Abstract: A "leads over chip" lead frame design is disclosed which can be used with a conventional die having leads located at the periphery. The inventive design uses an elongated tie bar which extends from one side of the lead frame to the other, across the die. The die is attached to the bottom of the tie bar, then the bond pads are wire bonded to the lead fingers. The lead fingers of the inventive lead frame do not extend over the top of the die, but are positioned in close proximity to allow for short bond wires. The die and a portion of the lead fingers are encapsulated, and the tie bars are severed to separate them from the lead frame. The invention allows the advantages of a leads over die configuration with a conventional die having bond pads located at the periphery. Therefor, a single die can be manufactured which can be used either with the inventive lead frame for a plastic package, or with a ceramic package.