl, and alicyclic groups, wherein R3 represents a divalent or polyvalent alkylene or alicyclic radical that is bonded to the phosphorus atom and to one or more sulfonate substituents via an alkylether link, and further wherein R3 does not contain any aryl moieties; n is an integer reflecting a number of methylene groups in the alkylether link; M represents a monovalent cation; and m is an integer representing a total number of sulfonated alkylether substituents. The compound is useful as a ligand in transition metal-ligand complex catalysts that are capable of catalyzing the hydroformylation of an olefinically-unsaturated compound with carbon monoxide and hydrogen to form one or more corresponding aldehyde products.

Abstract: An adduct and a process for preparing such adduct, wherein the adduct includes at least one reaction product of an epoxy resin material (A) and a compound (B); wherein the epoxy resin material (A) comprises a glycidyl ether or glycidyl ester of an alkanolamide; and compound (B) comprises a compound having two or more reactive hydrogen atoms per molecule, and the reactive hydrogen atoms are reactive with epoxide groups. A curable epoxy resin composition can be prepared from (i) the adduct described above, and (ii) one or more epoxy resins other than the epoxy resin material (A). A cured epoxy resin may be prepared from such curable composition including an article such as a coating, an electrical or structural laminate, an electrical or structural composite, a filament winding, a molding, a casting, and an encapsulation.

Abstract: An epoxy resin reactive diluent composition comprises an epoxy resin diluent (A) and a resin compound (B), wherein the epoxy resin diluent (A) comprises a cis, trans-1,3- and -1,4-cyclohexanedimethylether moiety; and wherein the resin compound (B) comprises one or more epoxy resins other than the epoxy resin diluent (A). A curable epoxy resin composition comprises the epoxy resin reactive diluent composition and a curing agent and/or curing catalyst therefore. A cured epoxy resin is prepared by curing the curable epoxy resin composition.

Abstract: An adduct comprises at least one reaction product of (i) an epoxy resin material (A) and (ii) a reactive compound (B). The epoxy resin material (A) comprises a cis, trans-1,3- and -1,4-cyclohexanedimethylether moiety and the reactive compound (B) comprises a compound having two or more reactive hydrogen atoms per molecule, wherein the reactive hydrogen atoms are reactive with epoxide groups. A curable epoxy resin composition comprises the adduct described above. A cured epoxy resin is prepared by a process of curing the curable epoxy resin composition.

Abstract: An epoxy resin comprising at least one epoxy amide such as at least one of a glycidyl ether amide and a glycidyl ester amide derived from at least one non-seed oil based alkanolamide; and a process for preparing such epoxy resin. An epoxy resin composition can be prepared comprising the epoxy amide above and one or more epoxy resins other than the epoxy amide. A curable epoxy resin composition can also be made from the above epoxy resin composition which contains at least one curing agent and/or at least one curing catalyst.

Abstract: Epoxy resins comprising a cis, trans-1,3- and -1,4-cyclohexanedimethylether moiety and processes for preparing the epoxy resins. The process of preparation of the epoxy resins comprises reacting (a) a mixture of a cis-1,3-cyclohexanedimethanol, a trans-1,3-cyclohexanedimethanol, a cis-1,4-cyclohexanedimethanol, and a trans-1,4-cyclohexanedimethanol, (b) an epihalohydrin, (c) a basic acting substance, (d) optionally, a solvent, (e) optionally, a catalyst, and/or (f) optionally, a dehydrating agent. The process may be a slurry epoxidation process, an anhydrous epoxidation process, or a Lewis acid catalyzed coupling and epoxidation process.

Abstract: Aromatic dicyanate compounds which comprise aliphatic moieties having at least about six carbon atoms and resins and thermoset products based on these compounds.

Abstract: Polymerizable monomers comprising at least one 1- or 2-propylene moiety and further comprising both aromatic moieties and additional aliphatic moieties and polymerizable mixtures, resins and thermoset products based on these monomers.

Abstract: Aromatic polycyanate compounds which comprise cycloaliphatic moieties, a process for the production thereof and resins and thermoset products which are based on these compounds.

Abstract: This invention is a monomer comprising at least two dienophile groups and at least two ring structures which ring structures are characterized by the presence of two conjugated carbon-to-carbon double bonds and the presence of a leaving group L, wherein L is characterized that when the ring structure reacts with a dienophile in the presence of heat or other energy sources, L is removed to form an aromatic ring structure. This invention is also curable oligomers and polymers and highly cross-linked polymers made with such monomers. Moreover, this invention is a method of making porous films by combining such monomers or their oligomers with a porogen, curing the polymer and removing the porogen.

Abstract: A compound (monomer) comprising i) one or more arylethynyl groups (A-functional groups), ii) one or more ring structures comprising two conjugated carbon-to-carbon double bonds and a leaving group L (B-functional groups), and iii) one or more ethynyl groups (C?-functional groups), characterized in that said A- and C?-functional groups are capable of reaction under cycloaddition reaction conditions with said B-functional groups to thereby form a cross-linked, polyphenylene polymer.

Abstract: A compound (monomer) comprising i) one or more dienophile groups (A-functional groups), ii) one or more ring structures comprising two conjugated carbon-to-carbon double bonds and a leaving group L (B-functional groups), and iii) one or more chemically bound mesogenic poragen forming moieties, characterized in that the A-functional group is capable of reaction under cycloaddition reaction conditions with the B-functional group to thereby form a cross-linked, polyphenylene polymer.

Abstract: A compound (monomer) comprising i) one or more arylethynyl groups (A-functional groups), ii) one or more ring structures comprising two conjugated carbon-to-carbon double bonds and a leaving group L (B-functional groups), and iii) one or more ethynyl groups (C?-functional groups), characterized in that said A- and C?-functional groups are capable of reaction under cycloaddition reaction conditions with said B-functional groups to thereby form a cross-linked, polyphenylene polymer.

Abstract: A monomer suitable for use in forming low dielectric constant films in semiconductor devices comprising i) two dienophile groups (A-functional groups) attached to a single aromatic ring and ii) a second ring structure comprising two conjugated carbon-to-carbon double bonds and a leaving group L (B-functional group), characterized in that said single aromatic ring is directly covalently attached to one of the double bonded carbons of the B functional group or to a fused aromatic ring containing two such double bonded carbons of the B-functional group, and one A-functional group of one monomer is capable of reaction under cycloaddition reaction conditions with the B-functional group of a second monomer to thereby form a polymer.