Abstract: An apparatus for applying material by cathodic arc vapor deposition to a substrate is provided which includes a vessel, a disk-shaped cathode, a platter for supporting the substrate, apparatus for maintaining a vacuum in the vessel, and apparatus for selectively sustaining an arc of electrical energy between the cathode and an anode. The disk-shaped cathode has a first end surface, a second end surface, and an evaporative surface extending between the first and second end surfaces, and the cathode is mounted on a pedestal positioned inside the vessel. The platter has a slot for receiving the pedestal, thereby enabling the platter to be movable into and out of the vessel.

Abstract: According to the present invention, an apparatus for applying material by cathodic arc vapor deposition to a substrate is provided which includes a vessel, apparatus for maintaining a vacuum in the vessel, an annular cathode having a bore and an evaporative surface extending between first and second end surfaces, apparatus for selectively sustaining an arc of electrical energy between the cathode and an anode, and apparatus for steering the arc around the evaporative surface. The apparatus for steering the arc is positioned within the cathode bore, and produces a magnetic field that runs substantially parallel to the evaporative surface. The annular cathode is disposed radially inside of, and aligned with, the substrates inside the vessel.

Abstract: An apparatus for applying material by cathodic arc deposition to a substrate is provided which includes a vessel, means for maintaining a vacuum in the vessel, a cathode, a contactor, means for selectively sustaining an arc of electrical energy between the cathode and an anode, and an actuator. The cathode and contactor are positioned inside the vessel, and the contactor is electrically connected to the means for selectively sustaining an arc of electrical energy. The actuator selectively actuates the contactor into electrical contact with the cathode, and thereby electrically connects the cathode to the means for sustaining an arc of electrical energy.

Abstract: Sputtering techniques are utilized to form an aluminum rich diffusion coating on the surface of a superalloy substrate. The coating contains additions of oxygen active elements, such as yttrium, and the coating has an outward diffusion aluminide microstructure obtained by carrying the sputtering process out at temperatures in the range of about 1,010.degree.-1,150.degree. C.