Abstract: Technologies for object social network analysis and modification to improve achievement of an identified goal include analyzing, by a processing device, a structure of data in a database complex and determining a context of the data. Additionally, the method includes identifying, by the processing device and based on the analysis, relationships between objects represented in the data that enable or restrict achievement of a goal. The relationships between the objects establish an object social network. The method also includes modifying, based on an analysis of subsequent data produced from the execution of a process to achieve the goal, the object social network to increase the achievement of the goal.

Abstract: Technologies for data capture and data analysis include a system having a knowledge repository in which all input data is stored as objects and relationships between objects, and each object represents at least one container of one or more properties. The knowledge repository is capable of storing the input data according to more than one storage format. The system may also include a user interface providing an input mechanism to obtain the input data, object information that defines one or more of the properties, and relationship information that defines one or more of the relationships. The system includes a controller configured to receive the input data, the object information, and the relationship information from the user interface and to cause the input data to be stored in the knowledge repository as at least one object based on the object information and the relationship information.

Abstract: An improved copper bump tape for tape automated bonding inhibits electromigration of the copper after bonding to a semiconductor device. The improved tape is characterized by the plating of a migration resistant metal onto the inner ends of connector beams of the tape. The migration resistant metal is coated onto all surfaces of the connector bump, except for the surface which is to be bonded to the semiconductor device. In this way, the surfaces of the bump which remain exposed after connection to the semiconductor are inhibited from electromigration.

Abstract: An improved copper bump tape for tape automated bonding inhibits electromigration of the copper after bonding to a semiconductor device. The improved tape is characterized by the plating of a migration resistant metal onto the inner ends of connector beams of the tape. The migration resistant metal is coated onto all surfaces of the connector bump, except for the surface which is to be bonded to the semiconductor device. In this way, the surfaces of the bump which remain exposed after connection to the semiconductor are inhibited from electromigration.